Multi-scale guidance diffusion network for wafer map defect recognition DOI
Zuxiang Long, Jinda Yan, Minghao Piao

et al.

Expert Systems with Applications, Journal Year: 2024, Volume and Issue: unknown, P. 126134 - 126134

Published: Dec. 1, 2024

Language: Английский

SCSNet: a novel transformer-CNN fusion architecture for enhanced segmentation and classification on high-resolution semiconductor micro-scale defects DOI

Yuening Luo,

Zhouzhouzhou Mei, Yibo Qiao

et al.

Applied Intelligence, Journal Year: 2025, Volume and Issue: 55(6)

Published: Feb. 12, 2025

Language: Английский

Citations

0
Global feature identification layer for mixed-type wafer bin map classification DOI
Jaehyeon Joo, Chang Ouk Kim

Expert Systems with Applications, Journal Year: 2025, Volume and Issue: unknown, P. 126709 - 126709

Published: Jan. 1, 2025

Language: Английский

Citations

0
MLR-WM-ViT: Global high-performance classification of mixed-type wafer map defect using a multi-level relay Vision Transformer DOI
Xiangyan Zhang,

Xuexiu Liang,

Ying Zhang

et al.

Expert Systems with Applications, Journal Year: 2025, Volume and Issue: unknown, P. 127121 - 127121

Published: March 1, 2025

Language: Английский

Citations

0
Special Issue (SI) Editorial Note Sustainable semiconductor supply chain under industrial disruption: Risk and resilience concerns DOI
Ming‐Lang Tseng, Chen‐Fu Chien, Ming K. Lim

et al.

International Journal of Production Economics, Journal Year: 2025, Volume and Issue: unknown, P. 109656 - 109656

Published: April 1, 2025

Language: Английский

Citations

0
A generative-adversarial-network-based temporal raw trace data augmentation framework for fault detection in semiconductor manufacturing DOI
Shu‐Kai S. Fan, Wei‐Yu Chen

Engineering Applications of Artificial Intelligence, Journal Year: 2024, Volume and Issue: 139, P. 109624 - 109624

Published: Nov. 14, 2024

Language: Английский

Citations

2
Improved wafer map defect pattern classification using automatic data augmentation based lightweight encoder network in contrastive learning DOI
Yi Sheng, Jinda Yan, Minghao Piao

et al.

Journal of Intelligent Manufacturing, Journal Year: 2024, Volume and Issue: unknown

Published: July 1, 2024

Language: Английский

Citations

1
Enhanced detection of unknown defect patterns on wafer bin maps based on an open-set recognition approach DOI

Jin-Su Shin,

Min-Joo Kim,

B. Kim

et al.

Computers in Industry, Journal Year: 2024, Volume and Issue: 164, P. 104208 - 104208

Published: Nov. 14, 2024

Language: Английский

Citations

1
Multi-scale guidance diffusion network for wafer map defect recognition DOI
Zuxiang Long, Jinda Yan, Minghao Piao

et al.

Expert Systems with Applications, Journal Year: 2024, Volume and Issue: unknown, P. 126134 - 126134

Published: Dec. 1, 2024

Language: Английский

Citations

0