Molecular Brush‐Grafted Liquid Crystalline Hetero‐Structured Fillers for Boosting Thermal Conductivity of Polyimide Composite Films DOI
Kunpeng Ruan,

Mukun Li,

Yang Pang

и другие.

Advanced Functional Materials, Год журнала: 2025, Номер unknown

Опубликована: Апрель 24, 2025

Abstract Hetero‐structured thermally conductive fillers, benefiting from the low interfacial thermal resistance and fillers’ synergistic effect, have been proven to be ideal choice for improving conductivities of polymer composites. However, hetero‐structured fillers are usually disorderly distributed in matrix, hindering further improvement efficiency constructing conduction pathways This work proposes a new strategy graft polymethyl methacrylate molecular brushes on surfaces fluorinated graphene@carbon nanotube (FG@CNT) by atom transfer radical polymerization. FG@CNT is orderly arranged presents liquid crystalline state (LC‐(FG@CNT), which then introduced into polyimide (LC‐PI) matrix with high intrinsic conductivity fabricate LC‐(FG@CNT)/LC‐PI composite films. The in‐plane through‐plane ( λ ∥ , ⊥ ) 15 wt.% films reach 5.66 0.76 W·m −1 ·K respectively, 168.2% 137.5% higher than those LC‐PI = 2.11 0.32 ), also significantly FG@CNT/LC‐PI 4.72 0.74 ). Demonstrated heat dissipation testing finite element simulation, show excellent management capabilities great application potential generation flexible electronic devices.

Язык: Английский

Ultrahigh Energy Charge–Discharge Efficiency in Olefinic Elastomer with POSS Cage‐Linking Construction DOI Open Access

Fuxing Zhai,

Jun Han, Jackie Y. Ying

и другие.

Advanced Materials Technologies, Год журнала: 2025, Номер unknown

Опубликована: Март 22, 2025

Abstract Polymer dielectrics with intrinsic breakdown strength and fast release cycle are promising candidates in energy conversion embedded power systems. However, the charge–discharge efficiency dielectric reliability of polymer film should be further enhanced urgently based on depression loss. In this study, sulfhydryl group modified polyhedral oligosiloxanes (SH‐POSS) nanoparticle, sulfhydryl‐functionalized POSS serves as crosslinking site through reacting unsaturated double bond poly(styrene‐butadiene‐styrene) (SBS) block copolymer. The constant ( ɛ ′) composite retains stable tendency over wide testing frequency, e.g. ′ = 1.79 at 10 6 Hz 1.73 15 GHz for 5 wt.% composite. With presence cage particles sites, viscoelastic hindrance becomes weak, resulting descending dissipative force between inter‐chains, which contributes to hysteresis loss under field on‐off cycle. reaches 97.5% 450 MV m −1 , current exhibits outstanding stability cycles 100 °C . These results indicate that proposed method effectively balances low high insulation demonstrates broad prospects storage/conversion microelectronic packaging stretchable electronics.

Язык: Английский

Процитировано

0
Molecular Brush‐Grafted Liquid Crystalline Hetero‐Structured Fillers for Boosting Thermal Conductivity of Polyimide Composite Films DOI
Kunpeng Ruan,

Mukun Li,

Yang Pang

и другие.

Advanced Functional Materials, Год журнала: 2025, Номер unknown

Опубликована: Апрель 24, 2025

Abstract Hetero‐structured thermally conductive fillers, benefiting from the low interfacial thermal resistance and fillers’ synergistic effect, have been proven to be ideal choice for improving conductivities of polymer composites. However, hetero‐structured fillers are usually disorderly distributed in matrix, hindering further improvement efficiency constructing conduction pathways This work proposes a new strategy graft polymethyl methacrylate molecular brushes on surfaces fluorinated graphene@carbon nanotube (FG@CNT) by atom transfer radical polymerization. FG@CNT is orderly arranged presents liquid crystalline state (LC‐(FG@CNT), which then introduced into polyimide (LC‐PI) matrix with high intrinsic conductivity fabricate LC‐(FG@CNT)/LC‐PI composite films. The in‐plane through‐plane ( λ ∥ , ⊥ ) 15 wt.% films reach 5.66 0.76 W·m −1 ·K respectively, 168.2% 137.5% higher than those LC‐PI = 2.11 0.32 ), also significantly FG@CNT/LC‐PI 4.72 0.74 ). Demonstrated heat dissipation testing finite element simulation, show excellent management capabilities great application potential generation flexible electronic devices.

Язык: Английский

Процитировано

0