Flexural and Free Vibration Analysis of Glass and Natural Fiber-Based Hybrid Laminated Composites: Experimental and Numerical Insights
Fibers and Polymers,
Год журнала:
2025,
Номер
unknown
Опубликована: Март 17, 2025
Язык: Английский
The Macromolecular Transition of Kapok Fiber by RF Plasma Treatment Investigated by SAXS/WAXD Studies and Their Correlation With Electrical Properties of the Fiber‐Reinforced Composites
Journal of Applied Polymer Science,
Год журнала:
2025,
Номер
unknown
Опубликована: Фев. 25, 2025
ABSTRACT
The
macromolecular
structure
of
untreated
and
RF
plasma‐treated
kapok
fiber
(KF)
was
investigated
employing
small‐angle
x‐ray
scattering
(SAXS)
wide‐angle
diffraction
(WAXD).
Subsequently,
the
structural
transition
KF
correlated
with
dielectric
properties
their
reinforced
epoxy
polymer
composites.
WAXD
patterns
resemble
Iβ
cellulose.
crystallinity
index
(CI)
crystallite
size
(CS)
values
are
found
to
increase
from
48.8%
3.0
nm
55.6%
3.6
nm,
respectively,
after
plasma
treatment
on
at
a
power
30
W
for
min.
one‐dimensional
three‐dimensional
correlation
functions
calculated
background‐corrected
smeared‐out
SAXS
intensity
data.
theories
developed
by
Vonk
Ruland
were
used
estimate
different
parameters
functions,
considering
has
non‐ideal
two‐phase
structure.
maximum
value
CI,
CS
minimum
transversal
length
in
void
phase
()
volume
fraction
obtained
treated
Consequently,
composites
exhibit
low
constant
(12)
loss
(0.5),
enhancing
suitability
use
printed
circuit
boards.
Язык: Английский
Cold plasma‐mediated kapok fiber/epoxy composites for printed circuit board applications
Polymer Composites,
Год журнала:
2025,
Номер
unknown
Опубликована: Апрель 12, 2025
Abstract
This
study
investigates
the
structural,
mechanical,
viscoelastic,
dielectric
and
impedance
properties
of
raw
RF
plasma‐treated
kapok
fiber/epoxy
composites
for
printed
circuit
board
(PCB)
applications,
with
a
focus
on
fiber‐matrix
interface
characteristics.
Kapok
fiber
(KF),
known
its
lightweight,
was
used
as
reinforcement
in
epoxy‐based
polymer
composites,
plasma
treatment
KF
employed
to
enhance
interfacial
adhesion
composite
performance.
The
flexural
strength
(
F
s
),
tensile
T
impact
I
)
storage
modulus
E
′)
increased
by
168%,
121%,
151%
104%
respectively,
after
KF.
Further,
analysis
demonstrated
reducing
electrical
losses
enhancing
insulation
KF/epoxy
studies
highlighting
role
crystalline
amorphous
content
AC
conductivity.
Also,
water
absorption
percentage
decreased
from
8.1%
4.0%
investigation
confirms
that
30‐Watt
30‐min
exhibit
superior
compared
due
KF,
making
them
viable
candidates
high‐strength
eco‐friendly
PCBs
electronic
applications.
Highlights
Plasm
enhanced
interfacial,
chemical,
mechanical
bonding.
Glass
transition
temperature
28°C.
Electrical
4.0%.
Язык: Английский