Multilayered silver nanowires and graphene fluoride-based aramid nanofibers for excellent thermoconductive electromagnetic interference shielding materials with low-reflection DOI
Duy Khiem Nguyen,

Trung Nhan Pham,

Ai Le Hoang Pham

и другие.

Colloids and Surfaces A Physicochemical and Engineering Aspects, Год журнала: 2024, Номер 688, С. 133553 - 133553

Опубликована: Фев. 23, 2024

Язык: Английский

Robust MXene Nanosheet-Based Electromagnetic Interference Shielding Membrane with Cation–π Interactions DOI
Longhai Zhuo, Pengfei Gou,

Lixia He

и другие.

ACS Applied Nano Materials, Год журнала: 2024, Номер 7(3), С. 3403 - 3414

Опубликована: Янв. 18, 2024

Electromagnetic interference (EMI) shielding is vital for electronic device reliability and combating electromagnetic wave (EMW) pollution. In this research, we employed a vacuum-assisted filtration method to fabricate MXene membranes achieved the construction of robust PAA/MXene hybrid by incorporating polyamic acid (PAA) adhesive containing imidazole rings through cation–π interactions. The integration PAA led reduction in internal pores thickness membrane, mainly attributed reinforcing interactions that enhance interlayer forces among nanosheets. This substantially enhances tensile strength concurrently induces alterations their fracture behavior. Adding small amount greatly increased conductivity but excessive amounts resulted severe decline. When content remained below 2 wt % nanosheets, EMI SET membrane exhibited minimal fluctuations, consistently exceeding 60 dB. mechanism primarily relied on reflection, with reflected waves accounting over 60% incident EMWs. utilization approach significantly interface thereby holding immense potential advanced modification materials.

Язык: Английский

Процитировано

5

Comparative Effects of Hydrazine and Thermal Reduction Methods on Electromagnetic Interference Shielding Characteristics in Foamed Titanium Carbonitride MXene Films DOI Creative Commons
Reza Rahmati, Meysam Salari, Mehran Ashouri‐Sanjani

и другие.

Small, Год журнала: 2023, Номер 20(21)

Опубликована: Дек. 17, 2023

The urgent need for the development of micro-thin shields against electromagnetic interference (EMI) has sparked interest in MXene materials owing to their metallic electrical conductivity and ease film processing. Meanwhile, postprocessing treatments can potentially exert profound impacts on shielding effectiveness (SE). This work comprehensively compares two reduction methods, hydrazine versus thermal, fabricate foamed titanium carbonitride (Ti

Язык: Английский

Процитировано

10

Ultrathin Aramid Nanofiber Composites with Alternating Multilayered Structure of Silver Nanowires and Boron Arsenide: Toward Superior Electrically Insulating Thermoconductive Electromagnetic Interference Shielding Materials DOI
Thien Chi Nguyen,

Ai Le Hoang Pham,

Duy Khiem Nguyen

и другие.

ACS Applied Electronic Materials, Год журнала: 2024, Номер 6(5), С. 3704 - 3716

Опубликована: Апрель 26, 2024

The development of advanced technology recently has led to the innovation smart wearable electronic devices. fabrication polymeric composites that can achieve exceptional electromagnetic interference (EMI) shielding and efficiently dissipate heat while maintaining superior mechanical flexibility electrical insulation been a long-standing objective. However, accomplishing these multiple objectives is challenge, particularly when working with thinner film thicknesses. To address this demand, work presents facile approach utilizing boron arsenide (BA) based aramid nanofibers (ANF) silver nanowires (AgNWs) create an alternating multilayered structure (AMS), employing vacuum filtration method. This technique allowed us investigate how different structures impact mechanical, EMI shielding, thermal conductivity properties composites. resultant composite denoted as BA50@ANF-3/AgNWs-2, which features AMS three layers BA (50 wt %) ANF two AgNWs, we observed tensile strength 137.83 MPa fracture strain 5.96%. Additionally, demonstrated impressive efficiency (EMI SE), reaching 54 dB at thickness 30 μm. Notably, optimal displays in both through-plane in-plane directions 10.92 28.125 W/(m K), respectively. study serves valuable guide for high-performance materials by leveraging innovative structural design techniques.

Язык: Английский

Процитировано

4

Tellurium Nanoparticles Incorporated into Electrospun Poly(acrylonitrile) Nanofibers, Followed by Carbonization and Their Poly(dimethylsiloxane) Composites for Electromagnetic Interference Shielding DOI
Govind Kumar Sharma, Sneha L Joseph,

M S Athira

и другие.

ACS Applied Nano Materials, Год журнала: 2024, Номер 7(6), С. 5819 - 5830

Опубликована: Фев. 15, 2024

Miniaturized, flexible, and highly integrated electronic devices have become an essential part of everyday life. This has contributed to a huge increase in the emission electromagnetic (EM) waves resulted interference (EMI), which can affect function devices. So, high-performance EMI shielding materials assume great importance. Low density favorable flexibility are desirable properties for these materials. The present study reports tellurium nanoparticles (Te NPs) incorporated into nitrogen-doped carbon nanofiber (Te-CNF) prepared through electrospinning, followed by carbonization, applications. Tellurium is metalloid with narrow band gap, incorporation Te NPs (CNF) may alter improve 3D conductive network. also introduce polarization sites heterointerfaces CNF. Te-CNF exhibited average effectiveness 37 dB X-band region thickness 0.08 mm 0.499 g cm–1 possessed high electrical conductivity 0.68 S cm–1. higher SEA values compared SER due synergistic effect CNF, such as interfacial polarization, conduction loss, multiple scattering internal reflections EM waves. Poly(dimethylsiloxane) (PDMS), common flexible substrate, been used ease handling mat. Thus, property PDMS substrate made use composite achieve material. its composites lightweight, hydrophobic exhibit property.

Язык: Английский

Процитировано

3

Multilayered silver nanowires and graphene fluoride-based aramid nanofibers for excellent thermoconductive electromagnetic interference shielding materials with low-reflection DOI
Duy Khiem Nguyen,

Trung Nhan Pham,

Ai Le Hoang Pham

и другие.

Colloids and Surfaces A Physicochemical and Engineering Aspects, Год журнала: 2024, Номер 688, С. 133553 - 133553

Опубликована: Фев. 23, 2024

Язык: Английский

Процитировано

3