Low‐Cost and Stable Semitransparent Crystalline Silicon Solar Cells via Two‐Step Laser Processing DOI
Hongdong Chen, Honghua Zhang, Yinuo Zhou

и другие.

Solar RRL, Год журнала: 2025, Номер unknown

Опубликована: Май 9, 2025

Semitransparent (ST) solar cells hold promise for application in building‐integrated photovoltaics and vehicles, but current ST often exhibit problems such as color uniformity, low efficiency, poor stability. This study proposes a novel method of fabricating crystalline silicon with average visible transmittance (AVT) controlled via hexagon‐arranged microhole patterns using two‐step laser processing. The optimal configuration microholes was evaluated, the AVT functions diameter distance. two steps processing, avoiding shunt problem during cell fabrication one‐step to form microholes, were individually performed. Thus, 80% 20% thickness wafer respectively removed melting before after fabrication. advanced heterojunction thus conducted, wet procedure responsible removing damage caused by first‐step Therefore, performance mainly depended on due second‐step We finally prepared power conversion efficiency 10.2% at 13%, damp‐heat endurance, neutral colors. strategy represents significant step toward development efficient their application.

Язык: Английский

Low‐Cost and Stable Semitransparent Crystalline Silicon Solar Cells via Two‐Step Laser Processing DOI
Hongdong Chen, Honghua Zhang, Yinuo Zhou

и другие.

Solar RRL, Год журнала: 2025, Номер unknown

Опубликована: Май 9, 2025

Semitransparent (ST) solar cells hold promise for application in building‐integrated photovoltaics and vehicles, but current ST often exhibit problems such as color uniformity, low efficiency, poor stability. This study proposes a novel method of fabricating crystalline silicon with average visible transmittance (AVT) controlled via hexagon‐arranged microhole patterns using two‐step laser processing. The optimal configuration microholes was evaluated, the AVT functions diameter distance. two steps processing, avoiding shunt problem during cell fabrication one‐step to form microholes, were individually performed. Thus, 80% 20% thickness wafer respectively removed melting before after fabrication. advanced heterojunction thus conducted, wet procedure responsible removing damage caused by first‐step Therefore, performance mainly depended on due second‐step We finally prepared power conversion efficiency 10.2% at 13%, damp‐heat endurance, neutral colors. strategy represents significant step toward development efficient their application.

Язык: Английский

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