ABSTRACT
Effective
heat
distribution
in
electronic
circuitry
is
essential
to
improve
the
performance
and
life
of
components
such
as
chips.
This
study
presents
a
numerical
analysis
transfer
on
substrate
board
populated
with
an
array
discrete
sources,
assumed
be
placed
horizontal
air
channel
for
forced
convection
cooling.
The
packages
performed,
taking
into
consideration
effect
thermal
contact
conductance
(TCC)
between
source
(chip)
board.
dependence
temperature
Reynolds
number
at
inlet
heating
power
from
investigated
velocities
ranging
0.6
1.4
m/s
observed
significant.
Temperature
coefficient
are
systematically
increase
dissipation
source.
Two
configurations—inline
staggered—are
analyzed,
staggered
configuration
showing
superior
cooling
performance.
improvement
attributed
fact
that
arrangements
expose
fewer
sources
pre‐heated
before
it
exits
system.
Additionally,
location
reaching
highest
found
highly
dependent
TCC
bonding
material
substrate.
A
hybrid
optimization
strategy
employed,
by
combining
Artificial
Neural
Network
(ANN)
Genetic
Algorithm
(GA)
optimizing
sources.
ANN
used
predicting
distribution,
subsequently
followed
GA
minimize
maximum
attained
generating
varying
other
control
variables
like
thickness,
velocity,
generation.
thickness
layer
varied
0.225
0.271
mm
generation
1000
2000
W/m
2
.
Among
them,
important
parameter
controlling
optimum
results
obtained
proposed
compared
simulation
reasonably
close.
Alumina/polymer
composites
are
conventional
thermal
interface
materials
widely
used
for
heat
dissipation.
However,
the
interfacial
resistance
(ITR)
dominates
conductivity
(TC)
of
these
composites,
presenting
a
critical
challenge.
This
study
introduces
erythritol
as
an
innovative
bridge
to
effectively
reduce
ITR
by
selectively
locating
it
at
interfaces
among
alumina
(Al2O3)
particles.
Through
straightforward
preparation
method,
was
positioned
Al2O3
particles,
followed
impregnation
poly(dimethylsiloxane)
(PDMS)
into
filler
gaps.
The
resulting
Al2O3/erythritol/PDMS
composite
demonstrated
3.12
W·m-1·K-1
content
4.16
wt
%
and
53.7
vol
%.
Minor
usage
brings
34.4%
enhancement
compared
with
Al2O3/PDMS
composites.
Additionally,
shows
potential
switch
due
erythritol's
phase
change
properties.
approach,
which
emphasizes
fluid-state
processing
bridging,
presents
promising
new
strategy
improving
ceramic-filled
polymer
Combining
droplets
of
liquid
metal
(LM)
with
nanomaterials
often
introduces
synergistic
thermal
or
electrical
properties
that
are
not
found
in
the
constituent
materials
alone.
However,
these
existing
systems,
LM
maintain
a
statistically
uniform
dispersion
and
capable
self-assembly
aggregation.
These
composites
limited
by
their
need
for
high
volume
fractions
(>60
vol
%)
to
achieve
properties,
introducing
leaking
as
drawback
management
wearable
electronic
applications.
In
this
work,
we
show
coating
nanoscale
eutectic
gallium–indium
(EGaIn)
small
Ti3C2Tx
MXenes
(0.25
results
unique
morphology
which
self-assemble
form
semisolid
aggregates.
This
is
accomplished
wrapping
MXene
sheets
around
individual
create
"sticky"
particles
self-assembled
aggregates
when
mixed
silicone
oil.
By
aggregation
design
parameter
soft
composites,
electric
resistance
composite
shown
change
dramatically.
contrast
silicone-based
containing
nanosheets
alone,
MXene-LM-silicone-based
exhibit
an
exponential
increase
conductivity
decreasing
interfacial
thickness
significantly
lower
(25
while
avoiding
rupture
bleed-out.
could
enable
more
effective
reducing
amount
filler
material
required
interface
(TIM)
printed
electronics.
Innovative
thermal
management
fiber
materials
have
emerged
as
a
solution
to
address
challenges
across
diverse
fields,
ranging
from
personal
comfort
and
electronic
device
cooling
aerospace
engineering.
While
graphene
is
known
for
its
higher
conductivity
over
conventional
carbon
fiber,
boron
nitride
(BN)
has
received
much
less
attention
in
one-dimensional
form,
despite
combined
high
notable
insulating
properties.
Previous
studies
mainly
focused
on
composite
fibers
with
BN
nanosheets
embedded
polymer
matrix.
In
contrast,
pure
consequent
investigations
single-fiber
level
barely
been
reported.
this
study,
we
report
the
fabrication
of
continuous,
via
polymer-derived
ceramic
approach
thermally
conductive
fillers.
Comprehensive
structural
characterizations
confirm
fibers'
quality
purity
without
apparent
contamination.
With
big-MEMS
method
developed,
single
precisely
measured
reaches
an
impressive
54
W
m-1
K-1.
Furthermore,
using
stacking-cutting
method,
resulting
vertically
aligned
fiber-reinforced
epoxy
demonstrates
24
K-1,
showing
immense
potential
usage
interface
material.
This
work
explores
electrically
applications.
Advanced Functional Materials,
Год журнала:
2024,
Номер
unknown
Опубликована: Ноя. 12, 2024
Abstract
Self‐hygroscopic
hydrogels,
characterized
by
high
evaporation
enthalpy,
cooling
efficiency,
and
self‐regulating
properties,
have
garnered
significant
attention.
However,
most
current
research
focuses
on
enhancing
the
hygroscopic
desorption
performance,
often
overlooking
importance
of
monitoring
self‐regulation
process,
which
limits
its
further
application.
Advanced
visualization
technologies,
such
as
in
situ
electrical
impedance
tomography,
low‐field
nuclear
magnetic
resonance,
hyperspectral
imaging,
offer
potential
insights
into
this
behavior,
yet
they
require
additional
devices,
incur
costs,
involve
complex
sample
preparation
processes.
Therefore,
drawing
inspiration
from
nature,
humidity‐color‐sensitive
hydrogels
(HCSHs)
strategy
is
proposed
for
visualized
cooling.
Benefiting
strong
polar
responsiveness
aggregation‐induced
emission
(AIE)
molecules,
hydrogel's
fluorescence
significantly
changes
with
varying
interior
water
content,
thereby
process
monitored
easily.
Further,
obtained
hydrogel
could
be
applied
electronic
device
owing
to
polymer
skeletons’
swelling
ratio,
adhesion,
excellent
self‐hygroscopic
properties.
This
overcomes
limitations
visual
technology
materials
provides
new
intelligent
thermal
management
devices.
Mathematically
inspired
structure
design
has
emerged
as
a
powerful
approach
for
tailoring
material
properties,
especially
in
nanoscale
thermal
transport,
with
promising
applications
both
within
this
field
and
beyond.
