Liquid phosphorus-based bis-imidazole compounds as latent curing agents for enhancing thermal, mechanical, and flame-retardant performances of single-component epoxy resins

Polymer Degradation and Stability, Год журнала: 2024, Номер unknown, С. 111066 - 111066

Опубликована: Окт. 1, 2024

Язык: Английский

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Control over phase structures’ evolution within the novel organic–inorganic hybrid system for achieving a comprehensive thermal, mechanical, and dielectric properties

Chemical Engineering Journal, Год журнала: 2024, Номер 498, С. 155182 - 155182

Опубликована: Авг. 25, 2024

Язык: Английский

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Natural resin-derived urushiol-based phosphorylation derivative towards flame-retardant and mechanically strong epoxy resin

Polymer Degradation and Stability, Год журнала: 2024, Номер 229, С. 110985 - 110985

Опубликована: Авг. 29, 2024

Язык: Английский

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Hydrogen-bonded organic framework for fire-safe epoxy composite with photochromic properties and rapid de-icing capability

Chemical Engineering Journal, Год журнала: 2024, Номер unknown, С. 156211 - 156211

Опубликована: Сен. 1, 2024

Язык: Английский

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Synthesis of nitrogen and phosphorus-doped chitosan derivatives for enhanced flame retardancy, smoke suppression, and mechanical properties in epoxy resin composites

International Journal of Biological Macromolecules, Год журнала: 2024, Номер unknown, С. 137889 - 137889

Опубликована: Ноя. 1, 2024

Язык: Английский

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Organic-inorganic Hybrid Epoxy Vitrimers with Excellent Thermal-Mechanical Stability Based on Carboxylic-acid Type Carbon Dots as Curing Agent: Flame Retardancy and Reprocessing

Composites Part B Engineering, Год журнала: 2025, Номер unknown, С. 112316 - 112316

Опубликована: Фев. 1, 2025

Язык: Английский

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Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO₂/Epoxy Composites for Advanced Electronic Packaging

Advanced Engineering Materials, Год журнала: 2025, Номер unknown

Опубликована: Фев. 21, 2025

Low‐dielectric epoxy‐based composites are crucial for advanced electronic packaging in the high‐speed digital communication field. An effective method to achieving low dielectric loss ( D f ) is construct active ester‐curing system. However, introduction of large ester groups negatively affects thermal stability cured epoxy composite. Herein, hydroxyl‐terminated polyphenylene oxide (PPO) incorporated into allyl bisphenol A‐based ester‐cured SiO 2 /epoxy composites, and their properties evaluated. By incorporating 20 wt% PPO, achieve an ultralow 0.0022 at 1 kHz a coefficient expansion 29.0 ppm °C −1 below T g , while glass transition temperature increased from 97.7 117 value Young's modulus enhanced 8610 10 331 MPa. Moreover, PPO significantly enhances humid constant k owing water absorption 0.12%. These results demonstrate that combination should be potential strategy designing materials.

Язык: Английский

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High-performance epoxy thermosets with excellent low dielectric, flame-retardant and antibacterial properties based on bio-based derived active ester curing agents

Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 161189 - 161189

Опубликована: Март 1, 2025

Язык: Английский

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Fluorene‐based active ester significantly improved high‐frequency dielectric performance of SiO₂/epoxy composites

Polymer Composites, Год журнала: 2025, Номер unknown

Опубликована: Март 22, 2025

Abstract High‐performance epoxy composites are critical dielectrics used in advanced electronic packaging. A low dielectric constant ( D k ) and an ultralow loss tangent f at high frequencies highly desired for fast lossless transition signals devices. Active ester, a new type of curing agent composites, can achieve . However, the thermal performance notably decreases compared to traditional amine phenolic agents. Herein, strengthen performance, active ester (BPFAE) constructed with fluorene rigid group was successfully synthesized via one‐step esterification reaction between bisphenol p‐toluoyl chloride lasting 5 hours. The cured SiO 2 ‐filled perform excellently T g ~ 149°C, d5% 384°C, α 1 21 ppm·K −1 (~2.4) (~0.0037) 20 GHz. After inundating water 24 hours boiled hour, still achieved about 2.45 0.004. These results highlight significant potential BPFAE‐cured high‐frequency, high‐performance packaging applications. Highlights Fluorene‐based reaction. BPFAE system performs reactivity p 135°C. 149°C CTE were obtained. Excellent properties 2.4 0.0037 Outstanding stability under humidity conditions

Язык: Английский

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Study on the dielectric properties of fluorinated graphene

FlatChem, Год журнала: 2025, Номер unknown, С. 100862 - 100862

Опубликована: Март 1, 2025

Язык: Английский

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