Molecular design and application of low dielectric bismaleimide resin

Polymer Engineering and Science, Год журнала: 2024, Номер unknown

Опубликована: Сен. 24, 2024

Abstract With the development of communications technology, copper‐clad laminate (CCL) for integrated circuits (IC) pointed to direction high‐frequency and high‐speed development, that is, a lower dielectric constant loss requirements. Bismaleimide (BMI) resins feature stable properties excellent thermal stability over wide temperature range, widely used in manufacture CCL substrates. However, comprehensive performance BMI resin itself, including properties, still cannot fully meet needs ever‐changing industry, so molecular design modification enhance is currently one key research directions circuit CCL. This paper reviews their applications, focusing on main methods formulation optimization, allyl, diamine, internal chain‐extended, chemical/physical blending modification. Finally, low its application are summarized prospected. Future include synthesis multi‐component copolymers further realize balance between performance, as well exploring possibility novel composite modifications provide more competitive high‐performance materials IC field. Highlights The bismaleimide applications reviewed. monomers' chemical reaction summarized. modified

Язык: Английский

Branching a benzoxazole-g-PBO fiber/cyanate ester resin composite with excellent wave transmission at high temperatures

Chemical Engineering Journal, Год журнала: 2024, Номер unknown, С. 158840 - 158840

Опубликована: Дек. 1, 2024

Язык: Английский