Polymer, Год журнала: 2024, Номер 309, С. 127423 - 127423
Опубликована: Июль 23, 2024
Язык: Английский
Polymer, Год журнала: 2024, Номер 309, С. 127423 - 127423
Опубликована: Июль 23, 2024
Язык: Английский
IEEE Transactions on Dielectrics and Electrical Insulation, Год журнала: 2024, Номер 32(1), С. 117 - 126
Опубликована: Окт. 24, 2024
Язык: Английский
Процитировано
23Nano-Structures & Nano-Objects, Год журнала: 2024, Номер 39, С. 101271 - 101271
Опубликована: Июль 24, 2024
Язык: Английский
Процитировано
19Materials Today Chemistry, Год журнала: 2024, Номер 43, С. 102492 - 102492
Опубликована: Дек. 28, 2024
Язык: Английский
Процитировано
19Materials Today Chemistry, Год журнала: 2025, Номер 45, С. 102644 - 102644
Опубликована: Март 17, 2025
Язык: Английский
Процитировано
3Chemical Engineering Journal, Год журнала: 2024, Номер 501, С. 157623 - 157623
Опубликована: Ноя. 16, 2024
Язык: Английский
Процитировано
15Composites Part A Applied Science and Manufacturing, Год журнала: 2025, Номер unknown, С. 108893 - 108893
Опубликована: Апрель 1, 2025
Язык: Английский
Процитировано
2Polymer, Год журнала: 2024, Номер 307, С. 127245 - 127245
Опубликована: Июнь 3, 2024
Язык: Английский
Процитировано
9ACS Applied Nano Materials, Год журнала: 2024, Номер 7(10), С. 11803 - 11815
Опубликована: Май 8, 2024
The development of heterostructures offers an effective method for influencing thermal transport mechanisms. This work presents the preparation heterostructured, thermally conductive alumina nanosphere@boron nitride nanosheet (f-A@B) fillers that resemble "sesame crackers" using in situ approach. Benefited from synergistic effect zero-dimensional (0D) alumina/two-dimensional (2D) boron (BNNS) which and BNNS are boned at interface, f-A@B/poly(dimethylsiloxane) (PDMS) nanocomposites presented excellent heat dissipation efficiency. uniformly connecting to interlaminar is essential supplying a conduction channel. At mass fraction 30 wt % f-A@B, f-A@B/PDMS nanocomposite optimal conductivity (κ) 3.72 W m–1 K–1, 1279% increase over pure PDMS. modified Hashin–Shtrikman (MHS) model verifies explains experimental results, suggesting reduced filler-to-filler interfacial resistance accounts construction f-A@B heterostructure. Meanwhile, as-prepared composites also exhibit exceptional volume resistivity up 2.2 × 1013 Ω cm, 4 orders magnitude greater than critical electrical insulation (109 cm). with superior insulating properties may open future opportunities packaging management.
Язык: Английский
Процитировано
8Polymer Composites, Год журнала: 2024, Номер unknown
Опубликована: Окт. 6, 2024
Abstract Establishing a robust interfacial bond between hexagonal boron nitride (h‐BN) plates and the epoxy matrix is essential for enhancing heat transfer, which difficult because of h‐BN's low‐surface energy, tendency to clump together, chemical inertness matrix. This research shows different techniques treating surface h‐BN fillers by applying acids thermal processes activate surface. The silanization process was used increase silane content on activated in order make it more compatible with X‐ray photoelectron spectroscopy analysis revealed silicon peaks (Si 2 s peak at 150.1 eV Si p 100.3 eV) spectrum silane‐treated samples. Heat treatment resulted production oxygen molecules shell compared acid treatment. Here, primary focus examining how affects conductivity (TC) performance both in‐plane through‐thickness paths. There an epoxy's TC perpendicular plane, going from 0.21 0.47 (W/mK), showing remarkable 123.8% enhancement adding 10 wt% silane‐modified‐thermal treated particles. improvement effectively silanizing exterior boundary particles, connection distribution Surface modification h‐BN‐epoxy composites improves TC, leading better conduction management systems, benefiting industries like aerospace, automotive, energy systems. Highlights Silanization filler‐matrix bonding improved transfer Boosting direction surface‐modified Significant h‐BN. Thermal produced oxygenation than Application aerospace automotive through transfer.
Язык: Английский
Процитировано
8Polymer Composites, Год журнала: 2024, Номер 45(10), С. 9530 - 9542
Опубликована: Апрель 9, 2024
Abstract The expanding realm of high‐frequency electronics necessitates materials with exceptional attributes: notably, a low dielectric constant ( D k ) to minimize signal propagation delays, high thermal conductivity for effective heat dissipation, higher breakdown strength, and robust mechanical properties withstand demanding operational environments. While cycloolefin copolymers (COC) excel in electrical insulation, chemical resistance, durability, their intrinsic slightly compared other polymers, along challenges such as poor dispersibility compatibility nanoparticles, hinder full potential this domain. Considering these drawbacks, study fabricated series COC/mica composites by integrating natural mica particles into the COC matrix via CTAB‐assisted surface modification enhance mitigating particle aggregation through in‐situ mixing hot‐press methods. resultant demonstrate an outstanding ultra‐low 1.44, marking significant decrease over 36% pristine 2.26, exceptionally loss δ 0.00013 at frequency 10 GHz, strength ~49.40 kV/mm enhanced up 0.88 W/(m K) 40% loading. Additionally, heightened performances like tensile 69 MPa 6.5% elongation break, impact ~17.9 kJ × m −2 , water resistance absorption below 0.097%. These performance above mentioned can meet stringent requirements modern packaging next generation development. Highlights Surface CTAB homogeneous composites. Achieved pure COC. Thermal improved significantly incorporation mica. Unlocking applications ultralow performance.
Язык: Английский
Процитировано
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