Enhanced intrinsic thermal conductivity of liquid crystalline polyester dispersed films through hydrogen bond interaction DOI

Panpan Yang,

Yifei Wu,

Kunxin Wang

и другие.

Polymer, Год журнала: 2024, Номер 309, С. 127423 - 127423

Опубликована: Июль 23, 2024

Язык: Английский

A review of methods and applications for improving electric driving performance of dielectric elastomer DOI

Libin Yang,

Mengyuan Hao, Kai Yang

и другие.

IEEE Transactions on Dielectrics and Electrical Insulation, Год журнала: 2024, Номер 32(1), С. 117 - 126

Опубликована: Окт. 24, 2024

Язык: Английский

Процитировано

23

Advancements in zinc oxide nanomaterials: Synthesis, properties, and diverse applications DOI
Hussain Gulab,

Nusrat Fatima,

Urooj Tariq

и другие.

Nano-Structures & Nano-Objects, Год журнала: 2024, Номер 39, С. 101271 - 101271

Опубликована: Июль 24, 2024

Язык: Английский

Процитировано

19

Synergistic regulation of intra-particle and inter-particle polarizations in BaTiO3@Al2O3/PVDF nanocomposites towards boosted overall dielectric properties DOI

Xingxing Meng,

Wenying Zhou, Xiaolong Chen

и другие.

Materials Today Chemistry, Год журнала: 2024, Номер 43, С. 102492 - 102492

Опубликована: Дек. 28, 2024

Язык: Английский

Процитировано

19

Fine assembly of TiO2 on the surface of Si particles leading to enhanced dielectric performance of PVDF composites DOI
Kai Zhang, Wenying Zhou, Na Lin

и другие.

Materials Today Chemistry, Год журнала: 2025, Номер 45, С. 102644 - 102644

Опубликована: Март 17, 2025

Язык: Английский

Процитировано

3

Enhanced dielectric breakdown strength and thermal conductivity of silicone gel composites with high-electron-affinity silicon Dioxide/Cationic Polymer/Nano-diamond DOI
Meng Luo, Yuanhang Zhou, Ran Wang

и другие.

Chemical Engineering Journal, Год журнала: 2024, Номер 501, С. 157623 - 157623

Опубликована: Ноя. 16, 2024

Язык: Английский

Процитировано

15

Regulating SiO2 interlayer morphology towards synergistically reinforced dielectric properties and thermal conductivity in Si/PVDF composites DOI
Mengyuan Zhang, Wenying Zhou, Yanqing Zhang

и другие.

Composites Part A Applied Science and Manufacturing, Год журнала: 2025, Номер unknown, С. 108893 - 108893

Опубликована: Апрель 1, 2025

Язык: Английский

Процитировано

2

Highly efficient thermal conductivity of polyarylene ether nitrile composites via the introduction of hybrid fillers and tailored cross-linked structure DOI
Liang He, Yu Zheng,

Xiaoling Xu

и другие.

Polymer, Год журнала: 2024, Номер 307, С. 127245 - 127245

Опубликована: Июнь 3, 2024

Язык: Английский

Процитировано

9

Heterostructured Alumina/Boron Nitride Nanosheets for Thermal Management of Poly(dimethylsiloxane) DOI

Xiaole Zheng,

Kun Wu,

Yingjie Zhan

и другие.

ACS Applied Nano Materials, Год журнала: 2024, Номер 7(10), С. 11803 - 11815

Опубликована: Май 8, 2024

The development of heterostructures offers an effective method for influencing thermal transport mechanisms. This work presents the preparation heterostructured, thermally conductive alumina nanosphere@boron nitride nanosheet (f-A@B) fillers that resemble "sesame crackers" using in situ approach. Benefited from synergistic effect zero-dimensional (0D) alumina/two-dimensional (2D) boron (BNNS) which and BNNS are boned at interface, f-A@B/poly(dimethylsiloxane) (PDMS) nanocomposites presented excellent heat dissipation efficiency. uniformly connecting to interlaminar is essential supplying a conduction channel. At mass fraction 30 wt % f-A@B, f-A@B/PDMS nanocomposite optimal conductivity (κ) 3.72 W m–1 K–1, 1279% increase over pure PDMS. modified Hashin–Shtrikman (MHS) model verifies explains experimental results, suggesting reduced filler-to-filler interfacial resistance accounts construction f-A@B heterostructure. Meanwhile, as-prepared composites also exhibit exceptional volume resistivity up 2.2 × 1013 Ω cm, 4 orders magnitude greater than critical electrical insulation (109 cm). with superior insulating properties may open future opportunities packaging management.

Язык: Английский

Процитировано

8

Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding DOI
Mostafa Mehdipour, Semih Doğan, Marjan Hezarkhani

и другие.

Polymer Composites, Год журнала: 2024, Номер unknown

Опубликована: Окт. 6, 2024

Abstract Establishing a robust interfacial bond between hexagonal boron nitride (h‐BN) plates and the epoxy matrix is essential for enhancing heat transfer, which difficult because of h‐BN's low‐surface energy, tendency to clump together, chemical inertness matrix. This research shows different techniques treating surface h‐BN fillers by applying acids thermal processes activate surface. The silanization process was used increase silane content on activated in order make it more compatible with X‐ray photoelectron spectroscopy analysis revealed silicon peaks (Si 2 s peak at 150.1 eV Si p 100.3 eV) spectrum silane‐treated samples. Heat treatment resulted production oxygen molecules shell compared acid treatment. Here, primary focus examining how affects conductivity (TC) performance both in‐plane through‐thickness paths. There an epoxy's TC perpendicular plane, going from 0.21 0.47 (W/mK), showing remarkable 123.8% enhancement adding 10 wt% silane‐modified‐thermal treated particles. improvement effectively silanizing exterior boundary particles, connection distribution Surface modification h‐BN‐epoxy composites improves TC, leading better conduction management systems, benefiting industries like aerospace, automotive, energy systems. Highlights Silanization filler‐matrix bonding improved transfer Boosting direction surface‐modified Significant h‐BN. Thermal produced oxygenation than Application aerospace automotive through transfer.

Язык: Английский

Процитировано

8

Surface functionalization of naturally occurring silicate minerals infused hydrocarbon polymer matrix for ultra‐low dielectric performance at high frequency domain DOI
Md Zahidul Islam, Hridam Deb, Khalid Hasan

и другие.

Polymer Composites, Год журнала: 2024, Номер 45(10), С. 9530 - 9542

Опубликована: Апрель 9, 2024

Abstract The expanding realm of high‐frequency electronics necessitates materials with exceptional attributes: notably, a low dielectric constant ( D k ) to minimize signal propagation delays, high thermal conductivity for effective heat dissipation, higher breakdown strength, and robust mechanical properties withstand demanding operational environments. While cycloolefin copolymers (COC) excel in electrical insulation, chemical resistance, durability, their intrinsic slightly compared other polymers, along challenges such as poor dispersibility compatibility nanoparticles, hinder full potential this domain. Considering these drawbacks, study fabricated series COC/mica composites by integrating natural mica particles into the COC matrix via CTAB‐assisted surface modification enhance mitigating particle aggregation through in‐situ mixing hot‐press methods. resultant demonstrate an outstanding ultra‐low 1.44, marking significant decrease over 36% pristine 2.26, exceptionally loss δ 0.00013 at frequency 10 GHz, strength ~49.40 kV/mm enhanced up 0.88 W/(m K) 40% loading. Additionally, heightened performances like tensile 69 MPa 6.5% elongation break, impact ~17.9 kJ × m −2 , water resistance absorption below 0.097%. These performance above mentioned can meet stringent requirements modern packaging next generation development. Highlights Surface CTAB homogeneous composites. Achieved pure COC. Thermal improved significantly incorporation mica. Unlocking applications ultralow performance.

Язык: Английский

Процитировано

7