Investigation of phenyl methyl sulfoxide as an additive for cobalt super-filling in 3D interconnect DOI
Yunwen Wu, Mengyun Zhang, Yuhang Jiang

и другие.

Surfaces and Interfaces, Год журнала: 2024, Номер unknown, С. 105652 - 105652

Опубликована: Дек. 1, 2024

Язык: Английский

From Fundamentals to Practice: Electrolyte Strategies for Zinc‐Ion Batteries in Extreme Temperature DOI Creative Commons
Tao Xue, Yongbiao Mu, Xian Yong Wei

и другие.

Carbon Neutralization, Год журнала: 2024, Номер 4(1)

Опубликована: Ноя. 24, 2024

ABSTRACT In the pursuit of advanced energy storage technologies that promote sustainable solutions, zinc‐ion batteries (ZIBs) have emerged as a promising alternative to lithium‐ion due their abundance, safety, and environmental advantages. However, failure mechanisms ZIBs under extreme temperatures are still not fully understood, presenting significant challenges development commercialization. Therefore, innovative strategies essential enhance adaptability temperature extremes. this review, we first explore thermodynamic kinetic aspects performance degradation temperatures, focusing on key factors such ion diffusion redox processes at electrode interfaces. We then comprehensively summarize discuss existing approaches for various electrolyte types, including aqueous, nonaqueous, solid state. Finally, highlight future prospects operating conditions. The insights presented in review expected accelerate advancement facilitate practical implementation large‐scale systems.

Язык: Английский

Процитировано

7

Superconformal Electrodeposition of Cobalt into Micron-Scale Trench with Alkynol Derivatives DOI Open Access
Wei Xu,

Y.D. Li,

Tingjun Wu

и другие.

Materials, Год журнала: 2025, Номер 18(8), С. 1747 - 1747

Опубликована: Апрель 10, 2025

Copper interconnect technology faces limitations due to the electron’s mean free path and electromigration, driving adoption of cobalt alternatives. This study proposes a novel mechanism achieve superfilling by tuning adsorption energy additive molecules on surfaces. The energies additives are tailored changing molecular structures with different functional groups. Computational results reveal that carbon–carbon triple bonds critically strengthen adsorption, while ether further enhance binding distinct crystallographic planes. Specifically, 1,4-bis(2-hydroxyethoxy)-2-butyne (BEO) containing both groups exhibits highest (−22.62 eV). Replacing hydroxyl in 2-butyne-1,4-diol (BOZ) reduces −10.39 eV, eliminating 1,4-butanediol diglycidyl (BDE) decreases it −8.43 eV. Experimental studies demonstrate BOZ BEO preferentially adsorb (101) (110) planes hexagonal close-packed (HCP-Co) their differential energies. selective suppression promotes preferential growth along densely packed (002) orientation. leads trench-filling process dominated most plane, resulting better electrical performance. Superfilling is achieved when range 5–8 work establishes group design strategy regulate enabling control for advanced electrodeposition processes.

Язык: Английский

Процитировано

0

Convection-dependent adsorption and growth modulation mechanism of a novel alkyne additive for high-quality cobalt superfilling DOI

Shiqi Song,

Haidi Li, Qian Li

и другие.

Applied Surface Science, Год журнала: 2025, Номер unknown, С. 163227 - 163227

Опубликована: Апрель 1, 2025

Язык: Английский

Процитировано

0

Study of 5-Alkynylpyrimidines as Cobalt Superfilling Inhibitors DOI
Haidi Li, Tao Zhang,

Shiqi Song

и другие.

The Journal of Physical Chemistry C, Год журнала: 2024, Номер 129(1), С. 232 - 243

Опубликована: Дек. 16, 2024

Electrodeposition technology is the key core for achieving micro/nanoscale interconnection in high-end chip manufacturing. Recently, cobalt interconnect structures have been ideal choice constructing electronic pathways process nodes below 14 nm due to fact that has a smaller electron mean free path compared copper; thus, studying electroplating filling behavior of micronano scale space become hot topic field In this article, an solution containing new 5-alkynylpyrimidine (5-EP) as inhibitor designed electrochemical tests, including cyclic voltammetry and linear sweep voltammetry. The results indicate 5-EP significantly inhibits electrodeposition. change nucleation mode with was revealed by chronoamperometry, where atoms nucleate three-dimensional continuous manner instead instantaneous nucleation. situ enhanced Raman spectroscopy used further analyze adsorption molecules on surface during from spectroscopic perspective. energy gap value additive molecule obtained through quantum chemical calculations △E = ELUMO – EHOMO 3.302 eV, indicating high reactivity higher strength at metal interface. calculated electrostatic potential (ESP) values range minimum −47.29 kJ/mol maximum 70.89 kJ/mol. Lower ESP imply density. Molecular dynamics simulations calculate Co(100) be −133.96 kcal/mol, good capability. Electroplating experiments reveal addition 6 ppm plating enables defect-free blind holes. Finally, it also characterization tests (scanning microscopy/atomic force microscopy/X-ray diffraction) effectively reduces roughness coating and, meantime, promotes preferential growth along 100 110 crystal planes.

Язык: Английский

Процитировано

1

Investigation of phenyl methyl sulfoxide as an additive for cobalt super-filling in 3D interconnect DOI
Yunwen Wu, Mengyun Zhang, Yuhang Jiang

и другие.

Surfaces and Interfaces, Год журнала: 2024, Номер unknown, С. 105652 - 105652

Опубликована: Дек. 1, 2024

Язык: Английский

Процитировано

1