Topological manifold microchannel cooling for thermal management of divertor in fusion reactor DOI
Jianhong Zhou, Mingxiang Lu, Le Han

и другие.

Energy, Год журнала: 2024, Номер unknown, С. 134145 - 134145

Опубликована: Дек. 1, 2024

Язык: Английский

Effect of surface wettability on bubble dynamics and heat transfer in microchannel flow boiling DOI

Yanhong Sun,

Zan Zhang, Guotao Zhang

и другие.

International Journal of Heat and Mass Transfer, Год журнала: 2025, Номер 241, С. 126729 - 126729

Опубликована: Янв. 23, 2025

Язык: Английский

Процитировано

2
Ultra-stable counter flow diverging minichannel heat sink with integrated microstructures for superior cooling performance DOI
Syed Waqar Ali Shah, Xingchi Jiang,

Yuanjie Li

и другие.

Applied Thermal Engineering, Год журнала: 2024, Номер unknown, С. 124560 - 124560

Опубликована: Окт. 1, 2024

Язык: Английский

Процитировано

4
Thermal-Hydraulic characterization in Manifold-microchannel heat sinks for Energy-efficient cooling of HEV/EV power modules DOI

Yunseo Kim,

Daeyoung Kong,

R. Deepak Selvakumar

и другие.

Applied Thermal Engineering, Год журнала: 2025, Номер unknown, С. 125611 - 125611

Опубликована: Янв. 1, 2025

Язык: Английский

Процитировано

0
Micro‐/Nanohierarchical Surfaces for Enhanced Pool Boiling in Large‐Area Silicon Multichips DOI Creative Commons

Youngseob Lee,

Kiwan Kim,

Yunseo Kim

и другие.

Small Structures, Год журнала: 2025, Номер unknown

Опубликована: Янв. 28, 2025

With the rising demand for data centers, need an efficient thermal management approach becomes increasingly critical. This study examines enhancement in pool boiling heat transfer on a customized multichip module, designed to mimic artificial intelligence chip layouts high‐performance computing. Experiments are conducted smooth surfaces and hierarchical structures integrating micropillars porous copper, specifically copper inverse opal (CuIO) nanowire (NW). The results demonstrate significant enhancements critical flux (CHF) coefficient (HTC) through these structures. Notably, NW‐CuIO‐integrated structure exhibits highest CHF (234 W cm −2 ), achieving 166% over silicon. HTC is more pronounced CuIO‐integrated structure; this achieves of 70.3 kW m K −1 , which represents improvement. heater layout, engineered surfaces, their synergistic effects analyzed visualization. observed inversion phenomena further underscore importance sequential activation nucleation sites improving performance. provides valuable insights into mechanisms governing offers practical guidance developing solutions centers.

Язык: Английский

Процитировано

0
Synergistic thermo-hydraulic optimization of embedded microchannels: Balancing chip cooling efficiency and pressure fluctuation resistance DOI
Xing Yang, Jingtan Chen, Yi Qin

и другие.

Energy, Год журнала: 2025, Номер unknown, С. 136775 - 136775

Опубликована: Май 1, 2025

Язык: Английский

Процитировано

0
Topological manifold microchannel cooling for thermal management of divertor in fusion reactor DOI
Jianhong Zhou, Mingxiang Lu, Le Han

и другие.

Energy, Год журнала: 2024, Номер unknown, С. 134145 - 134145

Опубликована: Дек. 1, 2024

Язык: Английский

Процитировано

2