Silicon surface texturing via TBAB-SDS composite additives enhanced copper-assisted chemical etching DOI

Yongqiang Wei,

Huanlun Tong,

Shaoyuan Li

и другие.

Solar Energy Materials and Solar Cells, Год журнала: 2024, Номер 278, С. 113185 - 113185

Опубликована: Сен. 23, 2024

Язык: Английский

Suppression of interference from dissolved organic matter using anionic surfactant for electrochemical detection of heavy metals DOI
Wenjie Qin, Huijie Hou,

Shun Gao

и другие.

Electrochimica Acta, Год журнала: 2025, Номер 514, С. 145641 - 145641

Опубликована: Янв. 2, 2025

Язык: Английский

Процитировано

0

Converting infiltration swales to sustainable urban drainage systems can improve water management and biodiversity DOI Creative Commons
Brigitte Helmreich, Maha Deeb, Patrizia Eben

и другие.

Frontiers in Environmental Science, Год журнала: 2025, Номер 12

Опубликована: Янв. 20, 2025

Sustainable Urban Drainage Systems (SUDS) are ecosystems that based on engineered soil and designed plant communities to manage stormwater on-site enhance infiltration, evapotranspiration, cooling, thus reducing flooding urban heat islands. In addition, SUDS may act as hotspots for biodiversity could be more socially accepted if they work well multifunctional. However, we still lack a critical understanding of the techno-ecological basis construct sustainably. Due climate change pollutants such de-icing salts, confronted with harmful environmental triggers interfere their sustainable development. Thus, challenge is combine treatment drainage principles restoration ecology, while implementing expertise from science, microbiome research, ecology. this perspective paper, will discuss development maintenance principle role interdisciplinary research in reaching these goals.

Язык: Английский

Процитировано

0

Cu(II) Biosorption and Synthesis of CuO Nanoparticles by Staphylococcus epidermidis CECT 4183: Evaluation of the Biocidal Effect DOI Creative Commons
Antonio J. Candil Muñoz, Francisco Espínola, Manuel Moya

и другие.

Applied Sciences, Год журнала: 2024, Номер 14(17), С. 7623 - 7623

Опубликована: Авг. 28, 2024

Copper contamination of natural waters is a global problem that affects ecosystems and public health, yet this metal an essential micronutrient has important applications. The efficacy Staphylococcus epidermidis CECT 4183 as Cu(II) biosorbent in synthetic solutions its potential ability to synthesize CuO nanoparticles (CuO-NPs) from cellular extract was investigated. In addition, the biocidal evaluated against five microorganisms. Using response surface methodology, optimal operating conditions were determined be biomass dose, 0.2 g/L, pH 5.5. Equilibrium tests performed, biosorption isotherms obtained for four models with maximum capacity 48.14 mg/g Langmuir model. Different spectroscopic microscopic techniques used determine mechanisms involved process, which dominated by physicochemical interactions strong involvement methyl, methylene, carbonyl, amino, phosphate groups. also allowed characterizing nanoparticles, had quasi-spherical morphology average size 14 nm. Finally, showed CuO-NPs good inhibitory microorganisms tested, minimum concentrations (MIC) between 62.5 500 µg/mL bacteria 1000 2000 yeasts. S. bioremediation synthesis capacity. use biosorption, cell presented high green CuO-NPs, at same time turned out agents.

Язык: Английский

Процитировано

2

Silicon Surface Texturing Via Tbab-Sds Composite Additives Enhanced Copper-Assisted Chemical Etching DOI

Yongqiang Wei,

Huanlun Tong,

Shaoyuan Li

и другие.

Опубликована: Янв. 1, 2024

Uneven etching and low fabrication efficiency impede the large-scale applications of copper-assisted chemical (Cu-ACE) for texturing light-trapping structures on surface silicon wafers. To address this, a composite additive composed tetrabutylammonium bromide (TBAB) sodium dodecyl sulfate (SDS) was introduced into Cu-ACE system. The results indicated that TBAB accelerated rate improved uniformity, while SDS enlarged size formed enhanced their ultraviolet light absorption efficiency. prepared inverted pyramid structure reduced reflectivity wafer to 3.8%, thus exhibiting efficient capabilities. evolution under various concentrations different HF/H2O2 ratios studied by characterizing contact angle copper deposition morphology. electrostatic attraction between dangling bonds material transfer at reaction interface changed electron distribution around bonds, facilitating catalytic metal attack these bonds. ion reactivity decreased due complexation dissociated alkyl ions ions, which favored larger nanoparticles during etching, thereby increasing structures. This research offers valuable insights enable Cu-ACE.

Язык: Английский

Процитировано

0

XV Congreso Español de Tratamiento de Aguas DOI

Vílchez Perdigón Carmen,

Kennes Veiga María Patricia,

C. Loreto

и другие.

Опубликована: Июль 24, 2024

Análisis del riesgo ambiental asociado al lavado de gases escape en buques

Процитировано

0

Silicon surface texturing via TBAB-SDS composite additives enhanced copper-assisted chemical etching DOI

Yongqiang Wei,

Huanlun Tong,

Shaoyuan Li

и другие.

Solar Energy Materials and Solar Cells, Год журнала: 2024, Номер 278, С. 113185 - 113185

Опубликована: Сен. 23, 2024

Язык: Английский

Процитировано

0