High-entropy
alloys
(HEAs)
have
been
widely
used
and
concerned
in
recent
years
due
to
their
excellent
material
properties.
The
impurity
elements
can
exert
a
certain
impact
on
the
alloy
properties
even
at
lower
content.
In
this
study,
total
reflection
X-ray
fluorescence
(TXRF)
was
combined
with
suspension
sample
preparation
methods
measure
trace
three
common
high-entropy
powders.
high-Z
(Ca,
Mn)
low-Z
(Mg,
Al)
were
quantitatively
determined
by
internal
standard
method
calibration
curve
method,
respectively.
Then,
compared
detection
results
of
inductively
coupled
plasma-optical
emission
spectrometer
(ICP-OES),
showed
good
consistency.
Although
there
some
deviation
influence
physical
mechanisms
elements,
qualitative
analysis
quantitative
estimation
could
still
be
conducted.
It
is
proved
that
TXRF
an
effective
analytical
tool
for
alloys.
Moreover,
through
methods,
process
non-destructive,
fast,
low-cost,
less
demands.
Therefore,
suitable
rapid
element
production
Micromachines,
Год журнала:
2025,
Номер
16(3), С. 300 - 300
Опубликована: Март 3, 2025
Flexible
wearable
devices
and
solar
flexible
units
often
use
thermally
sensitive
organic
materials
as
substrates,
which
are
prone
to
thermal
damage
during
the
bonding
process
in
3D
packaging,
leading
chip
deformation
or
failure.
Multicomponent
solders,
with
well-designed
multicomponent
metallic
elements,
exhibit
unique
low-melting-point
characteristics.
The
application
of
low-temperature
solders
electronic
packaging
can
significantly
reduce
temperatures
minimize
chips.
This
paper
reviews
wettability
preparation
methods
concludes
effect
different
elements
on
solders.
Additionally,
this
discusses
research
interfacial
reactions,
mechanical
properties
solder
joints,
providing
valuable
insights
for
future
development
field.
