Materials,
Год журнала:
2024,
Номер
17(23), С. 5978 - 5978
Опубликована: Дек. 6, 2024
Liquid
metals
and
metallic
alloys
often
exist
as
metastable
phases
or
can
be
undercooled
below
their
equilibrium
melting
point.
The
Traditional
CALPHAD
(CALculation
of
PHAse
Diagrams)
approach
struggles
to
accurately
model
these
conditions,
which
are
important
in
rapid
quenching
techniques
like
additive
manufacturing,
understand
glass
formation
oxidation
phenomena
occurring
the
liquid
phase
during
nuclear
high-temperature
aerospace
applications.
On
contrary,
third-generation
models
have
potential
describe
diagrams
provide
better
predictions
molten
behavior
under
non-equilibrium
conditions.
latter
is
utilized
this
study
achieve
a
more
accurate
description
thermodynamic
properties
elemental
Nb
Zr,
with
particular
focus
on
phases.
By
incorporating
available
first-principles
data,
representation
state
improved
for
both
elements,
capturing
peculiar
heat
capacity
wide
temperature
range.
These
improvements
enable
reliable
prediction
stability
liquidus
boundaries
Nb-Zr
system.
A
partial
re-assessment
binary
diagram
also
conducted
refined
that
align
well
experimental
data.
This
study
examines
the
impact
of
solid
solution
aging
treatment
on
microstructure
and
mechanical
properties
carbon
interstitial
AlCoCrFeNi2.1
eutectic
high-entropy
alloys
(EHEAs).
The
results
show
that
after
treatment,
atoms
are
fully
dissolved
in
matrix.
In
carbon-free
alloys,
body-centered
cubic
(BCC)
phase
adopts
a
rod-like
structure,
whereas
carbon-doped
exhibit
spherical
morphology.
After
at
500°C,
small
amount
precipitate
appears
along
boundary.
At
600°C,
disk
precipitates
completely
matched
with
interface
continuously
However,
700°C,
nano-precipitates
transform
into
coarser
particles
short
structures
unevenly
distributed
within
BCC
boundaries.
Mechanical
testing
reveals
1300°C
for
6
hours
600°C
4
hours,
alloy
achieves
yield
strength
560.7
MPa,
tensile
1072.5
elongation
11.3%,
reflecting
favorable
balance
ductility.
Strengthening
is
attributed
to
nanoscale
boundaries,
which
create
significant
dislocation
barriers.
These
coherent
bond
strongly
matrix,
enabling
coordinated
movement
promoting
plastic
co-deformation
both
phases,
thereby
maintaining
plasticity.
Micromachines,
Год журнала:
2025,
Номер
16(3), С. 300 - 300
Опубликована: Март 3, 2025
Flexible
wearable
devices
and
solar
flexible
units
often
use
thermally
sensitive
organic
materials
as
substrates,
which
are
prone
to
thermal
damage
during
the
bonding
process
in
3D
packaging,
leading
chip
deformation
or
failure.
Multicomponent
solders,
with
well-designed
multicomponent
metallic
elements,
exhibit
unique
low-melting-point
characteristics.
The
application
of
low-temperature
solders
electronic
packaging
can
significantly
reduce
temperatures
minimize
chips.
This
paper
reviews
wettability
preparation
methods
concludes
effect
different
elements
on
solders.
Additionally,
this
discusses
research
interfacial
reactions,
mechanical
properties
solder
joints,
providing
valuable
insights
for
future
development
field.
