Molecular structure influence of porous intrinsic polyimide nanofiber for high temperature flue gas filtration: Bisphenol AF, sulfone, ether bonds and hydroxyl groups
Materials Today Advances,
Год журнала:
2025,
Номер
25, С. 100564 - 100564
Опубликована: Фев. 4, 2025
Язык: Английский
Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
ACS Applied Polymer Materials,
Год журнала:
2025,
Номер
unknown
Опубликована: Март 17, 2025
The
use
of
traditional
photosensitive
polyimide
(PSPI)
insulating
materials,
which
possess
high
coefficients
thermal
expansion
(CTE)
and
poor
adhesion
to
copper,
easily
causes
failure
issues
in
the
redistribution
layers
(RDLs).
However,
there
are
some
trade-offs
design
low-CTE
PSPI
materials
such
as
ultraviolet
(UV)
transmittance
precursors
dielectric
properties
films.
To
overcome
above
challenges,
an
AB2-type
fluorinated
monoamine
(ETFPh-NH2)
with
a
nonplanar
steric
structure
was
designed
synthesized,
then
used
end-capper
attached
poly(amic
ester)
(PAE)
linear/stiff
structure.
solutions
were
developed
by
using
as-prepared
PAE
resins,
solvents,
other
additives.
Despite
presence
ETFPh-NH2
relatively
low
molar
ratio
total
precursor
chains,
transparency
PAE-4
notably
enhanced,
resulting
achievement
high-resolution
lithographic
pattern.
Meanwhile,
PI-4
film
exhibited
characteristics
(23.65
ppm
K–1),
its
mechanical
enhanced
microbranched
cross-link
structure,
constructed
reaction
arylethynyl
groups
during
imidization
process.
Furthermore,
between
PI
films
Cu
significantly
improved
introducing
aromatic
silane
(TMS).
In
short,
PI-4,
high-dimensional
stability,
strong
Cu,
photopatternable
capabilities,
could
be
feasible
reliable
material
for
advanced
packaging.
addition,
end-groups
modification
strategy
seems
effective
way
greatly
improve
overall
performance
materials.
Язык: Английский
Functional Groups‐Regulated Organic Semiconductors for Efficient Artificial Photosynthesis of Hydrogen Peroxide
Advanced Materials,
Год журнала:
2025,
Номер
unknown
Опубликована: Март 18, 2025
Abstract
Hydrogen
peroxide
(H
2
O
)
is
an
environmentally
friendly
reagent,
and
organic
semiconductors
(OSCs)
are
ideal
photocatalysts
for
the
synthesis
of
H
due
to
their
well‐defined
molecular
structure,
strong
donor‐acceptor
interactions,
efficient
charge
separation.
This
review
discusses
regulatory
mechanisms
functional
group
modifications
in
tuning
photocatalytic
performance
OSCs,
highlighting
relationship
between
structure
catalytic
performance.
For
example,
electron‐regulating
groups,
such
as
cyano
halogen,
induce
dipoles,
facilitating
migration
photogenerated
electrons.
Fluorine
groups
optimize
band
prolong
carrier
lifetime
high
electronegativity.
π‐Conjugated
extension
like
anthraquinone
thiophene,
expand
conjugation,
improve
visible
light
capture,
stabilize
intermediates
through
redox
cycles.
Hydroxyl
enhance
surface
hydrophilicity
promote
activation,
while
imine
bond
protonation
adjusts
distribution
improves
selectivity
cycle
stability.
Multi‐active
site
sulfonic
acid
amide,
accelerate
reaction
kinetics
inhibit
decomposition.
Functional
absorption,
separation,
reactions
electronic
regulation,
intermediate
adsorption
optimization,
proton‐electron
transfer.
Future
work
should
integrate
machine
learning
identify
optimal
combinations
develop
green
functionalization
strategies
photocatalyst
synthesis.
Язык: Английский
Reveling the Structural, Electric, and High-Frequency Dielectric Properties of Residue Doped-CaWO4 Flexible Multilayer Ceramic Sheets
Materials Research,
Год журнала:
2025,
Номер
28
Опубликована: Янв. 1, 2025
The
mineralization
process
to
reach
Tungsten
(W)
involves
several
steps
reduce
the
impurities
(residues),
which
makes
more
expensive.
However,
it
is
possible
explore
pure
scheelite
(CaWO4)
and
residue
doped-CaWO4
on
flexible
sheets
using
Tape
Casting
technique.
In
particular,
high
frequency
dielectric
properties
of
multilayers
have
an
increased
appeal
in
electronics
industry.
this
study,
we
present
a
systematic
investigation
structural,
morphological,
electrical
high-frequency
ceramics
sheet
composed
CaWO4
residue-doped
CaWO4.
Our
findings
demonstrate
that
constant
has
small
dependence
amount,
but
remarkable
modification
as
number
layers
increases.
Here
achieved
34%
increase
for
ceramic
when
from
1
3.
Язык: Английский
Fluorine-Free Thermoplastic High-Frequency Low Dielectric Poly(ether imide)s for Flexible Copper Clad Laminates
ACS Applied Polymer Materials,
Год журнала:
2025,
Номер
unknown
Опубликована: Март 25, 2025
To
meet
the
requirements
of
high-frequency
signal
transmission
in
5G
or
6G
applications,
development
high-performance
functional
polyimide
possessing
a
low
dielectric
constant
(Dk)
and
loss
(Df)
at
high
frequencies,
along
with
melting
processing
capabilities
good
adhesion
to
copper
foil,
is
both
urgent
highly
challenging.
In
this
work,
three
diamines
containing
tert-butyl
moieties
ether
bonds
but
different
substitution
positions
amine
groups
were
designed
synthesized,
poly(ether
imide)s
(PEIs;
TBPI,
TTBPI,
ATBPI,
PTBPI)
obtained
from
their
polycondensation
4,4′-(4,4′-isopropylidenediphenoxy)
diphthalic
anhydride
(BPADA).
The
introduction
flexible
such
as
bond
bisphenol
A
structure
has
potential
improve
flexibility
molecular
chains
reduce
density
imide
ring,
polarity,
glass
transition
temperature
PEIs.
incorporation
unique
spatial
nonpolar
side
group
may
help
increase
free
volume
exceptional
hydrophobicity
Both
give
as-prepared
fluorine-free
PEIs
range
beneficial
characteristics,
property,
excellent
solubility,
water
absorption
(0.42,
0.35,
0.50%
P/P0
=
0.50
(50%
relatively
humidity
(RH)),
respectively),
Dk
(2.83,
2.84,
2.82
10
GHz
50%
RH),
Df
(0.00339,
0.00257,
0.00366
peel
strength
foil
via
hot-pressing
molding.
successful
enables
preparation
truly
adhesive-free
clad
laminates
(FCCLs)
This
significantly
simplifies
process
FCCLs
enhances
reliability
electronic
circuits,
thereby
presenting
attractive
application
prospects
for
mobile
communication.
Язык: Английский
High Performance Polyimide Films with Low Dk and Low Df at 10 GHz via Cross-Linking of Bulky Pendant Groups
ACS Applied Polymer Materials,
Год журнала:
2025,
Номер
unknown
Опубликована: Март 28, 2025
Язык: Английский
Preparation of hollow mesoporous silica/polyimide composite films and study of their properties
Xin Li,
Qi‐wen Ma,
Guang‐ning Yu
и другие.
Polymer Composites,
Год журнала:
2025,
Номер
unknown
Опубликована: Апрель 18, 2025
Abstract
Constructing
high‐performance
polyimide
(PI)
films
with
low
dielectric
constant,
excellent
mechanical
properties,
hydrophobicity,
and
thermal
stability
is
of
great
significance,
but
remains
a
challenge.
Herein,
five
PI
(labeled
as
P1,
P2,
P3,
P4,
P5,
respectively)
were
successfully
synthesized
by
conventional
two‐step
method
using
1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene
the
sole
diamine
monomer
pyromellitic
dianhydride,
2,3,6,7‐Naphthalenetetracarboxylic
2,3:6,7‐Dianhydride,
3,3′,4,4′‐biphenyltetracarboxylic
o‐4,4′‐oxydiphthalic
anhydride,
3,3′,4,4′‐benzophenonetetracarboxylic
dianhydride
monomers,
respectively.
Particularly,
hollow
mesoporous
silica
(HMSMs)/PI
film
comprehensive
properties
was
introducing
HMSMs
into
P4
based
on
polymerization
strategy.
The
results
showed
that
doping
contributed
to
reducing
improving
maintaining
in
comparison
film.
When
content
1.5
wt.%,
decomposition
temperature,
tensile
strength,
water
contact
angle,
constant
HMSMs/PI
composite
measured
at
489°C,
162
MPa,
86.45°,
2.40,
This
study
presents
new
approach
for
preparing
advanced
films.
Highlights
High‐performance
synthesized.
Doping
enhances
overall
performance
A
lower
(2.40)
achieved.
Язык: Английский