Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 162904 - 162904
Опубликована: Апрель 1, 2025
Язык: Английский
Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 162904 - 162904
Опубликована: Апрель 1, 2025
Язык: Английский
Colloids and Surfaces A Physicochemical and Engineering Aspects, Год журнала: 2025, Номер unknown, С. 136746 - 136746
Опубликована: Март 1, 2025
Язык: Английский
Процитировано
0Small, Год журнала: 2025, Номер unknown
Опубликована: Март 30, 2025
Abstract The escalating thermal challenges posed by increasing power densities in electronic devices emerge as a critical barrier to maintain their sustained and reliable operation. Addressing this issue requires the strategic development of materials with superior conductivity properties facilitate progress high‐power electronics development. Thermal conductive polymer composites incorporating ceramic material renowned for exceptional adjustability, insulating properties, moldability, are emerging promising solution urgent challenge. Hexagonal boron nitride (h‐BN) nanomaterials highly candidates management applications, owing mechanical stability, remarkable coefficients, minimal expansion characteristics, outstanding chemical inertness. In work, ≈10 years on high nitride‐filled is thoroughly summarized. Moreover, strategies h‐BN other nanomaterials‐filled at synthesis, functionalization, innovative structural design discussed detail. main future nitride‐polymer also proposed, which will provide meaningful guidance practical applications materials.
Язык: Английский
Процитировано
0Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 162904 - 162904
Опубликована: Апрель 1, 2025
Язык: Английский
Процитировано
0