Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper

Applied Sciences, Год журнала: 2025, Номер 15(1), С. 476 - 476

Опубликована: Янв. 6, 2025

As the density of electronic packaging continues to rise, traditional soldering techniques encounter significant challenges, leading copper–copper direct bonding as a new high-density connection method. The high melting point copper presents difficulties for diffusion under standard conditions, thus making low-temperature focal research. In this study, we examine sintering process at various temperatures by constructing models with multiple nanoparticles and them different conditions. Our findings indicate that 600 K is crucial temperature sintering. Below threshold, predominantly depends on structural adjustments driven residual stresses particle contact. Conversely, above, activation rapid surface atomic motion enables further between nanoparticles, marked decrease in porosity. Mechanical testing sintered samples corroborated changes temperatures, demonstrating dynamic atoms inherent mechanisms significantly affects mechanical properties nanomaterials. These have important implications developing high-performance materials align evolving requirements modern devices.

Язык: Английский

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Sintering of Ti–Al nanoparticle pairs: a molecular dynamics simulation study

Journal of Nanoparticle Research, Год журнала: 2025, Номер 27(5)

Опубликована: Май 1, 2025

Язык: Английский

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Development of an Antioxidation Copper Paste with Self-Reducing Copper Formate and Molecular Dynamics Analysis of Sintering Mechanisms

Acta Metallurgica Sinica (English Letters), Год журнала: 2025, Номер unknown

Опубликована: Май 9, 2025

Язык: Английский

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Study on the melting and sintering behavior of Cu-Fe mixed nanoparticles based on molecular dynamics simulations

Materials & Design, Год журнала: 2024, Номер 248, С. 113457 - 113457

Опубликована: Ноя. 13, 2024

Язык: Английский

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