2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Год журнала: 2024, Номер unknown, С. 1 - 4
Опубликована: Июнь 30, 2024
Язык: Английский
2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Год журнала: 2024, Номер unknown, С. 1 - 4
Опубликована: Июнь 30, 2024
Язык: Английский
Microsystems & Nanoengineering, Год журнала: 2025, Номер 11(1)
Опубликована: Март 19, 2025
Abstract Flexible devices are increasingly crucial in various aspects of our lives, including healthcare and human-machine interface systems, revolutionizing human life. As technology evolves rapidly, there is a high demand for innovative manufacturing methods that enable rapid prototyping custom multifunctional flexible with quality. Recently, digital light processing (DLP) 3D printing has emerged as promising approach due to its capabilities creating intricate customized structures, fabrication speed, low-cost widespread adoption. This review provides state-of-the-art overview the recent advances creation using DLP printing, focus on soft actuators, sensors energy devices. We emphasize how development printable materials enhance structural design, sensitivity, mechanical performance, overall functionality these Finally, we discuss challenges perspectives associated DLP-printed anticipate continued advancements will foster smarter devices, shortening design-to-manufacturing cycles.
Язык: Английский
Процитировано
4Applied Materials Today, Год журнала: 2025, Номер 44, С. 102675 - 102675
Опубликована: Март 13, 2025
Язык: Английский
Процитировано
2Renewable and Sustainable Energy Reviews, Год журнала: 2025, Номер 216, С. 115663 - 115663
Опубликована: Март 31, 2025
Язык: Английский
Процитировано
1Nano Convergence, Год журнала: 2024, Номер 11(1)
Опубликована: Ноя. 4, 2024
Abstract Digital light processing (DLP) is a projection-based vat photopolymerization 3D printing technique that attracts increasing attention due to its high resolution and accuracy. The layer-by-layer deposition in DLP uses precise control cure photopolymer resin quickly, providing smooth surface finish the uniform layer curing process. Additionally, extensive material selection printing, notably including existing photopolymerizable materials, presents significant advantage compared with other techniques limited choices. Studies can be categorized into two main domains: material-level system-level innovation. Regarding innovations, development of photocurable resins tailored rheological, photocuring, mechanical, functional properties crucial for expanding application prospects technology. In this review, we comprehensively review state-of-the-art advancements focusing on innovations centered particularly various smart materials 4D addition piezoelectric ceramics their composites applications DLP. discuss recyclable promote sustainable manufacturing practices. are also delineated, recent progress multi-materials DLP, grayscale AI-assisted related developments. We highlight current challenges propose potential directions future development. Exciting areas such as creation stimuli-responsive functionality, ceramic AI-enhanced still nascent stages. By exploring concepts like recycling technology, integration these aspects unlock opportunities driven by Through aim stimulate further interest encourage active collaborations advancing systems, fostering dynamic field. Graphical abstract
Язык: Английский
Процитировано
9Bio-Design and Manufacturing, Год журнала: 2024, Номер 7(3), С. 358 - 382
Опубликована: Апрель 29, 2024
Язык: Английский
Процитировано
5Nano Energy, Год журнала: 2024, Номер 130, С. 110168 - 110168
Опубликована: Авг. 23, 2024
Язык: Английский
Процитировано
5Applied Physics Reviews, Год журнала: 2024, Номер 11(4)
Опубликована: Дек. 1, 2024
Electronic skin (e-skin), capable of sensing a physical or chemical stimulus and triggering suitable response, is critical in applications such as healthcare, wearables, robotics, more. With substantial number types sensors over large area, the low-cost fabrication desirable for e-skin. In this regard, printing electronics attract attention it allow efficient use materials, “maskless” fabrication, low-temperature deposition. Additionally, e-skin real-time calls faster computation communication. However, due to limitations widely used materials (e.g., low mobility) tools poor print resolution), printed has been restricted passive devices low-end until recent years. Such are now being addressed through high-mobility highlighted review article, using vehicle. This paper discusses techniques that high-quality electronic layers inorganic nanostructures, their further processing obtain sensors, energy harvesters, transistors. Specifically, contact printing, transfer direct roll discussed along with working mechanisms influence dynamics. For sake completeness, few examples organic semiconductor-based also included. E-skin presents good case 3D integration flexible electronics, therefore, high-resolution connect various on substrate stack discussed. Finally, major challenges hindering scalability methods commercial uptake potential solutions.
Язык: Английский
Процитировано
4Micromachines, Год журнала: 2024, Номер 15(6), С. 678 - 678
Опубликована: Май 22, 2024
MEMS devices are more and commonly used as sensors, actuators, microfluidic in different fields like electronics, opto-electronics, biomedical engineering. Traditional fabrication technologies cannot meet the growing demand for device miniaturisation time reduction, especially when customised required. That is why additive manufacturing increasingly applied to MEMS. In this review, attention focused on Italian scenario regard 3D-printed MEMS, studying techniques materials their fabrication. To aim, research has been conducted follows: first, 3D-printing have illustrated, then some examples of reported. After that, typical these presented, finally, application described. conclusion, techniques, instead traditional processes, a trend Italy, where exciting promising results already obtained, due new selected involved.
Язык: Английский
Процитировано
3Chemical Engineering Journal, Год журнала: 2024, Номер 493, С. 152862 - 152862
Опубликована: Июнь 5, 2024
Язык: Английский
Процитировано
3Sensors and Actuators A Physical, Год журнала: 2025, Номер unknown, С. 116734 - 116734
Опубликована: Май 1, 2025
Язык: Английский
Процитировано
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