Realising Bio‐Synapse Analogous Paired‐Pulse Facilitation (PPF) and Release Inactivation (RI) and Emulating "Tip of the Tongue" Experience Through Conductance and Retention Dynamics in Ag Nano‐Labyrinth‐Based Neuromorphic Device

Advanced Functional Materials, Год журнала: 2025, Номер unknown

Опубликована: Фев. 21, 2025

Abstract In bio‐neural networks, pairing of consecutive action potentials based on the time interval in between, known as paired‐pulse facilitation (PPF), is crucial enhancing synaptic strength and duration. However, at lower intervals, release inactivation (RI) may set diminishing effect potentials. While neuromorphic version PPF extensively studied literature, aspects related to RI are largely ignored. This study presents a novel two‐terminal resistive device utilizing dewetting‐engineered Ag labyrinth structure, designed emulate observed biological synapses. The pulse not only conductance (G) but also its retention (t r ), with PPF(G) reaching maximum ≈2.65 PPF(t ) ≈12.6. Furthermore, unique second‐order when larger than first employed; instances where ended right before second within very small interval, effects can still be seen, akin “tip tongue” experience humans. Utilizing such inherent volatility particularly significant for dynamical neural network‐based reservoir computing (RC).

Язык: Английский

Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling

ACS Applied Materials & Interfaces, Год журнала: 2025, Номер unknown

Опубликована: Апрель 22, 2025

Leveler is the key additive for achieving microvia void-free filling in high-density integration of electronic components miniaturization, lightweighting, and intelligent development devices. Traditional organic levelers are mostly quaternary ammonium salts nitrogen-containing heterocyclic compounds. In this study, thiosemicarbazide (TA) 1-phenyl 2-thiourea (PTA), which thioamino compounds with different substituents amino phenyl, used first time as an acidic copper sulfate bath Cu electroplating (Cu-EP). The results demonstrate that only PTA, when leveler combination poly(ethylene glycol) (PEG) suppressor bis(sodium sulfopropyl)-disulfide (SPS) accelerator, can achieve filling. Chronopotentiometric analyses reveal both TA PTA accelerate reduction cupric ions. accelerator SPS synergistically enhances accelerating effect, while it behaves competitive adsorption to weaken effect. PEG cooperate show a strong inhibiting effect on ion but presents TA, weakening PEG. Under such complex interactions these additives, has been found SPS, exhibits convection-dependent behavior, more negative potential ions at mouth than bottom microvia, indicating theoretical feasibility Cyclic voltammetry experiments further ions, acceleration weakened by due adsorption. synergizes greatly enhance reduction. According electrochemical properties essence PTA-based elucidated through simulations. When three additives coexist, coverage PTA-PEG gradually decreases from bottom. As synergistic inhibition gradient significantly inhibits deposition mouth; simultaneously, increases bottom, facilitating dual effects enable

Язык: Английский