Consistent Thermal Conductivities of Spring‐Like Structured Polydimethylsiloxane Composites under Large Deformation

Advanced Materials, Год журнала: 2024, Номер unknown

Опубликована: Июль 6, 2024

Flexible and highly thermally conductive materials with consistent thermal conductivity (λ) during large deformation are urgently required to address the heat accumulation in flexible electronics. In this study, spring-like conduction pathways of silver nanowire (S-AgNW) fabricated by 3D printing compounded polydimethylsiloxane (PDMS) prepare S-AgNW/PDMS composites excellent λ deformation. The exhibit a 7.63 W m

Язык: Английский

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High intrinsic thermal conductivity and low dielectric constant of liquid crystalline epoxy resins with fluorine-containing semi-IPN structures

Science China Chemistry, Год журнала: 2025, Номер unknown

Опубликована: Фев. 7, 2025

Язык: Английский

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Enhancing thermal conductivity in polysiloxane composites through synergistic design of liquid crystals and boron nitride nanosheets

Journal of Material Science and Technology, Год журнала: 2025, Номер unknown

Опубликована: Фев. 1, 2025

Язык: Английский

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Advances in polymers and composite dielectrics for thermal transport and high-temperature applications

Composites Part A Applied Science and Manufacturing, Год журнала: 2022, Номер 164, С. 107320 - 107320

Опубликована: Ноя. 16, 2022

Язык: Английский

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Thermal conductive network construction and enhanced thermal conductivity in mica tape composites for large generator insulation

Composites Science and Technology, Год журнала: 2024, Номер 254, С. 110671 - 110671

Опубликована: Май 23, 2024

Язык: Английский

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Finely tuning the self-assembled architectures of liquid crystal polymers by molecular engineering: phase transitions derived from terminal group variations

Materials Advances, Год журнала: 2024, Номер 5(8), С. 3450 - 3458

Опубликована: Янв. 1, 2024

Through rational molecular design and modulation of terminal groups in building blocks, as an efficient approach, it is quite to achieve diverse phase transition behaviours adjust structures.

Язык: Английский

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Intrinsic Thermal Conductivity of Polyesters with Flexible Segments in Main Chains

The Journal of Physical Chemistry C, Год журнала: 2025, Номер unknown

Опубликована: Янв. 24, 2025

Язык: Английский

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Biphenyl-Based High Thermal Conductivity Films with Intrinsic Self-Healing Properties

ACS Applied Polymer Materials, Год журнала: 2025, Номер unknown

Опубликована: Апрель 3, 2025

Язык: Английский

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Palladium-catalyzed ligand for sterically enabled nondirected distal-selective C-H arylation of arenes

Science China Chemistry, Год журнала: 2025, Номер unknown

Опубликована: Июнь 4, 2025

Язык: Английский

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Improved thermal conductivity and excellent electrical insulation properties of polysiloxane nanocomposite-incorporated functional boron nitride sheets via in situ polymerization

Nanoscale, Год журнала: 2023, Номер 15(31), С. 13025 - 13036

Опубликована: Янв. 1, 2023

Benefiting from its high thermal conductivity (κ) and superior insulation, the boron nitride nanosheet (BNNS) is widely investigated as a promising filler for nanocomposites. However, poor dispersibility weak interaction with polymer matrix hinder further improvement of BNNS-based composites. Here, inspired by side-chain liquid crystal polysiloxane (SCLCP) good mesomorphic structures, highly thermoconductive nanocomposites prepared via in situ polymerization using SCLCP 2D BNNS are reported. The surface silanized γ-(methacryloxy)propyltrimethoxysilane (KH-570) to introduce double bonds (defined f-BNNS), it directly linked chains during polymerization. Therefore, alternating stacking f-BNNS microscopic ordered structure yielded κ 2.463 W m-1 K-1 at only 30 wt% content, improving dramatically pure ∼9 times. Further, volume electrical resistivity reached 2.11 × 1014 Ω cm, which five orders magnitude higher than critical resistance insulation (109 cm). Also, f-BNNS/SCLCP composites management materials decreased temperature LED chip 17.5 °C, exhibiting performance. Along excellent resistance, this type displays great advantages properties electronic packaging electronics.

Язык: Английский

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