Based on electrostatic adsorption constructing neural network-like structure of BNNS-OH@CNF composite films with excellent thermal management and electrical insulation performance
Yan Liao,
Dezhong Wang,
Meng Ma
и другие.
Composites Part B Engineering,
Год журнала:
2025,
Номер
unknown, С. 112197 - 112197
Опубликована: Фев. 1, 2025
Язык: Английский
An innovative heterogeneous integration of analog/digital micro-module with AMR sensors embedded for self-monitoring
Measurement,
Год журнала:
2025,
Номер
unknown, С. 117247 - 117247
Опубликована: Март 1, 2025
Язык: Английский
An Approach to Thermal Management and Performance Throttling for Federated Computation on a Low-Cost 3D ESP32-S3 Package Stack
Yi Liu,
Parth J. Shah,
Tian Xia
и другие.
Computers,
Год журнала:
2025,
Номер
14(4), С. 147 - 147
Опубликована: Апрель 11, 2025
The
rise
of
3D
heterogeneous
packaging
holds
promise
for
increased
performance
in
applications
such
as
AI
by
bringing
compute
and
memory
modules
into
close
proximity.
This
comes
with
thermal
management
challenges.
research
explores
the
use
sensing
load
throttling
combined
federated
computation
to
manage
localized
internal
heating
a
multi-3D
chip
package.
overall
concept
is
that
individual
chiplets
may
heat
at
different
rates
due
operational
geometric
factors.
Shifting
computational
loads
from
hot
cooler
can
prevent
local
overheating
while
maintaining
output.
verified
experiments
low-cost
test
vehicle.
vehicle
mimics
chiplet
stack
tightly
stacked
assembly
SoC
devices.
These
devices
sense
report
temperature
dynamically
adjust
frequency.
configuration
ESP32-S3
microcontrollers
work
on
task,
reporting
host
controller.
tight
packing
processors
causes
temperatures
rise,
those
rising
more
quickly
than
external
ones.
With
real-time
monitoring,
when
exceed
threshold,
system
reduces
processor
frequency,
i.e.,
throttles
processor,
save
power
shifts
part
workload
other
ESP32-S3s
lower
temperatures.
approach
maximizes
efficiency
safety
without
compromising
power.
Experimental
results
up
six
confirm
validity
concept.
Язык: Английский
Application of Semiconductor Technology for Piezoelectric Energy Harvester Fabrication
Energies,
Год журнала:
2024,
Номер
17(23), С. 5896 - 5896
Опубликована: Ноя. 24, 2024
In
this
paper,
we
propose
the
application
of
semiconductor
technology
processes
to
fabricate
integrated
silicon
devices
that
demonstrate
piezoelectric
energy
harvesting
effect.
The
structure
converts
thermal
into
electricity
using
a
transducer,
which
generates
electrical
signals
owing
dynamic
bending
under
pressure
caused
by
explosive
boiling
working
fluid
within
harvester.
challenges
previous
works
included
complex
manufacturing
processing
and
form
limitations
were
addressed
use
based
on
laser
beam
processing,
led
simplification
device’s
fabrication.
characterization
fabricated
harvester
prototype
proved
its
functionality
in
conversion
potential
for
integration
with
step-up
converter
or
power
management
circuit
(PMIC)
generating
stable
impulses
ranging
from
0.4
1.5
V
at
frequency
7
Hz.
Язык: Английский