Laser & Photonics Review,
Год журнала:
2024,
Номер
unknown
Опубликована: Окт. 12, 2024
Abstract
High‐speed
electro‐optic
modulators
are
key
components
in
modern
communication
networks
and
various
applications
that
require
chip‐scale
modulation
with
large
bandwidth,
high
efficiency,
compact
footprint.
However,
fundamental
trade‐offs
make
it
challenging
to
achieve
these
metrics
simultaneously,
thus
new
methodologies
must
be
explored.
To
this
end,
a
Mach–Zehnder
modulator
harnessing
slow‐light
waveguides
capacitively
loaded
slow‐wave
electrodes
presented
on
silicon‐nitride‐loaded
lithium
niobate
an
insulator
platform.
The
increased
group
index
reduced
microwave
loss
significantly
improve
the
efficiency.
With
1‐mm‐length
section,
low
half‐wave
voltage
length
product
V
π
·L
of
0.21
cm
is
obtained,
which
one
order
magnitude
smaller
than
conventional
thin
film
modulators,
bandwidth
surpassing
110
GHz
achieved.
digital
signal
processor‐free
non‐return‐to‐zero
eight‐level
pulse
amplitude
up
180
300
Gbps,
respectively,
generated
by
modulator,
provides
ultra‐large
ultra‐high
solution
for
next‐generation
systems.
Laser & Photonics Review,
Год журнала:
2024,
Номер
unknown
Опубликована: Сен. 12, 2024
Abstract
Hyperuniform
disordered
solids
(HUDS)
waveguides,
a
type
of
emerging
artificial
photonic
bandgap
(PBG)
devices,
are
demonstrated
to
possess
large,
complete,
and
isotropic
PBGs,
being
promising
for
developing
applications
in
optoelectronics,
nonlinear
optics,
sensing.
However,
optical
losses
HUDS
waveguides
usually
limited
by
giant
light
scattering
from
the
irregular
distribution
cells.
Herein,
waveguide
devices
with
low
large
PBGs
exploring
morphology‐engineering
wall‐network‐regulation
method
structures.
The
results
show
that
proposed
device
can
achieve
3.0
dB
transmittance
improvement
36‐µm‐long
silicon
waveguide.
Based
on
structure,
waveguide‐coupled
HUDS‐cladding
nanocavity
is
also
quality
factor
≈70
at
2.250
µm
wavelengths
theoretical
refractive
index
sensitivity
446
nm
RIU
−1
.
study
opens
an
avenue
develop
intriguing
on‐chip
applications.
Analog
optical
and
electronic
hardware
has
emerged
as
a
promising
alternative
to
digital
electronics
improve
the
efficiency
of
deep
neural
networks
(DNNs).
However,
previous
work
been
limited
in
scalability
(input
vector
length
To
meet
the
growing
demand
for
high-frequency
and
broadband
wireless
communications,
extending
microwave
frequencies
to
millimeter-wave
range
is
essential.
Microwave
photonic
filters
(MPFs),
as
key
components
in
systems,
are
used
select
target
signals
reduce
channel
interference.
However,
achieving
MPFs
with
a
tuning
beyond
40
GHz
remains
challenging
due
limited
bandwidth
of
electro-optical
devices
optical
filters.
In
this
study,
we
demonstrate
reconfigurable
integrated
MPF
based
on
thin-film
lithium-niobate-on-insulator
platform.
The
achieves
widest
operational
from
2
62
tunable
frequency
resolution
0.7
3
GHz.
Additionally,
filter
enables
selection
Gbit/s
data
rates
communication,
offering
practical
scalable
solution
future
applications.
Applied Physics Reviews,
Год журнала:
2024,
Номер
11(1)
Опубликована: Янв. 31, 2024
Every
multi-input
multi-output
linear
optical
system
can
be
deemed
as
a
matrix
multiplier
that
carries
out
desired
transformation
on
the
input
information,
such
imaging,
modulation,
and
computing.
The
strong
programmability
of
has
been
explored
proved
to
able
bring
more
flexibility
greater
possibilities
applications
signal
processing
general
digital
analog
Furthermore,
burgeoning
integrated
photonics
with
advanced
manufacturing
light
manipulating
technology
pave
way
for
large-scale
reconfigurable
photonic
coherent
matrix.
This
paper
reviews
programmable
in
platform.
First,
theoretical
basis
optimizing
methods
three
types
(Mach–Zehnder
interferometer
mesh,
multi-plane
diffraction,
crossbar
array)
are
introduced.
Next,
we
overview
configuring
method
this
their
processing,
neural
network,
logic
operation,
recurrent
acceleration,
quantum
computing
comprehensively
reviewed.
Finally,
challenges
opportunities
discussed.
The
huge
development
of
micro-/nano-manufacturing
techniques
on
different
materials
has
greatly
expanded
the
possibilities
realizing
on-chip
multifunctional
devices
photonic
integrated
circuits.
In
recent
years,
we
have
witnessed
technological
advancements,
such
as
active
applications
through
hybrid
integration.
this
Perspective,
first
summarize
materials,
integration
technologies,
and
corresponding
coupling
in
give
technique
prospects.
We
also
introduce
significant
advances
technologies
for
applications,
laser
sources,
optical
frequency
combs,
modulators,
our
views
that
are
likely
to
develop
rapidly.
Finally,
discuss
challenges
applications.
ACS Photonics,
Год журнала:
2024,
Номер
11(4), С. 1703 - 1714
Опубликована: Март 15, 2024
The
Ising
machine
(IM)
has
emerged
as
a
promising
tool
for
tackling
nondeterministic
polynomial-time
hard
combinatorial
optimization
problems
in
real-world
applications.
Among
various
types
of
IMs,
optoelectronic
IMs
based
on
electro-optical
(EO)
modulators
stand
out
an
impressive
platform
computations.
They
offer
simple
and
stable
architecture,
with
the
EO
modulator
providing
natural
inline
nonlinear
transfer
function
model.
However,
integrated
have
not
been
demonstrated
until
now,
exploring
large-scale
computations
within
constraints
digital
hardware
resources
remains
open
challenge
these
systems.
In
this
paper,
IM
thin-film
lithium
niobate
(TFLN)
photonic
chip
is
presented,
conjunction
sparse
matrix–vector
multiplication
algorithm
embedded
field-programmable
gate
array
that
optimizes
resource
utilization
minimizes
computational
latency.
This
setup
allows
us
to
solve
multiple
MAX-CUT
up
2048
spins
achieve
remarkably
low
iteration
latency
1.78
μs.
To
further
address
posed
by
devices
when
larger-scale
problems,
we
extend
application
TFLN
yet
another
new
scheme
which
single,
compact
on-chip
concurrently
performs
operations
linear
transformation.
demonstrates
capability
involving
16,384
spins,
which,
best
our
knowledge,
are
largest-scale
solved
IM,
highlighting
its
potential
overcome
limitations.
TFLN-based
provide
solution
high
scalability
potentially
practical
applications
addressing
complex
problems.
Optica,
Год журнала:
2024,
Номер
11(4), С. 498 - 498
Опубликована: Фев. 5, 2024
Time-bin
(TB)
and
energy-time
(ET)
entanglements
are
crucial
resources
for
long-distance
quantum
information
processing.
However,
their
standard
implementations
suffer
from
the
so-called
post-selection
loophole
that
allows
classical
simulation
thus
prevents
advantage.
The
has
been
addressed
in
proof-of-principle
experiments.
An
open
problem
though
is
to
close
it
real-life
applications
based
on
integrated
technologies.
This
especially
important
since,
so
far,
all
sources
of
TB
ET
loophole.
Here,
we
report
loophole-free
certification
or
entanglement
technologies,
by
implementing
a
silicon
nitride
chip
“hug”
scheme
[
Phys.
Rev.
Lett.
102
,
040401
(
2009
)
PRLTAO
0031-9007
10.1103/PhysRevLett.102.040401
]
certifying
genuine
through
violation
Bell
inequality.
Photonics,
Год журнала:
2025,
Номер
12(1), С. 85 - 85
Опубликована: Янв. 17, 2025
With
the
ever-growing
demand
for
high-speed
optical
communications,
microwave
photonics,
and
quantum
key
distribution
systems,
compact
electro-optic
(EO)
modulators
with
high
extinction
ratios,
large
bandwidth,
tuning
efficiency
are
urgently
pursued.
However,
most
integrated
lithium–niobate
(LN)
cannot
achieve
these
performances
simultaneously.
In
this
paper,
we
propose
an
improved
theoretical
model
of
a
chip-scale
microring
modulator
(EO-MRM)
based
on
X-cut
lithium–niobate-on-insulator
(LNOI)
hybrid
architecture
consisting
180-degree
Euler
bend
in
coupling
region,
double-layer
metal
electrode
structure,
ground–signal–signal–ground
(G-S-S-G)
configuration,
which
can
realize
highly
comprehensive
performance
footprint.
After
parameter
optimization,
designed
EO-MRM
exhibited
ratio
38
dB.
Compared
to
structure
without
bends,
increase
was
35
It
also
had
modulation
bandwidth
29
GHz
tunability
8.24
pm/V
when
straight
waveguide
length
100
μm.
At
same
time,
proposed
device
footprint
1.92
×
104
μm2.
The
MRM
provides
efficient
solution
communication
systems
is
helpful
fabrication
high-performance
multifunctional
photonic
devices.
Journal of Lightwave Technology,
Год журнала:
2024,
Номер
42(10), С. 3554 - 3562
Опубликована: Фев. 19, 2024
Achieving
high
data
rate
with
simple
system
configuration
and
low
power
consumption
is
of
great
interest
in
short-reach
intensity-modulation
direct-detection
(IM-DD)
fiber
links
for
future
datacenter
networks,
business
local
area
networks
so
forth.
For
external
modulation-based
IM-DD,
recently
remarkable
modulator
performance
has
been
achieved
terms
3dB
bandwidth,
exploiting
different
materials/platforms.
However,
due
to
the
relatively-high
RF-to-RF
(or
end-to-end)
signal
loss,
optical
amplifiers
(OA)
and/or
RF
(RFA)
were
typically
needed
IM-DD
links,
which
increases
complexity
dissipation.
In
this
work,
we
present
a
more
comprehensive
figure
merit
(FoM)
(and
link)
design,
namely
"slope
efficiency
(SLE)",
takes
into
account
not
only
bandwidth
but
also
half-wave
voltage
RF/optical
waveguide
losses,
can
provide
guiding
principle
design
toward
lower
loss.
With
high-SLE
modulator,
both
OA
RFA
be
omitted
even
when
supporting
broadband
signals
CMOS-level
driving
voltages.
We
theoretically
investigate
impact
modulators
technology
SLE
on
pulse
amplitude
modulation
(PAM)
link.
Next,
report
series
PAM
transmission
experiments
Lithium
Niobate
intensity
prototype,
enables
sub-1
Vpp
driving,
up-to-432Gb/s
over
up-to-600m
single-mode
C-band
OA&RFA-free
reception
digital
processing
(DSP)
complexity.
instance,
384Gb/s
PAM8
300m,
transmitter
was
DSP-free
while
symbol-spaced
decision-feedback
equalizer
(DFE)
61
feedforward
taps
1
feedback
tap
sufficient
receiver
considering
16.7%
hard-decision
(HD)-FEC.
Furthermore,
experimentally
show
that
supports
ultra-wide
bands
(O-,
S-,
C-
L-band).
Research Square (Research Square),
Год журнала:
2025,
Номер
unknown
Опубликована: Янв. 13, 2025
Abstract
Optical
computing
leverages
high
bandwidth,
low
latency,
and
power
efficiency,
which
is
considered
as
one
of
the
most
effective
solutions
for
accelerating
deep
learning
tasks.
However,
mainstream
photonic
hardware
accelerators
are
primarily
optimized
two-dimensional
(2D)
matrix-vector
multiplications
(MVMs).
To
implement
three-dimensional
(3D)
convolutional
neural
networks
(CNNs),
high-order
tensors
must
be
reshaped,
duplicated,
cached
in
electrical
domain
according
to
size
before
computation,
leading
extra
memory
usage
time
overheads.
Additionally,
synchronization
across
multiple
channels
depends
on
external
electronic
clocks,
increases
complexity
system.
In
this
work,
we
propose
an
integrated
3D
tensor
processing
engine
(3D-TPE)
based
interweaving
time,
wavelength,
space.
Data
caching,
realized
optical
domain,
reducing
usage,
simplifying
caching
achieved
with
tunable
delay
line
chip
supporting
versatile
clock
frequencies
up
200
GHz,
accomplished
a
dual-coupled
micro-ring
resonators
(MRRs)
crossbar
3-dB
passband
width
50
GHz.
We
verify
capabilities
3D-TPE
at
ranging
from
10
GHz
30
perform
proof-of-concept
experiment
LiDAR
point
cloud
image
recognition
task
operating
20
achieving
accuracy
97.06%.
The
proposed
anticipated
facilitate
convolutions,
playing
important
role
autonomous
driving,
healthcare,
video
analytics,
virtual
reality,
etc.