Composites Science and Technology, Год журнала: 2024, Номер unknown, С. 111031 - 111031
Опубликована: Дек. 1, 2024
Язык: Английский
Composites Science and Technology, Год журнала: 2024, Номер unknown, С. 111031 - 111031
Опубликована: Дек. 1, 2024
Язык: Английский
iScience, Год журнала: 2024, Номер 27(9), С. 110707 - 110707
Опубликована: Авг. 12, 2024
Cardiovascular diseases (CVDs) pose a significant global health threat, responsible for considerable portion of worldwide mortality. Flexible electronics enable continuous, noninvasive, real-time, and portable monitoring, providing an ideal platform personalized healthcare. Nevertheless, challenges persist in sustaining stable adherence across diverse intricate skin environments, hindering further advancement toward clinical applications. Strategies such as structural design chemical modification can significantly enhance the environmental adaptability monitoring performance flexible electronics. This review delineates processing techniques, including modification, to mitigate signal interference from sebaceous skin, motion artifacts motion, infection risks fragile thereby enabling accurate key cardiovascular indicators complex physiological environments. Moreover, it delves into potential strategic development improvement ensure their alignment with environment requirements, facilitating transition
Язык: Английский
Процитировано
2Talanta, Год журнала: 2024, Номер 283, С. 127085 - 127085
Опубликована: Окт. 22, 2024
Язык: Английский
Процитировано
2Soft Science, Год журнала: 2024, Номер 4(4)
Опубликована: Ноя. 29, 2024
Micro-cylindrical electronic devices represent a rapidly emerging class of electronics distinguished by their unique geometries and superior mechanical properties. These features enable broad range applications across fields such as wearable fibric devices, surgical robotics, implantable medical devices. The choice micro-cylindrical substrate materials is crucial in determining device performance, high curvature excellent flexibility offer an ideal foundation for functional integration. This paper systematically reviews wide array suitable analyzing differences application potential terms stability, biocompatibility, processability. requirements specifically flexibility, integrative capabilities, lightweight nature, challenge conventional planar fabrication processes, which often fall short meeting these demands. Thus, we further examine custom techniques tailored electronics, assessing advantages, limitations, specific each approach. Additionally, analyze the current developmental progress multiple fields. review also outlines future directions this field, focusing on enhancing precision, improving material compatibility advancing integration intelligent functionalities. With comprehensive overview, aims to provide valuable reference research development promoting technological advancements innovation applications.
Язык: Английский
Процитировано
2Advanced Composites and Hybrid Materials, Год журнала: 2024, Номер 8(1)
Опубликована: Ноя. 29, 2024
Язык: Английский
Процитировано
1Опубликована: Янв. 1, 2024
Язык: Английский
Процитировано
0Polymer Composites, Год журнала: 2024, Номер unknown
Опубликована: Дек. 24, 2024
Abstract Constructing effective conductive networks within polymer composites has proven to be a successful strategy for fabricating electromagnetic interference (EMI) shielding materials. Herein, we present novel approach creating high‐temperature EMI materials by integrating 3D printing with compression molding. First, thermoplastic polyurethane (TPU) framework was printed using fused deposition modeling (FDM), enabling customization of the composite's conductivity. This subsequently treated solution immersion load carbon nanotubes (CNTs) onto TPU surface, followed molding form TPU/CNTs segregated network. The effects coating cycles and hot‐pressing temperature on network performance were systematically studied. results revealed that hot pressing significantly influences development At 130°C, weak formed due spatial confinement frame, yielding an effectiveness (SE T ) 44 dB. However, at 190°C, more extensive developed as CNTs‐rich phase overcomes constrains, achieving impressive SE 52 high‐performance material, coupled its simple versatile fabrication process, holds promise advanced Highlights Integrating molding, established in composites, up dB X‐band SE. Hot‐pressing plays critical role constructing networks. A 130°C confinement, resulting lower value. robust network, demonstrates excellent electrical properties low R 0.22, next‐gen applications.
Язык: Английский
Процитировано
0Composites Science and Technology, Год журнала: 2024, Номер unknown, С. 111031 - 111031
Опубликована: Дек. 1, 2024
Язык: Английский
Процитировано
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