Enhanced thermal conductivity of polypropylene/polyamide 6 composites via optimizing the selective distribution of h‐BN and NH2‐CNTs hybrid fillers within the co‐continuous structure DOI

Xinyi Jing,

Linggong Meng,

Tong Liu

и другие.

Polymer Composites, Год журнала: 2024, Номер 45(17), С. 15968 - 15982

Опубликована: Авг. 15, 2024

Abstract Achieving high thermal conductivity in composites with low filler content is a major challenge current research. In this paper, polypropylene (PP) and polyamide 6 (PA6) were used as polymer matrix, the hybrid conductive filler, formed by hexagonal boron nitride (h‐BN) aminated carbon nanotubes (NH 2 ‐CNTs), was integrated into matrix for fabrication of (PP/PA6/h‐BN PP/PA6/h‐BN@CNTs) via two‐step melt blending technology. The fillers selectively distributed phase co‐continuous structure, forming path three‐dimensional network structure. results show that when h‐BN reaches 25 wt%, PP/PA6/h‐BN PP/PA6/h‐BN@CNTs 199% 300% higher than PP/PA6, respectively. Through testing volume resistivity composites, it confirmed maintain good electrical insulation. Both demonstrated remarkable outstanding This research provides facile way to prepare highly excellent processing performances Highlights h‐BN@CNTs sandwich structure prepared. A method control selective distribution collective. conductivity, insulation favorable performances.

Язык: Английский

Unlocking the potential of borophene: Recent progress in synthesis, properties, and applications DOI

Anuj Kumar,

A. Sudheer Kumar,

Ganeshraja Ayyakannu Sundaram

и другие.

Coordination Chemistry Reviews, Год журнала: 2024, Номер 523, С. 216246 - 216246

Опубликована: Окт. 4, 2024

Язык: Английский

Процитировано

4
Enhancing Thermal and Mechanical Properties of Soft PVC Composites With Phosphorylated Boron Nitride DOI
Yawen Li,

Guoyang Ma,

Shaohong Xu

и другие.

Polymers for Advanced Technologies, Год журнала: 2025, Номер 36(1)

Опубликована: Янв. 1, 2025

ABSTRACT In the present study, hexagonal boron nitride (h‐BN) nanosheets were first functionalized with hydroxyl groups (h‐BN‐OH), and then phosphonic acid grafted onto h‐BN surface (BNP) using aminotris(methylenephosphonic acid) (ATMP) through a condensation reaction. The BNP was incorporated into polyvinyl chloride (PVC) matrix to prepare PVC/BNP composites. Thermogravimetric analysis showed an increase in thermal stability, BNP/PVC composites exhibiting greater resistance degradation at elevated temperatures. addition of improved dispersion interfacial adhesion within PVC matrix, as confirmed by Scanning Electron Microscopy (SEM). Furthermore, exhibited 22.5% tensile strength (21.2 MPa) 82% improvement elongation break (464%) compared pristine composites, which 17.3 MPa 255%. Moreover, notably conductivity from 0.18 1.50 W/m K content increased BNP‐0 BNP‐4. These improvements stability mechanical strength, well excellent migration resistance, make highly promising for advanced applications.

Язык: Английский

Процитировано

0
Cation Adsorption Strategy to Increase the Impregnation Limit of Thermally Conductive Alumina Filler in Adhesives: Mass-Producible and Eco-Friendly Scheme for Direct Industrial Application DOI
Gaehang Lee,

Yechan Chang,

Angelo Earvin Sy Choi

и другие.

Опубликована: Янв. 1, 2025

Язык: Английский

Процитировано

0
Prediction of parameters and simulation of the process for boron isotope separation DOI

Zhongfeng Geng,

Zhenhan Wang,

Xiao Cong

и другие.

Separation and Purification Technology, Год журнала: 2025, Номер unknown, С. 132763 - 132763

Опубликована: Март 1, 2025

Язык: Английский

Процитировано

0
Hexagonal boron nitride (h-BN) “a miracle in white”: An emerging two-dimensional material for the advanced powered electronics and energy harvesting application DOI
Chinmoy Kuila, Animesh Maji, Naresh Chandra Murmu

и другие.

Composites Part B Engineering, Год журнала: 2025, Номер unknown, С. 112531 - 112531

Опубликована: Апрель 1, 2025

Язык: Английский

Процитировано

0
Methods for Preparation of Hexagonal Boron Nitride Nanomaterials DOI
Dehong Yang, Pengcheng Dai, Xiangfen Jiang

и другие.

Chemistry of Materials, Год журнала: 2024, Номер 36(20), С. 10008 - 10053

Опубликована: Июль 15, 2024

Hexagonal boron nitride (h-BN) represents a promising inorganic compound, garnering widespread attention for its unique combination of electrical insulation, thermal conductivity, lightweight nature, and chemical stability. The past decades have witnessed the advent diverse h-BN nanostructures, which preserve intrinsic superior attributes while endowing these materials with nanoscale properties. This paper aims to provide comprehensive review synthesis methods nanomaterials across different dimensions. Furthermore, it outlines applications in energy storage, management, catalysis, other fields, concludes discussion challenges prospects. It is conceived as foundational guide aimed at practical production nanomaterials.

Язык: Английский

Процитировано

2
Polymeric Nanocomposites of Boron Nitride Nanosheets for Enhanced Directional or Isotropic Thermal Transport Performance DOI Creative Commons
Buta Singh, Jinchen Han, Mohammed J. Meziani

и другие.

Nanomaterials, Год журнала: 2024, Номер 14(15), С. 1259 - 1259

Опубликована: Июль 27, 2024

Polymeric composites with boron nitride nanosheets (BNNs), which are thermally conductive yet electrically insulating, have been pursued for a variety of technological applications, especially those thermal management in electronic devices and systems. Highlighted this review recent advances the effort to improve in-plane transport performance polymer/BNNs also growing research activities aimed at enhanced cross-plane or isotropic conductivity, various filler alignment strategies during composite fabrication explored. Also highlighted discussed some significant challenges major opportunities further development materials their mechanistic understandings.

Язык: Английский

Процитировано

2
Enhanced Thermal Management in Microelectronics Packaging With 2D h‐BN Nanocomposite Underfills DOI Creative Commons

S. A. Razgaleh,

Shyam Aravamudhan

Nano Select, Год журнала: 2024, Номер unknown

Опубликована: Авг. 8, 2024

ABSTRACT The quest for faster and more densely packed microelectronic circuits has necessitated significant advancements in thermal management encapsulant manufacturing technologies. This pursuit driven the development of innovative methods to enhance heat flux transfer microelectronics packaging. A critical issue is stress induced by coefficient expansion (CTE) mismatch between chip substrate, threatening chip's mechanical integrity lifespan. To address this challenge, there a growing emphasis on using underfills improve dissipation. current study focuses hexagonal boron nitride (h‐BN) nanofillers robust support deploys epoxy adhesives integrate nanofillers, where precise dispersion crucial optimizing properties. Findings show 1500‐ 500‐nm h‐BN axial conductivity diffusivity linearly with filler content, while 70‐nm plateaus at 3% volume. demonstrates superior radial performance.

Язык: Английский

Процитировано

1
Enhanced thermal conductivity of polypropylene/polyamide 6 composites via optimizing the selective distribution of h‐BN and NH2‐CNTs hybrid fillers within the co‐continuous structure DOI

Xinyi Jing,

Linggong Meng,

Tong Liu

и другие.

Polymer Composites, Год журнала: 2024, Номер 45(17), С. 15968 - 15982

Опубликована: Авг. 15, 2024

Abstract Achieving high thermal conductivity in composites with low filler content is a major challenge current research. In this paper, polypropylene (PP) and polyamide 6 (PA6) were used as polymer matrix, the hybrid conductive filler, formed by hexagonal boron nitride (h‐BN) aminated carbon nanotubes (NH 2 ‐CNTs), was integrated into matrix for fabrication of (PP/PA6/h‐BN PP/PA6/h‐BN@CNTs) via two‐step melt blending technology. The fillers selectively distributed phase co‐continuous structure, forming path three‐dimensional network structure. results show that when h‐BN reaches 25 wt%, PP/PA6/h‐BN PP/PA6/h‐BN@CNTs 199% 300% higher than PP/PA6, respectively. Through testing volume resistivity composites, it confirmed maintain good electrical insulation. Both demonstrated remarkable outstanding This research provides facile way to prepare highly excellent processing performances Highlights h‐BN@CNTs sandwich structure prepared. A method control selective distribution collective. conductivity, insulation favorable performances.

Язык: Английский

Процитировано

0