Nanostructured compliant interconnections for advanced Micro-Electronic packaging DOI Creative Commons

Waqas Saeed,

Zhongyu Liu,

Rubin Yan

и другие.

Materials & Design, Год журнала: 2024, Номер 244, С. 113166 - 113166

Опубликована: Июль 14, 2024

The continuous drive for miniaturization and enhanced functionality in micro-electronic devices demands highly integrated circuit (IC) packaging. This trend leads to a dense network of packaging interconnections, facilitated by the reduction traditional solder interconnection sizes. However, these advancements bring about significant challenges, including thermal expansion differences between materials used package presence non-planar substrates. Such issues can lead thermomechanical stresses interconnections warpage, resulting serious reliability issues. In response, nanostructured compliant have emerged as promising solution. These effectively manage variations substrate non-coplanarity, mitigating risks associated with high integration IC review explores latest trends developing modern micro-electronics. focus is on integrating various materials, nanoparticles (via sintering), nanoporous nanowires (NWs) carbon nanotubes (CNTs). aims improve performance mechanical under extreme loading conditions. Advanced bonding techniques their impacts are also discussed. Additionally, study provides insights into future developments guiding researchers toward specific technical areas exploration.

Язык: Английский

Nanostructured compliant interconnections for advanced Micro-Electronic packaging DOI Creative Commons

Waqas Saeed,

Zhongyu Liu,

Rubin Yan

и другие.

Materials & Design, Год журнала: 2024, Номер 244, С. 113166 - 113166

Опубликована: Июль 14, 2024

The continuous drive for miniaturization and enhanced functionality in micro-electronic devices demands highly integrated circuit (IC) packaging. This trend leads to a dense network of packaging interconnections, facilitated by the reduction traditional solder interconnection sizes. However, these advancements bring about significant challenges, including thermal expansion differences between materials used package presence non-planar substrates. Such issues can lead thermomechanical stresses interconnections warpage, resulting serious reliability issues. In response, nanostructured compliant have emerged as promising solution. These effectively manage variations substrate non-coplanarity, mitigating risks associated with high integration IC review explores latest trends developing modern micro-electronics. focus is on integrating various materials, nanoparticles (via sintering), nanoporous nanowires (NWs) carbon nanotubes (CNTs). aims improve performance mechanical under extreme loading conditions. Advanced bonding techniques their impacts are also discussed. Additionally, study provides insights into future developments guiding researchers toward specific technical areas exploration.

Язык: Английский

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