Development of Flexible Electronic Interlayer Material: Advancing by Protein‐Based Interfacial Adhesion

Advanced Engineering Materials, Год журнала: 2025, Номер unknown

Опубликована: Март 28, 2025

Flexible electronic devices have garnered significant attention due to their broad applications in skin, flexible displays, wearable devices, and biomedical systems. However, the inherent chemical mechanical mismatches between metal coatings polymer substrates these often result interface misalignment, which severely compromises stability. Moreover, frequent repeated use causes stress conductive layer exceed its fracture limit, leading cracks that reduce device sensitivity. To overcome challenges drive advancements surface modification using amyloid‐like proteins has emerged as a promising approach enhance both stability functionality. This article reviews design criteria for interfacial adhesion materials highlights latest developments incorporating protein‐based aggregates. It begins with brief introduction of materials, followed by an in‐depth discussion fundamentals aggregation, including structure, formation processes, strategies vitro construction, adhesive properties. Finally, recent progress aggregates technique sensors, batteries is discussed, offering valuable insights guidelines achieving high‐performance enhanced sensitivity, structural stability, robust adhesion.

Язык: Английский

4D-printable photocurable pressure sensitive adhesives derived from waste cooking oil

Virtual and Physical Prototyping, Год журнала: 2025, Номер 20(1)

Опубликована: Май 18, 2025

Язык: Английский