Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption

Angewandte Chemie International Edition, Год журнала: 2024, Номер 63(17)

Опубликована: Фев. 9, 2024

The development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application 5G communication technology military fields. This work uses aramid nanofibers (ANF) as matrix, hetero-structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by situ growth fillers, which are combined to fabricate sandwich structured electrically insulating (BNNS/ANF)-(AgNWs@BNNS)-(BNNS/ANF) (denoted BAB) composite films "filtration self-assembly, air spraying, hot-pressing" method. When mass ratio AgNWs@BNNS BNNS is 1 : total fraction 50 wt %, BAB film maximum in-plane thermal conductivity coefficient (λ

Язык: Английский

---

Effect of the Structure of Epoxy Monomers and Curing Agents: Toward Making Intrinsically Highly Thermally Conductive and Low-Dielectric Epoxy Resins

JACS Au, Год журнала: 2023, Номер 3(12), С. 3424 - 3435

Опубликована: Ноя. 28, 2023

The low intrinsic thermal conduction and high dielectric properties of epoxy resins have significantly limited their applications in electrical electronic devices with integration, frequency, power, miniaturization. Herein, a liquid crystalline (LCE) monomer biphenyl mesogenic unit was first synthesized through an efficient one-step reaction. Subsequently, bisphenol AF (BPAF) containing low-polarizable −CF3 groups 4,4′-diaminodiphenylmethane (DDM) were applied to cure the LCE commercial diglycidyl ether A-type (E-51), respectively, afford four kinds various conductivity dielectricity values. Owing dual effect microscopically stacking mesogens contribution fluorine formation crystallinity, ordered microstructures nematic crystal phase formed within cross-linking network as confirmed by polarized optical microscopy X-ray diffraction. Consequently, phonon scattering suppressed, improved considerably 0.38 W/(m·K), nearly twice that E-51 cured DDM (0.20 W/(m·K)). Additionally, microstructure ultralow polar BPAF enabled resin exhibit remarkably lower stable constant (ε) loss tangent (tan δ) over both frequencies compared DDM. ε decreased from 3.40 2.72 while tan δ 0.044 0.038 at 10 GHz. This work presents scalable facile strategy for breaking bottleneck making simultaneously inherent performance.

Язык: Английский

---

Green segregated honeycomb biopolymer composites for electromagnetic interference shielding biomedical devices

Chemical Engineering Journal, Год журнала: 2024, Номер 493, С. 152438 - 152438

Опубликована: Май 21, 2024

Язык: Английский

---

Recent progress on general wearable electrical heating textiles enabled by functional fibers

Nano Energy, Год журнала: 2024, Номер 124, С. 109497 - 109497

Опубликована: Март 16, 2024

Язык: Английский

---

Polymer composites with high thermal conductivity: Theory, simulation, structure and interfacial regulation

Progress in Materials Science, Год журнала: 2024, Номер 148, С. 101362 - 101362

Опубликована: Сен. 8, 2024

Язык: Английский

---

Thermally Conductive and UV-EMI Shielding Electronic Textiles for Unrestricted and Multifaceted Health Monitoring

Nano-Micro Letters, Год журнала: 2024, Номер 16(1)

Опубликована: Май 21, 2024

Skin-attachable electronics have garnered considerable research attention in health monitoring and artificial intelligence domains, whereas susceptibility to electromagnetic interference (EMI), heat accumulation issues, ultraviolet (UV)-induced aging problems pose significant constraints on their potential applications. Here, an ultra-elastic, highly breathable, thermal-comfortable epidermal sensor with exceptional UV-EMI shielding performance remarkable thermal conductivity is developed for high-fidelity of multiple human electrophysiological signals. Via filling the elastomeric microfibers thermally conductive boron nitride nanoparticles bridging insulating fiber interfaces by plating Ag (NPs), interwoven conducting network (0.72 W m

Язык: Английский

---

2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

Advanced Materials, Год журнала: 2024, Номер unknown

Опубликована: Июнь 7, 2024

Abstract The challenges associated with heat dissipation in high‐power electronic devices used communication, new energy, and aerospace equipment have spurred an urgent need for high‐performance thermal interface materials (TIMs) to establish efficient transfer pathways from the heater (chip) sinks. Recently, emerging 2D materials, such as graphene boron nitride, renowned their ultrahigh basal‐plane conductivity capacity facilitate cross‐scale, multi‐morphic structural design, found widespread use fillers production of TIMs. To deepen understanding material‐based TIMs, this review focuses primarily on nitride‐based exploring structures, properties, applications. Building foundation, developmental history these TIMs is emphasized a detailed analysis critical potential solutions provided. Additionally, preparation application some other novel materials‐based are briefly introduced, aiming offer constructive guidance future development

Язык: Английский

---

Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method

Journal of Materials Science Materials in Electronics, Год журнала: 2024, Номер 35(15)

Опубликована: Май 1, 2024

Abstract With the development of microelectronics towards integration, miniaturization and high power, accumulation heat in this small space has become a serious problem. Therefore, polymer matrix composites with thermal conductivity electrical insulation need to be developed urgently. Here, an ordered oriented boron nitride/silicon dioxide (silica) coated multiwalled carbon nanotubes (BN/SiO 2 @MWCNTs) thermally conductive network was constructed polyvinylidene fluoride (PVDF) by electrostatic spinning technique, subsequently PVDF were prepared hot-pressing. The synergistic effect two-dimensional BN one-dimensional MWCNTs investigated. It found that out-of-plane 30 /SiO @MWCNTs reached 0.4693 Wm −1 K , which 209% higher than pure 10% BN/PVDF composites. in-plane @MWCNts) 1.5642 1055% 40% This is attributed on SiO @MWCNTs. Meanwhile, volume resistivity breakdown strength BN/SiO @MWCNTs/PVDF 3.6 × 10 13 Ω m 47.68 kV/mm, respectively. results indicate have excellent insulating properties, are promising for applications.

Язык: Английский

---

Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption

Angewandte Chemie, Год журнала: 2024, Номер 136(17)

Опубликована: Фев. 9, 2024

Abstract The development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application 5G communication technology military fields. This work uses aramid nanofibers (ANF) as matrix, hetero‐structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by situ growth fillers, which are combined to fabricate sandwich structured electrically insulating (BNNS/ANF)‐(AgNWs@BNNS)‐(BNNS/ANF) (denoted BAB) composite films “filtration self‐assembly, air spraying, hot‐pressing” method. When mass ratio AgNWs@BNNS BNNS is 1 : total fraction 50 wt %, BAB film maximum in‐plane thermal conductivity coefficient ( λ ∥ 10.36 W/(m ⋅ K)), excellent electrical insulation (breakdown strength volume resistivity 41.5 kV/mm 1.21×10 15 Ω cm, respectively) mechanical properties (tensile 170.9 MPa). % could efficiently reduce equilibrium temperature central processing unit (CPU) working at full power, resulting 7.0 °C lower than CPU solely integrated ANF directly. In addition, boasts adaptive dual on cement roads jungle environments, well function fast QR code within 24 seconds.

Язык: Английский

---

A Novel Thermal Interface Material Composed of Vertically Aligned Boron Nitride and Graphite Films for Ultrahigh Through‐Plane Thermal Conductivity

Small Methods, Год журнала: 2024, Номер unknown

Опубликована: Март 20, 2024

Abstract The relentless drive toward miniaturization in microelectronic devices has sparked an urgent need for materials that offer both high thermal conductivity (TC) and excellent electrical insulation. Thermal interface (TIMs) possessing these dual attributes are highly sought after modern electronics, but achieving such a combination proven to be formidable challenge. In this study, cutting‐edge solution is presented by developing boron nitride (BN) graphite films layered silicone rubber composites with exceptional TC insulation properties. Through carefully devised stacking‐cutting method, the orientation degree of BN successfully preserved, resulting unprecedented through‐plane 23.7 Wm −1 K remarkably low compressive modulus 4.85 MPa. Furthermore, properties composites, including resistance resilience rate, make them reliable durable option various applications. Practical tests demonstrate their outstanding heat dissipation performance, significantly reducing CPU temperatures computer cooling system. This research work unveils possible upper limit BN‐based TIMs paves way large‐scale practical implementation, particularly management next‐generation electronic devices.

Язык: Английский

---