Polymers,
Год журнала:
2024,
Номер
16(3), С. 432 - 432
Опубликована: Фев. 4, 2024
This
study
explores
the
potential
of
novel
boron
nitride
(BN)
microplatelet
composites
with
combined
thermal
conduction
and
electrical
insulation
properties.
These
are
manufactured
through
Fusion
Deposition
Modeling
(FDM),
their
application
for
management
in
electronic
devices
is
demonstrated.
The
primary
focus
this
work
is,
therefore,
investigation
thermoplastic
composite
properties
to
show
3D
printing
lightweight
polymeric
heat
sinks
remarkable
performance.
By
comparing
various
microfillers,
including
BN
MgO
particles,
effects
on
material
alignment
within
polymer
matrix
during
filament
fabrication
FDM
processing
analyzed.
characterization
includes
evaluation
morphology,
conductivity,
mechanical
Particularly,
a
32
wt%
microplatelets
shows
an
in-plane
conductivity
1.97
W
m-1
K-1,
offering
excellent
printability.
To
assess
practical
applications,
pin
fin
using
these
designed
printed.
Their
performance
evaluated
via
thermography
under
different
heating
conditions.
findings
very
promising
efficient
cost-effective
devices,
which
can
be
obtained
extrusion-based
Additive
Manufacturing
(AM),
such
as
FDM,
exploited
enhanced
solutions
devices.
Nanomaterials,
Год журнала:
2024,
Номер
14(4), С. 331 - 331
Опубликована: Фев. 7, 2024
With
the
integration
and
miniaturization
of
chips,
there
is
an
increasing
demand
for
improved
heat
dissipation.
However,
low
thermal
conductivity
(TC)
polymers,
which
are
commonly
used
in
chip
packaging,
has
seriously
limited
development
chips.
To
address
this
limitation,
researchers
have
recently
shown
considerable
interest
incorporating
high-TC
fillers
into
polymers
to
fabricate
thermally
conductive
composites.
Hexagonal
boron
nitride
(h-BN)
emerged
as
a
promising
filler
candidate
due
its
excellent
electrical
insulation.
This
review
comprehensively
outlines
design
strategies
using
h-BN
covers
intrinsic
TC
morphology
effects,
functionalization
methods,
construction
three-dimensional
(3D)
conduction
networks.
Additionally,
it
introduces
some
experimental
measurement
techniques
composites
theoretical
computational
simulations
composite
design.
Finally,
summarizes
effective
possible
challenges
fillers.
provides
field
polymeric
with
comprehensive
understanding
constructive
guidance
on
Journal of Polymer Science,
Год журнала:
2024,
Номер
62(11), С. 2410 - 2442
Опубликована: Март 13, 2024
Abstract
With
the
development
of
high
power‐density
electronic
devices
on
smaller
scales
and
emerging
new
energy
vehicles,
thermal
conductive
materials
have
attracted
more
attention
for
better
management
to
adapt
various
applications.
By
combining
both
advantages
polymer
thermally
fillers,
composite
are
widely
used
in
packaging
protection
their
mechanical
robustness,
conductivity,
excellent
insulation
properties,
heat
resistance,
chemical
resistance.
In
this
review,
first,
basic
theory
conduction
composites
is
discussed.
Second,
according
classification
composition
polymer,
filled
material
emphatically
introduced.
paper,
construction
process
a
network
discussed
from
perspective
processing.
The
simple
includes
core‐shell
structure,
external
force
orientation,
electrostatic
spinning,
spraying,
induced
vacuum‐assisted
filtration.
three‐dimensional
conductivity
can
be
constructed
using
self‐assembly
template
methods.
From
above
processing
methods,
paper
analyzes
how
effectively
improve
achieve
goal
properties
under
low
filling.
After
that,
contribution
filler
modification
explained
detail.
Finally,
future
research
direction
functionalization
prospected.
Polymers,
Год журнала:
2024,
Номер
16(3), С. 432 - 432
Опубликована: Фев. 4, 2024
This
study
explores
the
potential
of
novel
boron
nitride
(BN)
microplatelet
composites
with
combined
thermal
conduction
and
electrical
insulation
properties.
These
are
manufactured
through
Fusion
Deposition
Modeling
(FDM),
their
application
for
management
in
electronic
devices
is
demonstrated.
The
primary
focus
this
work
is,
therefore,
investigation
thermoplastic
composite
properties
to
show
3D
printing
lightweight
polymeric
heat
sinks
remarkable
performance.
By
comparing
various
microfillers,
including
BN
MgO
particles,
effects
on
material
alignment
within
polymer
matrix
during
filament
fabrication
FDM
processing
analyzed.
characterization
includes
evaluation
morphology,
conductivity,
mechanical
Particularly,
a
32
wt%
microplatelets
shows
an
in-plane
conductivity
1.97
W
m-1
K-1,
offering
excellent
printability.
To
assess
practical
applications,
pin
fin
using
these
designed
printed.
Their
performance
evaluated
via
thermography
under
different
heating
conditions.
findings
very
promising
efficient
cost-effective
devices,
which
can
be
obtained
extrusion-based
Additive
Manufacturing
(AM),
such
as
FDM,
exploited
enhanced
solutions
devices.
