Robust and tough polyamide hot-melt adhesives inspired by intersecting structures of plant cell walls and cytoplasm: Design for environmental adaptability DOI
Huajun Sun,

Kangbo Yang,

Nan Xiang

и другие.

Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 162564 - 162564

Опубликована: Апрель 1, 2025

Язык: Английский

Robust and tough polyamide hot-melt adhesives inspired by intersecting structures of plant cell walls and cytoplasm: Design for environmental adaptability DOI
Huajun Sun,

Kangbo Yang,

Nan Xiang

и другие.

Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 162564 - 162564

Опубликована: Апрель 1, 2025

Язык: Английский

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