Robust and tough polyamide hot-melt adhesives inspired by intersecting structures of plant cell walls and cytoplasm: Design for environmental adaptability DOI
Huajun Sun,

Kangbo Yang,

Nan Xiang

et al.

Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: unknown, P. 162564 - 162564

Published: April 1, 2025

Language: Английский

Robust and tough polyamide hot-melt adhesives inspired by intersecting structures of plant cell walls and cytoplasm: Design for environmental adaptability DOI
Huajun Sun,

Kangbo Yang,

Nan Xiang

et al.

Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: unknown, P. 162564 - 162564

Published: April 1, 2025

Language: Английский

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