Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption

Science Bulletin, Год журнала: 2023, Номер 68(11), С. 1195 - 1212

Опубликована: Май 2, 2023

Язык: Английский

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A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

Advanced Functional Materials, Год журнала: 2023, Номер 33(36)

Опубликована: Июнь 15, 2023

Abstract Recently, the need for miniaturization and high integration have steered a strong technical wave in developing (micro‐)electronic devices. However, excessive amounts of heat may be generated during operation/charging, severely affecting device performance leading to life/property loss. Benefiting from their low density, easy processing manufacturing cost, thermally conductive polymer composites become research hotspot mitigate disadvantage heat, with potential applications 5G communication, electronic packaging energy transmission. By far, reported thermal conductivity coefficient (λ) composite is far expectation. Deeper understanding transfer mechanism desired next generation composites. This review holistically scopes current advances this field, while giving special attention critical factors that affect as well conduction mechanisms on how enhance λ value. covers such interfacial resistance, chain structure polymer, intrinsic value different fillers, orientation/configuration nanoparticles, 3D interconnected networks, technology, etc. The devices are summarized. existing problems also discussed, new challenges opportunities prospected.

Язык: Английский

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Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption

Angewandte Chemie International Edition, Год журнала: 2024, Номер 63(17)

Опубликована: Фев. 9, 2024

The development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application 5G communication technology military fields. This work uses aramid nanofibers (ANF) as matrix, hetero-structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by situ growth fillers, which are combined to fabricate sandwich structured electrically insulating (BNNS/ANF)-(AgNWs@BNNS)-(BNNS/ANF) (denoted BAB) composite films "filtration self-assembly, air spraying, hot-pressing" method. When mass ratio AgNWs@BNNS BNNS is 1 : total fraction 50 wt %, BAB film maximum in-plane thermal conductivity coefficient (λ

Язык: Английский

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Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy

Advanced Functional Materials, Год журнала: 2023, Номер 33(14)

Опубликована: Янв. 22, 2023

Abstract For advanced thermal interface materials (TIMs), massive inorganic addition for high isotropic conductivities conflicts with suitable rheological viscosity low contact resistance. Traditional strategies rarely resolve such a contradiction, and it remains an academic industrial challenge. Herein, inspired by the structure function of bone joint, best‐of‐both‐worlds approach is reported that endows standard polydimethylsiloxane/alumina (PDMS/Al 2 O 3 ) TIM simultaneously enhanced mobility conductivity. It conducted employing morphology‐controllable gallium‐based liquid metal (LM) to surface Al scalable mechanochemical process. At typical polymer‐LM‐Al interface, LM droplets cohesive energy can release freedom macromolecular chain relaxation reduce viscosity, successfully allowing high‐loading TIMs (79 vol.%) keep thixotropic state effectively reducing its resistance copper substrate 65%. same time, adjacent LMs merge thermally bridge separate particles, which facilitates interfacial conduction enhances conductivity from 5.9 6.7 W m −1 K . Along additional electrical insulation, this filler modification strategy believed inspire others develop high‐performance polymer‐based future electronics.

Язык: Английский

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Self-standing boron nitride bulks enabled by liquid metals for thermal management

Materials Horizons, Год журнала: 2023, Номер 10(12), С. 5656 - 5665

Опубликована: Янв. 1, 2023

Thermally conductive materials (TCMs) are highly desirable for thermal management applications to tackle the "overheating" concerns in electronics industry. Despite recent progress, development of high performance TCMs integrated with an in-plane conductivity (TC) higher than 50.0 W (m K)-1 and a through-plane TC greater 10.0 is still challenging. Herein, self-standing liquid metal@boron nitride (LM@BN) bulks ultrahigh were reported first time. In LM@BN bulks, LM could serve as bonding linker among oriented BN platelets, thus remarkably accelerating heat transfer across whole system. Benefiting from formation unique structure, bulk achieved 82.2 20.6 K)-1, which highest values ever TCMs. Furthermore, exhibited superior compressive leakage-free performances, strength (5.2 MPa) without any leakage even after being crushed. It was also demonstrated that excellent TCs made them effectively cool high-power light emitting diode modules. This work opens up one promising pathway high-performance

Язык: Английский

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Vertically aligned carbon fibers-penetrated phase change thermal interface materials with high thermal conductivity for chip heat dissipation

Applied Thermal Engineering, Год журнала: 2023, Номер 230, С. 120807 - 120807

Опубликована: Май 19, 2023

Язык: Английский

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Fabrication of flexible multifunctional graphene-based composite membrane with improved hydrophobicity and thermal conductivity characters for thermal management

Colloids and Surfaces A Physicochemical and Engineering Aspects, Год журнала: 2024, Номер unknown, С. 135494 - 135494

Опубликована: Окт. 1, 2024

Язык: Английский

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Polymer composites with high thermal conductivity: Theory, simulation, structure and interfacial regulation

Progress in Materials Science, Год журнала: 2024, Номер 148, С. 101362 - 101362

Опубликована: Сен. 8, 2024

Язык: Английский

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2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

Advanced Materials, Год журнала: 2024, Номер unknown

Опубликована: Июнь 7, 2024

Abstract The challenges associated with heat dissipation in high‐power electronic devices used communication, new energy, and aerospace equipment have spurred an urgent need for high‐performance thermal interface materials (TIMs) to establish efficient transfer pathways from the heater (chip) sinks. Recently, emerging 2D materials, such as graphene boron nitride, renowned their ultrahigh basal‐plane conductivity capacity facilitate cross‐scale, multi‐morphic structural design, found widespread use fillers production of TIMs. To deepen understanding material‐based TIMs, this review focuses primarily on nitride‐based exploring structures, properties, applications. Building foundation, developmental history these TIMs is emphasized a detailed analysis critical potential solutions provided. Additionally, preparation application some other novel materials‐based are briefly introduced, aiming offer constructive guidance future development

Язык: Английский

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MOF decorated boron nitride/natural rubber composites with heterostructure for thermal management application through dual passive cooling modes base on the improved thermal conductivity and water sorption-desorption process

Composites Science and Technology, Год журнала: 2024, Номер 248, С. 110469 - 110469

Опубликована: Янв. 29, 2024

Язык: Английский

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