Polymer Engineering and Science,
Год журнала:
2024,
Номер
unknown
Опубликована: Ноя. 14, 2024
Abstract
The
present
research
investigated
the
properties
of
epoxy
resin
nanocomposites
containing
POSS
and
silica
nanoparticles
modified
by
chitosan
effect
type
weight
percent
on
nanocomposites.
modification
(CS)
improved
mechanical
thermal
performance
nanocomposites,
as
evidenced
higher
tensile
strength,
stability,
ash
content.
At
1
wt.%
POSS,
incorporation
resulted
in
Young's
modulus
417
MPa,
value
717
MPa
was
obtained
when
CS
used.
Also,
9.48%,
while
11.73%.
curing
behavior
also
influenced
heating
rate
nanoparticle
According
to
cure
index
calculations,
all
nanocomposite
samples
showed
excellent
cure.
exhibited
increased
hydrophobicity
with
polyhedral
oligomeric
silsesquioxanes
(POSS)
content,
which
could
reduce
susceptibility
bacterial
microbial
contamination.
morphology
revealed
that
fracture
toughness
dispersion
matrix.
results
indicated
surface
optimize
adjusting
content
nanoparticles,
coatings
have
potential
applications
biomedicine.
Highlights
Silica
were
successfully
chitosan.
distribution
Nanoparticle
at
lower
presence
contact
angle
from
60°
81°.
Thermal
stability
designed
system.
Chemical Reviews,
Год журнала:
2024,
Номер
124(12), С. 7674 - 7711
Опубликована: Июнь 7, 2024
The
development
of
microelectronics
and
large-scale
intelligence
nowadays
promotes
the
integration,
miniaturization,
multifunctionality
electronic
devices
but
also
leads
to
increment
signal
transmission
delays,
crosstalk,
energy
consumption.
exploitation
materials
with
low
permittivity
(low-
Advanced Functional Materials,
Год журнала:
2025,
Номер
unknown
Опубликована: Янв. 31, 2025
Abstract
With
the
rapid
increase
in
demand
for
next‐generation
communication,
development
of
advanced
dielectric
materials
has
become
imperative.
To
enhance
performance
and
reliability
miniaturized
electronic
devices,
must
exhibit
high
thermal
conductivity
(λ)
while
simultaneously
fulfilling
crucial
criteria
such
as
low
permittivity
(
D
k
)
loss
f
).
The
synthesis
novel
polymers
(LDPs)
is
newly
reported
by
integrating
fused
aromatic
mesogens
siloxane
functions
with
silane
linkers.
Fused
mesogenic
building
blocks
undergo
crosslinking
via
hydrosilylation
octavinylsilsesquioxane
(OVS).
resulting
LDPs
excellent
properties
1.79
a
0.004)
along
λ
(0.89
W
m
−1
K
cold
crystallization
governs
their
molecular
packing
structure,
which
controls
electron
alignment
phonon
transfer.
A
comprehensive
understanding
interplay
between
structure
allows
precise
tuning
signal
transmission
heat
conduction
polymers.
Furthermore,
reprocessable
recyclable
nature
highlights
potential
highly
effective
environmentally
sustainable
applications.
Molecules,
Год журнала:
2025,
Номер
30(5), С. 1113 - 1113
Опубликована: Фев. 28, 2025
In
order
to
improve
the
dielectric
properties
of
existing
thermosetting
resins,
taking
advantage
reactive
fillers
is
a
simple
and
feasible
option.
this
paper,
we
synthesized
new
double
epoxycyclohexane
double-decker
silsesquioxane
(DEDDSQ),
in
which
structure
aliphatic
epoxy
resin
introduced
into
DDSQ
successfully,
resulting
DEDDESQ
confirmed
by
Fourier
transform
infrared
(FTIR),
nuclear
magnetic
resonance
(NMR)
spectroscopy,
mass
spectrometry
(MS).
Cyanate
ester
was
selected
as
case
study
for
application
DEDDSQ
fillers.
A
CE/E51/DEDDSQ
nanocomposite
fabricated
incorporating
small
proportion
E51
cyanate
enhance
its
comprehensive
properties.
X-ray
diffraction
(XRD)
energy-dispersive
spectroscopy
(EDS)
analyses
demonstrated
that
dispersed
uniformly
within
matrix.
Dynamic
mechanical
analysis
(DMA)
CE/E51/8.0DEDDSQ
nanocomposites
exhibit
excellent
thermal
The
glass
transition
temperature
(Tg)
measured
be
264
°C,
indicating
stability.
Dielectric
property
measurements
showed
addition
reduced
constant
resin,
with
CE/E51/8.0DEPOSS
exhibiting
2.47
at
1
MHz.
