ACS Applied Electronic Materials,
Год журнала:
2024,
Номер
unknown
Опубликована: Дек. 17, 2024
With
the
rapid
advancement
of
artificial
intelligence,
smart
sensing
technologies,
and
batteries
with
high
power
density,
thermal
management
has
become
a
critical
issue
for
electronic
devices.
Phase
change
materials
(PCMs)
offer
promising
applications
in
management.
However,
it
is
significant
challenge
to
fabricate
PCMs
conductivity
(TC)
electromagnetic
interference
shielding
effectiveness
(EMI
SE)
while
maintaining
leakage-free
performance.
This
work
reports
solid–solid
phase
composites
TC
EMI
SE
enabled
by
covalent
functionalization
quasi-hyperbolic
framework.
The
material
(OP)
synthesized
via
nucleophilic
ring-opening
reaction
epoxy
groups,
where
octadecanol
(OD)
grafted
onto
side
chains
polyethylene-co-methyl
acrylate-co-glycidyl
methacrylate
(PEMAGMA).
Subsequently,
filled
into
electrochemically
expanded
graphite
(EEG)
framework
through
vacuum
filtration,
which
EEG
produced
using
an
electrochemical
expansion
method
SE.
obtained
OP/EEG
exhibited
excellent
properties,
including
very
low
leakage
(0.6%),
latent
heat
(86.45
J/g),
ultrahigh
(22.6
W/(m·K)),
superior
(110.28
dB).
shows
great
potential
improving
transfer
efficiency
interface
(TIMs)
practical
applications,
demonstrating
outlook
field
Nano-Micro Letters,
Год журнала:
2025,
Номер
17(1)
Опубликована: Фев. 6, 2025
Abstract
A
series
of
divinylphenyl-acryloyl
chloride
copolymers
(PDVB-
co
-PACl)
is
synthesized
via
atom
transfer
radical
polymerization
employing
tert-butyl
acrylate
and
divinylbenzene
as
monomers.
PDVB-
-PACl
utilized
to
graft
on
the
surface
spherical
aluminum
nitride
(AlN)
prepare
functionalized
AlN
(AlN@PDVB-
-PACl).
Polymethylhydrosiloxane
(PMHS)
then
used
matrix
thermally
conductive
AlN@PDVB-
-PACl/PMHS
composites
with
fillers
through
blending
curing.
The
grafting
synchronously
enhances
hydrolysis
resistance
its
interfacial
compatibility
PMHS
matrix.
When
molecular
weight
5100
g
mol
−1
density
0.8
wt%,
containing
75
wt%
exhibit
optimal
comprehensive
performance.
thermal
conductivity
(
λ
)
composite
1.14
W
m
K
,
which
by
20%
420%
compared
simply
physically
blended
AlN/PMHS
pure
PMHS,
respectively.
Meanwhile,
display
remarkable
hydrothermal
aging
retaining
99.1%
after
soaking
in
90
°C
deionized
water
for
80
h,
whereas
decreases
sharply
93.7%.
Abstract
The
miniaturization,
integration,
and
high
data
throughput
of
electronic
chips
present
challenging
demands
on
thermal
management,
especially
concerning
heat
dissipation
at
interfaces,
which
is
a
fundamental
scientific
question
as
well
an
engineering
problem—a
death
problem
called
in
semiconductor
industry.
A
comprehensive
examination
interfacial
resistance
has
been
given
from
physics
perspective
2022
Review
Modern
Physics
.
Here,
we
provide
detailed
overview
materials
perspective,
focusing
the
optimization
structure
compositions
interface
(TIMs)
interact/contact
with
source
sink.
First,
discuss
impact
conductivity,
bond
line
thickness,
contact
TIMs.
Second,
it
pointed
out
that
there
are
two
major
routes
to
improve
transfer
through
interface.
One
reduce
TIM's
(
R
TIM
)
TIMs
strategies
like
incorporating
conductive
fillers,
enhancing
treatment
techniques.
other
c
by
improving
effective
contact,
strengthening
bonding,
utilizing
mass
gradient
alleviate
vibrational
mismatch
between
source/sink.
Finally,
such
challenges
theories,
potential
developments
sustainable
TIMs,
application
AI
design
also
explored.
ACS Applied Polymer Materials,
Год журнала:
2024,
Номер
6(20), С. 12765 - 12773
Опубликована: Окт. 16, 2024
With
the
rapid
growth
and
widespread
adoption
of
cloud
services,
machine
learning,
artificial
intelligence,
thermal
interface
materials
have
become
increasingly
vital
for
efficient
management
in
electronic
devices.
However,
traditional
often
struggle
to
strike
a
delicate
balance
between
adhesion
performance
conductivity.
Here,
we
report
design
polymer
filler
networks
fabricate
material
consisting
polydimethylsiloxane/aluminum
fillers,
with
high
(adhesion
strength
3.30
±
0.26
MPa,
energy
913.2
152.71
J
m–2),
enhanced
conductivity
(5.24
W
m–1
K–1).
These
merit
properties
stem
from
optimization
both
polydimethylsiloxane
aluminum
through
adjustments
branching
point,
cross-linking
fraction,
mass
fraction.
We
envision
that
strategy
optimizing
can
be
adopted
development
desirable
multifunctionality.
Polymer Composites,
Год журнала:
2024,
Номер
unknown
Опубликована: Июнь 12, 2024
Abstract
The
multifunctional
composite
elastomers
serve
as
thermal
interface
materials
for
heat
dissipation
in
electronic
devices
when
their
transport
performance
is
enhanced.
common
method
enhancement,
continuously
raising
the
conductive
filler
loading
only
can
improve
conductivity
of
but
reduces
compliance,
resulting
elevated
contact
resistance
with
solid
surfaces,
compromising
transport.
To
address
this,
we
propose
grafting
short
dangling
chains
onto
elastomer
matrix
to
further
promote
compliance
under
a
certain
loading.
Characterization
results
demonstrate
that
grafted
effectively
reduce
relaxation
time,
enabling
faster
deformation
material
pressure.
This
approach
enhances
interfacial
compatibility,
widening
path
at
interfaces
by
94%
(from
17.8
1.07
mm
2
W/K),
significantly
improving
overall
Additionally,
discussed
feasibility
employing
efficient
chip
dissipation.
Highlight
softness.
softness
promotion
help
resistance.
A
series
theories
are
employed
learn
mechanisms
promotion.
be
used
materials.
ACS Applied Materials & Interfaces,
Год журнала:
2024,
Номер
16(45), С. 62961 - 62969
Опубликована: Окт. 29, 2024
In
recent
years,
adhesive
thermal
interface
materials
have
attracted
much
attention
because
of
their
reliable
adhesion
properties
on
most
substrates,
preventing
moisture,
vibration
impact,
or
chemical
corrosion
damage
to
components
and
equipment,
as
well
solving
the
heat
dissipation
problem.
However,
a
huge
contradiction
between
strong
high
conductivity.
Here,
we
report
polymer-based
material
consisting
polydimethylsiloxane/spherical
aluminum
fillers,
which
possesses
both
(adhesion
strength
3.59
MPa
toughness
1673
J
m–2
enhanced
conductivity
3.90
W
m–1
K–1).
These
excellent
are
attributed
modified
chain
structure
by
introducing
acrylate
accelerators
into
polydimethylsiloxane
network,
thereby
striking
balance
interfacial
intrinsic
dissipation.
The
addition
thermally
conductive
fillers
not
only
increases
but
also
improves
bulk
energy
material.
This
work
provides
novel
strategy
for
designing
material,
leading
new
ideas
in
long-term
applications
high-power
electronics.
