Thermal interface materials: From fundamental research to applications
SusMat,
Год журнала:
2024,
Номер
unknown
Опубликована: Сен. 23, 2024
Abstract
The
miniaturization,
integration,
and
high
data
throughput
of
electronic
chips
present
challenging
demands
on
thermal
management,
especially
concerning
heat
dissipation
at
interfaces,
which
is
a
fundamental
scientific
question
as
well
an
engineering
problem—a
death
problem
called
in
semiconductor
industry.
A
comprehensive
examination
interfacial
resistance
has
been
given
from
physics
perspective
2022
Review
Modern
Physics
.
Here,
we
provide
detailed
overview
materials
perspective,
focusing
the
optimization
structure
compositions
interface
(TIMs)
interact/contact
with
source
sink.
First,
discuss
impact
conductivity,
bond
line
thickness,
contact
TIMs.
Second,
it
pointed
out
that
there
are
two
major
routes
to
improve
transfer
through
interface.
One
reduce
TIM's
(
R
TIM
)
TIMs
strategies
like
incorporating
conductive
fillers,
enhancing
treatment
techniques.
other
c
by
improving
effective
contact,
strengthening
bonding,
utilizing
mass
gradient
alleviate
vibrational
mismatch
between
source/sink.
Finally,
such
challenges
theories,
potential
developments
sustainable
TIMs,
application
AI
design
also
explored.
Язык: Английский
The effect originated from atomic vibration on thermal transport in diatomic semiconductors via ab initio molecular dynamics
Nanoscale,
Год журнала:
2025,
Номер
unknown
Опубликована: Янв. 1, 2025
Based
on
AIMD
methods,
temperature
and
velocity
statistics
of
diatomic
semiconductors
are
classified
by
atomic
species,
facilitating
the
understanding
their
electronic
properties
at
finite
temperatures.
Язык: Английский
Excellent mechanical and thermal conductivity performance of polyvinyl alcohol film doped SiO2@Ti3C2Tx MXene via electrostatic nano-particle assembly
Colloids and Surfaces A Physicochemical and Engineering Aspects,
Год журнала:
2025,
Номер
713, С. 136507 - 136507
Опубликована: Фев. 25, 2025
Язык: Английский
Soft, Tough, Antifatigue Fracture Elastomer Composites with Low Thermal Resistance through Synergistic Crack Pinning and Interfacial Slippage
Advanced Materials,
Год журнала:
2024,
Номер
unknown
Опубликована: Июль 30, 2024
Soft
elastomer
composites
are
promising
functional
materials
for
engineer
interfaces,
where
the
miniaturized
electronic
devices
have
triggered
increasing
demand
effective
heat
dissipation,
high
fracture
energy,
and
antifatigue
fracture.
However,
such
a
combination
of
these
properties
can
be
rarely
met
in
same
simultaneously.
Here
strategy
is
presented
to
fabricate
soft,
extreme
tough
(3316
J
m
Язык: Английский
Fluorinated boron nitride nanosheets for high thermal conductivity and low dielectric constant silicone rubber composites
Polymer Composites,
Год журнала:
2024,
Номер
unknown
Опубликована: Сен. 9, 2024
Abstract
Increasing
miniaturization
and
integration
of
microelectronic
devices
have
led
to
an
unprecedented
attention
on
heat
dissipation
signal
transmission
electronic
equipment.
However,
the
mostly
used
method
enhance
thermal
conductivity
polymers
by
adding
thermally
conductive
fillers
usually
results
in
increase
dielectric
constant
(D
k
).
It
was
still
challenging
synergistically
achieve
low
D
high
polymer‐matrix
composites.
Herein,
hydroxylated
boron
nitride
nanosheet
(BNNS‐OH)
with
a
yield
35.67%
prepared
liquid
ultrasonic
exfoliation
under
assistance
sodium
cholate
(SC),
grafted
(1H,1H,2H,2H‐perfluorodecyl)
trimethoxy
silane
prepare
fluorinated
nanosheets
(F‐BNNS),
which
can
uniformly
disperse
silicone
rubber
(LSR)
reduce
LSR
The
composites
20
wt%
F‐BNNS
reached
0.489
W·m
−1
·K
,
showing
307.35%
comparison
pure
(0.12
Meantime,
as‐obtained
LSR/F‐BNNS
(20
wt%)
is
reduced
from
3.4
2.6,
loss
f
)
less
than
0.012.
facile
rational
design
BNNS
offers
new
insight
for
high‐end
packaging
materials.
Highlights
A
treatment
h‐BN
proposed.
achieved
ultralow
2.63
via
BNNS.
Thermal
increased
LSR.
Язык: Английский
Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid
International Journal of Molecular Sciences,
Год журнала:
2024,
Номер
25(20), С. 11156 - 11156
Опубликована: Окт. 17, 2024
With
the
innovation
of
modern
electronics,
heat
dissipation
in
devices
faces
several
problems.
In
our
work,
boron
nitride
(BN)
with
good
thermal
conductivity
(TC)
was
successfully
fabricated
by
constructing
BN
along
axial
direction
and
surface-grafted
hybrid
composite
fibers
via
wet-spinning
hot-pressing
method.
The
unique
inter-outer
inter-interconnected
structure
exhibited
176.47%
enhancement
(TCE),
which
exhibits
TC,
mechanical
resistance,
chemical
resistance.
addition,
depending
on
special
fibers,
it
provides
a
new
strategy
for
fabricating
interface
materials
electronic
device.
Язык: Английский
General Approach to Hydrolysis Resistive Aluminum Nitride and Its High-Performance Thermal Interface Materials
ACS Applied Materials & Interfaces,
Год журнала:
2024,
Номер
16(45), С. 62721 - 62731
Опубликована: Окт. 30, 2024
Aluminum
nitride
(AlN),
noted
for
its
excellent
thermal
conductivity
and
exceptional
electrical
insulation,
presents
a
promising
alternative
to
traditional
ceramic
particles
in
interface
materials
(TIMs).
However,
broader
adoption
practical
applications
is
limited
by
performance
degradation
due
the
vulnerability
of
crystal
structure
ubiquitous
moisture.
This
study
introduces
dual
solution,
utilizing
mechanochemical
method
design
dense
outer
layer
Galinstan
liquid
metal
(LM)
that
simultaneously
enhances
AlN's
resistance
hydrolysis
improves
TIM
applications.
The
high
surface
free
energy
LM
imparts
hydrophobic
properties
AlN
and,
combined
with
oxides,
forms
dual-layer
protective
barrier
prevents
water
penetration,
significantly
enhancing
TIM's
long-term
stability
high-humidity
conditions.
Additionally,
at
thixotropic
interfacial
heat
transport
through
bridging
effect
LM,
resulting
improved
rheological
mobility
composite
material.
win–win
modification
strategy
opens
opportunities
durable
application
widespread
electronic
management.
Язык: Английский