DTAB-functionalized MXene nanofillers for enhancing dielectric properties of TPU-based composites DOI

Yajing Liu,

Yan Jia, Weiwei He

и другие.

Composites Communications, Год журнала: 2025, Номер unknown, С. 102426 - 102426

Опубликована: Апрель 1, 2025

Язык: Английский

Enhancing Hydrolysis Resistance and Thermal Conductivity of Aluminum Nitride/Polysiloxane Composites via Block Copolymer-Modification DOI
Yongqiang Guo, Lei Zhang, Kunpeng Ruan

и другие.

Polymer, Год журнала: 2025, Номер unknown, С. 128189 - 128189

Опубликована: Фев. 1, 2025

Язык: Английский

Процитировано

2
Low dielectric constant and ultra-low dielectric loss poly(arylene ether nitrile)/octaphenyl-POSS composite films with dual cross-linked networks DOI
Zhixuan Zhang, Tong Cao,

Hanrong Wu

и другие.

Composites Communications, Год журнала: 2025, Номер unknown, С. 102268 - 102268

Опубликована: Янв. 1, 2025

Язык: Английский

Процитировано

1
Closed-loop recycling and utilization of waste hydroxyl-terminated polybutadiene solid propellant DOI

Deqian Meng,

Lipeng Sang,

Bowen Tao

и другие.

Composites Communications, Год журнала: 2025, Номер 54, С. 102263 - 102263

Опубликована: Янв. 15, 2025

Язык: Английский

Процитировано

0
Bio-inspired PEI/BNNS composite film via hydrogen bond self-assembly for efficiently enhancing high-temperature dielectric energy storage DOI

Zhaotian Ba,

Lili Ma,

Hui Liu

и другие.

Composites Communications, Год журнала: 2025, Номер unknown, С. 102266 - 102266

Опубликована: Янв. 1, 2025

Язык: Английский

Процитировано

0
Dielectric Films Enhanced With SiC@PDA‐PEI for Improved Energy Storage and Insulation Performance DOI Open Access

Jinwen Tan,

Liang He, Jinghui Zhang

и другие.

Journal of Applied Polymer Science, Год журнала: 2025, Номер unknown

Опубликована: Март 2, 2025

ABSTRACT This study presents an approach to enhancing dielectric properties, energy storage performance, and thermal stability of polymer composite. A composite film based on polyarylene ether nitrile (PEN) was prepared, in which SiC acted as fillers. PEI PDA layers were co‐deposited the surface particles improve dispersion filler PEN resin. Benefiting from SiC's rigidity, composites exhibit good conductivity low coefficient expansion. Besides, introduction SiC@PDA‐PEI enables have superior electrical insulation, with a breakdown field strength up 195 kV/mm, 63.9% higher than that pure film. Moreover, constant films increased 3.3 5.0 PEN/SiC@PDA‐PEI addition content increased, resulting significant increase density films. When 2 wt%, 233% Therefore, this multifunctional shows broad application potential electronics, aerospace, high‐end manufacturing fields.

Язык: Английский

Процитировано

0
DTAB-functionalized MXene nanofillers for enhancing dielectric properties of TPU-based composites DOI

Yajing Liu,

Yan Jia, Weiwei He

и другие.

Composites Communications, Год журнала: 2025, Номер unknown, С. 102426 - 102426

Опубликована: Апрель 1, 2025

Язык: Английский

Процитировано

0