DTAB-functionalized MXene nanofillers for enhancing dielectric properties of TPU-based composites DOI

Yajing Liu,

Yan Jia, Weiwei He

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102426 - 102426

Published: April 1, 2025

Language: Английский

Enhancing Hydrolysis Resistance and Thermal Conductivity of Aluminum Nitride/Polysiloxane Composites via Block Copolymer-Modification DOI
Yongqiang Guo, Lei Zhang, Kunpeng Ruan

et al.

Polymer, Journal Year: 2025, Volume and Issue: unknown, P. 128189 - 128189

Published: Feb. 1, 2025

Language: Английский

Citations

2
Low dielectric constant and ultra-low dielectric loss poly(arylene ether nitrile)/octaphenyl-POSS composite films with dual cross-linked networks DOI
Zhixuan Zhang, Tong Cao,

Hanrong Wu

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102268 - 102268

Published: Jan. 1, 2025

Language: Английский

Citations

1
Closed-loop recycling and utilization of waste hydroxyl-terminated polybutadiene solid propellant DOI

Deqian Meng,

Lipeng Sang,

Bowen Tao

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: 54, P. 102263 - 102263

Published: Jan. 15, 2025

Language: Английский

Citations

0
Bio-inspired PEI/BNNS composite film via hydrogen bond self-assembly for efficiently enhancing high-temperature dielectric energy storage DOI

Zhaotian Ba,

Lili Ma,

Hui Liu

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102266 - 102266

Published: Jan. 1, 2025

Language: Английский

Citations

0
Dielectric Films Enhanced With SiC@PDA‐PEI for Improved Energy Storage and Insulation Performance DOI Open Access

Jinwen Tan,

Liang He, Jinghui Zhang

et al.

Journal of Applied Polymer Science, Journal Year: 2025, Volume and Issue: unknown

Published: March 2, 2025

ABSTRACT This study presents an approach to enhancing dielectric properties, energy storage performance, and thermal stability of polymer composite. A composite film based on polyarylene ether nitrile (PEN) was prepared, in which SiC acted as fillers. PEI PDA layers were co‐deposited the surface particles improve dispersion filler PEN resin. Benefiting from SiC's rigidity, composites exhibit good conductivity low coefficient expansion. Besides, introduction SiC@PDA‐PEI enables have superior electrical insulation, with a breakdown field strength up 195 kV/mm, 63.9% higher than that pure film. Moreover, constant films increased 3.3 5.0 PEN/SiC@PDA‐PEI addition content increased, resulting significant increase density films. When 2 wt%, 233% Therefore, this multifunctional shows broad application potential electronics, aerospace, high‐end manufacturing fields.

Language: Английский

Citations

0
DTAB-functionalized MXene nanofillers for enhancing dielectric properties of TPU-based composites DOI

Yajing Liu,

Yan Jia, Weiwei He

et al.

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102426 - 102426

Published: April 1, 2025

Language: Английский

Citations

0