Simultaneously enhanced in-plane and through-plane thermal conductivity of the bacterial cellulose composite prepared via a facile method

Journal of Alloys and Compounds, Год журнала: 2025, Номер unknown, С. 178859 - 178859

Опубликована: Янв. 1, 2025

Язык: Английский

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Significantly anisotropic thermal conductivity improvement of PEEK composites with EMI shielding effectiveness

Composites Communications, Год журнала: 2025, Номер unknown, С. 102282 - 102282

Опубликована: Янв. 1, 2025

Язык: Английский

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High Thermal Conductivity and Low Dielectric Loss of Three-Dimensional Boron Nitride Nanosheets/Epoxy Composites

Composites Communications, Год журнала: 2024, Номер 50, С. 102007 - 102007

Опубликована: Июль 16, 2024

Язык: Английский

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Fabrication of Curdlan connected honeycomb-like 3D BN-CNT network for enhancing the thermal conductivity of epoxy composites

Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 160443 - 160443

Опубликована: Фев. 1, 2025

Язык: Английский

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Vertically aligned hollow Ag@Ni tubes for synergistic EMI shielding and enhancing the thermal conductivities of epoxy composites

Applied Materials Today, Год журнала: 2025, Номер 44, С. 102741 - 102741

Опубликована: Апрель 22, 2025

Язык: Английский

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Microwave absorption, thermal and mechanical properties of amorphous nano carbon doped aluminium nitride composite ceramics

Ceramics International, Год журнала: 2024, Номер 50(17), С. 30931 - 30939

Опубликована: Май 24, 2024

Язык: Английский

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Silver Nanoparticle Decorated Boron Nitride for Reducing Interfacial Thermal Resistance in Thermal Conductivity Epoxy Resin Composite

Journal of Applied Polymer Science, Год журнала: 2025, Номер unknown

Опубликована: Март 18, 2025

ABSTRACT The thermal conductivity of polymer composite is often constrained by the discontinuous structure filler networks within matrix and high contact resistance at interfaces. In response to these limitations, this study proposes a novel method for reducing interfacial creating silver nanoparticle “bridges” through deposition onto surfaces. work, boron nitride (BN) hybrids modified with nanoparticles (BN‐Ag) were synthesized via in situ reduction ions. A continuous BN‐Ag framework was constructed using sacrificial template method, followed infiltration epoxy resin produce an composite. At content 42.8%, increased from 1.36 Wm −1 K BN fillers 2.57 Ag nanoparticle‐modified fillers, representing improvement 89%. Foygel model employed fit data, revealing that incorporation effectively reduced between fillers. Furthermore, electrical insulating properties preserved, making design approach highly promising development thermally conductive electrically composites suitable electronic applications.

Язык: Английский

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Construction of a controllable dual-channel structure of Al2O3 and boron nitride within cellulose nanofiber composite films to improve through-plane thermal conductivity

Polymer, Год журнала: 2025, Номер unknown, С. 128520 - 128520

Опубликована: Май 1, 2025

Язык: Английский

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Simple Protein Foaming‐Derived 3D Segregated MgO Networks in Epoxy Composites with Outstanding Thermal Conductivity Properties

Advanced Science, Год журнала: 2025, Номер unknown

Опубликована: Май 28, 2025

Abstract The miniaturization and high‐power density of electronic devices present new challenges for thermal management. Efficient heat dissipation in electrically insulating packaging materials is currently limited by the conductivity thermal‐interface (TIMs) their ability to effectively direct toward sinks. In this study, MgO‐based composites with high conductivities are fabricated achieve excellent performances optimizing heat‐transfer path. These produced using a protein foaming method, which forms interconnected ceramic‐filler networks. Additionally, liquid phase formed during sintering MgO enhances bonding epoxy matrix, thereby improving composites. As result, 54.64 vol% 17.19 W m −1 K , 101 times higher than that pure epoxy, 3.7 randomly dispersed composites, even superior nitride‐based Moreover, also exhibited low thermal‐expansion coefficient (27.76 ppm °C ) electrical‐insulation strength (51.51 kV mm ), ensuring good electrical performance electronic‐packaging applications. strategic design TIM microstructures directing offers promising solution efficient management integrated electronics.

Язык: Английский

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Construction of three-dimensional network using boron nitride microspheres and the thermal conductivity/stability of epoxy resin composites

European Polymer Journal, Год журнала: 2024, Номер 212, С. 113084 - 113084

Опубликована: Май 1, 2024

Язык: Английский

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