Simultaneously enhanced in-plane and through-plane thermal conductivity of the bacterial cellulose composite prepared via a facile method

Journal of Alloys and Compounds, Journal Year: 2025, Volume and Issue: unknown, P. 178859 - 178859

Published: Jan. 1, 2025

Language: Английский

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Significantly anisotropic thermal conductivity improvement of PEEK composites with EMI shielding effectiveness

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102282 - 102282

Published: Jan. 1, 2025

Language: Английский

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High Thermal Conductivity and Low Dielectric Loss of Three-Dimensional Boron Nitride Nanosheets/Epoxy Composites

Composites Communications, Journal Year: 2024, Volume and Issue: 50, P. 102007 - 102007

Published: July 16, 2024

Language: Английский

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Fabrication of Curdlan connected honeycomb-like 3D BN-CNT network for enhancing the thermal conductivity of epoxy composites

Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: unknown, P. 160443 - 160443

Published: Feb. 1, 2025

Language: Английский

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Vertically aligned hollow Ag@Ni tubes for synergistic EMI shielding and enhancing the thermal conductivities of epoxy composites

Applied Materials Today, Journal Year: 2025, Volume and Issue: 44, P. 102741 - 102741

Published: April 22, 2025

Language: Английский

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Microwave absorption, thermal and mechanical properties of amorphous nano carbon doped aluminium nitride composite ceramics

Ceramics International, Journal Year: 2024, Volume and Issue: 50(17), P. 30931 - 30939

Published: May 24, 2024

Language: Английский

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Silver Nanoparticle Decorated Boron Nitride for Reducing Interfacial Thermal Resistance in Thermal Conductivity Epoxy Resin Composite

Journal of Applied Polymer Science, Journal Year: 2025, Volume and Issue: unknown

Published: March 18, 2025

ABSTRACT The thermal conductivity of polymer composite is often constrained by the discontinuous structure filler networks within matrix and high contact resistance at interfaces. In response to these limitations, this study proposes a novel method for reducing interfacial creating silver nanoparticle “bridges” through deposition onto surfaces. work, boron nitride (BN) hybrids modified with nanoparticles (BN‐Ag) were synthesized via in situ reduction ions. A continuous BN‐Ag framework was constructed using sacrificial template method, followed infiltration epoxy resin produce an composite. At content 42.8%, increased from 1.36 Wm −1 K BN fillers 2.57 Ag nanoparticle‐modified fillers, representing improvement 89%. Foygel model employed fit data, revealing that incorporation effectively reduced between fillers. Furthermore, electrical insulating properties preserved, making design approach highly promising development thermally conductive electrically composites suitable electronic applications.

Language: Английский

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Construction of a controllable dual-channel structure of Al2O3 and boron nitride within cellulose nanofiber composite films to improve through-plane thermal conductivity

Polymer, Journal Year: 2025, Volume and Issue: unknown, P. 128520 - 128520

Published: May 1, 2025

Language: Английский

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Simple Protein Foaming‐Derived 3D Segregated MgO Networks in Epoxy Composites with Outstanding Thermal Conductivity Properties

Advanced Science, Journal Year: 2025, Volume and Issue: unknown

Published: May 28, 2025

Abstract The miniaturization and high‐power density of electronic devices present new challenges for thermal management. Efficient heat dissipation in electrically insulating packaging materials is currently limited by the conductivity thermal‐interface (TIMs) their ability to effectively direct toward sinks. In this study, MgO‐based composites with high conductivities are fabricated achieve excellent performances optimizing heat‐transfer path. These produced using a protein foaming method, which forms interconnected ceramic‐filler networks. Additionally, liquid phase formed during sintering MgO enhances bonding epoxy matrix, thereby improving composites. As result, 54.64 vol% 17.19 W m −1 K , 101 times higher than that pure epoxy, 3.7 randomly dispersed composites, even superior nitride‐based Moreover, also exhibited low thermal‐expansion coefficient (27.76 ppm °C ) electrical‐insulation strength (51.51 kV mm ), ensuring good electrical performance electronic‐packaging applications. strategic design TIM microstructures directing offers promising solution efficient management integrated electronics.

Language: Английский

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Construction of three-dimensional network using boron nitride microspheres and the thermal conductivity/stability of epoxy resin composites

European Polymer Journal, Journal Year: 2024, Volume and Issue: 212, P. 113084 - 113084

Published: May 1, 2024

Language: Английский

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