Carbon fiber/boron nitride fillers for enhancing through-plane thermal conductivity of poly(vinylidene fluoride): Synergistic effect and mechanism

Composites Communications, Год журнала: 2024, Номер unknown, С. 102090 - 102090

Опубликована: Сен. 1, 2024

Язык: Английский

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Electrical properties of MAH-g-PP modified PP/SEBS matrix semi-conductive composite materials

Composites Science and Technology, Год журнала: 2024, Номер 253, С. 110657 - 110657

Опубликована: Май 9, 2024

Язык: Английский

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Influence of barium titanate and graphite on electrical attributes of Polyvinylidene fluoride matrix composites

Materials Science in Semiconductor Processing, Год журнала: 2024, Номер 181, С. 108606 - 108606

Опубликована: Июнь 12, 2024

Язык: Английский

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Development of copper-boron nitride core-shell structured fillers and surface treatment for thermally conductive composites

Journal of Alloys and Compounds, Год журнала: 2024, Номер 1003, С. 175691 - 175691

Опубликована: Июль 23, 2024

Язык: Английский

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Exploring Material and Dielectric Properties of Poly(vinylidene fluoride) Composites Incorporated with Graphene and Graphene Oxide

Soft Matter, Год журнала: 2024, Номер 20(32), С. 6490 - 6499

Опубликована: Янв. 1, 2024

This study focuses on enhancing the structural, thermal, and dielectric properties of poly(vinylidene fluoride) (PVDF) nanocomposites loaded with graphene oxide (GO) (G), synthesized

Язык: Английский

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Synthesis of a novel fluorinated polyimide for preparing thermally conductive polyimide composites

Polymer Composites, Год журнала: 2024, Номер 45(17), С. 15915 - 15923

Опубликована: Авг. 8, 2024

Abstract A fluorinated polyimide (PI‐FTD) was synthesized for preparing a thermally conductive PI matrix and composites. Additionally, surface‐treated boron nitride (BN) incorporated into the PI‐FTD via solution casting method to form efficient heat paths along through‐plane direction. The resultant composite demonstrated remarkable characteristics, including an impressive thermal conductivity of 3.6 W mK −1 , substantial tensile strength 69.4 MPa, excellent stability. When this applied light‐emitting diodes, it effectively managed heat, reducing operating temperature by 29°C. PI‐FTD/BN‐OH composites can potentially improve management in electronic devices. Highlights novel fabricated. Introducing CF 3 functionalities provides high BN‐OH reinforced mechanical properties achieved management.

Язык: Английский

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Mechanical and electrical properties of PP composite modified by SEBS used for high voltage cable

Engineering Fracture Mechanics, Год журнала: 2025, Номер unknown, С. 110807 - 110807

Опубликована: Янв. 1, 2025

Язык: Английский

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Emerging Low-Dimensional Perovskite Photoferroelectrics: from Crystallographic Microstructure to Applications

Nano Energy, Год журнала: 2025, Номер unknown, С. 110774 - 110774

Опубликована: Фев. 1, 2025

Язык: Английский

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Balancing Catalyst-Intermediate Interactions: Unlocking High-Performance MXene-Supported Catalysts for Two-Electron Water Oxidation Reaction from Single Atoms to Nanoparticles

Environmental Research, Год журнала: 2025, Номер unknown, С. 121207 - 121207

Опубликована: Фев. 1, 2025

Язык: Английский

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Polyarylene ether nitrile dielectric material with a thermally conductive network connected by crystals and boron nitride nanosheets

Polymer Composites, Год журнала: 2025, Номер unknown

Опубликована: Апрель 1, 2025

Abstract The localized heat accumulation in electronic components not only restricts the further miniaturization and integration of devices but also severely impacts their performance longevity. This thesis develops a high‐temperature‐resistant, insulating, thermally conductive composite material, which can be applied fields such as encapsulation materials flexible copper clad laminate substrate materials. Boron nitride nanosheets (BNNS) are utilized both nucleating agents thermal additives. dual‐role approach synergistically enhances electrical properties. Results show that out‐of‐plane conductivity (λ ⊥ ) crystallized poly(aryl ether nitrile) (PEN) reaches 0.255 W/(m K), 54.55% increase over untreated PEN. Furthermore, BNNS‐filled PEN exhibits an λ 0.831 representing significant 403.64% enhancement. demonstrates improved overall performance, including dielectric breakdown strength 249.59 kV/mm, expansion coefficient 18.03 ppm/°C, elevated glass transition temperature 209.5°C, decomposition 441.3°C. Highlights BNNS plays roles nucleation agent heat‐conductive filler. increases by compared to pure film. Thermal through regulation condensed matter structure.

Язык: Английский

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