Hexagonal boron nitride nanosheets/graphene nanoplatelets/cellulose nanofibers-based multifunctional thermal interface materials enabling electromagnetic interference shielding and electrical insulation

Carbon, Год журнала: 2024, Номер 228, С. 119397 - 119397

Опубликована: Июнь 25, 2024

Язык: Английский

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Reinforcement of microwave absorption and thermal conductivity of polydimethylsiloxane achieved by metal-organic framework-derived carbon nanotube/boron nitride flake heterogeneous structure

Carbon, Год журнала: 2024, Номер 227, С. 119242 - 119242

Опубликована: Май 13, 2024

Язык: Английский

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Functionalized Aluminum Nitride for Improving Hydrolysis Resistances of Highly Thermally Conductive Polysiloxane Composites

Nano-Micro Letters, Год журнала: 2025, Номер 17(1)

Опубликована: Фев. 6, 2025

Abstract A series of divinylphenyl-acryloyl chloride copolymers (PDVB- co -PACl) is synthesized via atom transfer radical polymerization employing tert-butyl acrylate and divinylbenzene as monomers. PDVB- -PACl utilized to graft on the surface spherical aluminum nitride (AlN) prepare functionalized AlN (AlN@PDVB- -PACl). Polymethylhydrosiloxane (PMHS) then used matrix thermally conductive AlN@PDVB- -PACl/PMHS composites with fillers through blending curing. The grafting synchronously enhances hydrolysis resistance its interfacial compatibility PMHS matrix. When molecular weight 5100 g mol −1 density 0.8 wt%, containing 75 wt% exhibit optimal comprehensive performance. thermal conductivity ( λ ) composite 1.14 W m K , which by 20% 420% compared simply physically blended AlN/PMHS pure PMHS, respectively. Meanwhile, display remarkable hydrothermal aging retaining 99.1% after soaking in 90 °C deionized water for 80 h, whereas decreases sharply 93.7%.

Язык: Английский

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An Engineered Heterostructured Trinity Enables Fire-Safe, Thermally Conductive Polymer Nanocomposite Films with Low Dielectric Loss

Nano-Micro Letters, Год журнала: 2025, Номер 17(1)

Опубликована: Фев. 26, 2025

Abstract To adapt to the trend of increasing miniaturization and high integration microelectronic equipments, there is a demand for multifunctional thermally conductive (TC) polymeric films combining excellent flame retardancy low dielectric constant ( ε ). date, have been few successes that achieve such performance portfolio in polymer due their different even mutually exclusive governing mechanisms. Herein, we propose trinity strategy creating rationally engineered heterostructure nanoadditive (FG@CuP@ZTC) by situ self-assembly immobilization copper-phenyl phosphonate (CuP) zinc-3, 5-diamino-1,2,4-triazole complex (ZTC) onto fluorinated graphene (FG) surface. Benefiting from synergistic effects FG, CuP, ZTC bionic lay-by-lay (LBL) strategy, as-fabricated waterborne polyurethane (WPU) nanocomposite film with 30 wt% FG@CuP@ZTC exhibits 55.6% improvement limiting oxygen index (LOI), 66.0% 40.5% reductions peak heat release rate total release, respectively, 93.3% increase tensile strength relative pure WPU between ZTC. Moreover, presents thermal conductivity λ ) 12.7 W m −1 K 2.92 at 10 6 Hz. This work provides commercially viable rational design develop high-performance films, which hold great potential as advanced dissipators high-power-density microelectronics.

Язык: Английский

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A nacre-inspired thermo conductive and healable nanocomposite captures extremely enhanced stiffness and toughness

Composites Part B Engineering, Год журнала: 2024, Номер 272, С. 111228 - 111228

Опубликована: Янв. 11, 2024

Язык: Английский

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Fusing-smashing exfoliation for high-aspect-ratio hexagonal boron nitride nanosheets available to highly-thermoconductive polymeric composites

Chemical Engineering Journal, Год журнала: 2025, Номер unknown, С. 161451 - 161451

Опубликована: Март 1, 2025

Язык: Английский

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Boron Nitride‐Polymer Composites with High Thermal Conductivity: Preparation, Functionalization Strategy and Innovative Structural Regulation

Small, Год журнала: 2025, Номер unknown

Опубликована: Март 30, 2025

Abstract The escalating thermal challenges posed by increasing power densities in electronic devices emerge as a critical barrier to maintain their sustained and reliable operation. Addressing this issue requires the strategic development of materials with superior conductivity properties facilitate progress high‐power electronics development. Thermal conductive polymer composites incorporating ceramic material renowned for exceptional adjustability, insulating properties, moldability, are emerging promising solution urgent challenge. Hexagonal boron nitride (h‐BN) nanomaterials highly candidates management applications, owing mechanical stability, remarkable coefficients, minimal expansion characteristics, outstanding chemical inertness. In work, ≈10 years on high nitride‐filled is thoroughly summarized. Moreover, strategies h‐BN other nanomaterials‐filled at synthesis, functionalization, innovative structural design discussed detail. main future nitride‐polymer also proposed, which will provide meaningful guidance practical applications materials.

Язык: Английский

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Synthesis of novel Stachytarpheta jamaicensis flower liked hexagonal boron nitride nanoribbons (SJF-BNNBs) to efficiently improve the thermal/mechanical/electrical properties of flexible polyimide films

Composites Part B Engineering, Год журнала: 2024, Номер 280, С. 111524 - 111524

Опубликована: Май 3, 2024

Язык: Английский

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Enhanced thermal conductivity and electrical insulation properties of liquid crystalline epoxy composites by using optimized alumina hybrid fillers

Materials Today Physics, Год журнала: 2025, Номер unknown, С. 101719 - 101719

Опубликована: Апрель 1, 2025

Язык: Английский

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Density-controlled thermal and mechanical properties of vertically aligned graphite foam-based polymer composites

Composites Part A Applied Science and Manufacturing, Год журнала: 2024, Номер 186, С. 108436 - 108436

Опубликована: Авг. 28, 2024

Язык: Английский

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