Polymer Composites,
Journal Year:
2024,
Volume and Issue:
45(13), P. 12325 - 12337
Published: June 18, 2024
Abstract
The
continuous
updating
and
iteration
of
electronic
devices
brings
about
a
significant
accumulation
heat.
It
is
urgent
to
enhance
the
thermal
properties
polymer‐based
composites
alleviate
heat
dissipation
problem
in
microelectronics
industry.
In
this
paper,
hot
drawing
process
was
introduced
increase
crystallinity
ultra‐high
molecular
weight
polyethylene
(UHMWPE)
fiber
improve
its
conductivity.
fiber/epoxy
resin
(UHMWPE
fiber/Epoxy)
with
high
conductivity
were
prepared
by
compositing
UHMWPE
epoxy
under
vacuum
conditions.
Due
good
(86%),
an
efficient
conduction
path
provided
for
phonons
axial
direction
along
fibers.
results
show
that
reaches
maximum
3.51
W/mK
(in‐plane),
which
17.47
times
higher
than
(0.19
W/mK).
thermography
pictures
indicate
have
better
transfer
capacity
draw
ratio
(λ).
addition,
also
characteristics
low
density
electrical
These
researches
will
provide
new
idea
preparation
all‐polymer
properties.
Highlights
A
improving
High
facilitates
reduction
phonon
scattering
transmission
energy
phonons.
obtained
polymer
exhibit
in‐plane
Nano-Micro Letters,
Journal Year:
2025,
Volume and Issue:
17(1)
Published: Feb. 6, 2025
Abstract
A
series
of
divinylphenyl-acryloyl
chloride
copolymers
(PDVB-
co
-PACl)
is
synthesized
via
atom
transfer
radical
polymerization
employing
tert-butyl
acrylate
and
divinylbenzene
as
monomers.
PDVB-
-PACl
utilized
to
graft
on
the
surface
spherical
aluminum
nitride
(AlN)
prepare
functionalized
AlN
(AlN@PDVB-
-PACl).
Polymethylhydrosiloxane
(PMHS)
then
used
matrix
thermally
conductive
AlN@PDVB-
-PACl/PMHS
composites
with
fillers
through
blending
curing.
The
grafting
synchronously
enhances
hydrolysis
resistance
its
interfacial
compatibility
PMHS
matrix.
When
molecular
weight
5100
g
mol
−1
density
0.8
wt%,
containing
75
wt%
exhibit
optimal
comprehensive
performance.
thermal
conductivity
(
λ
)
composite
1.14
W
m
K
,
which
by
20%
420%
compared
simply
physically
blended
AlN/PMHS
pure
PMHS,
respectively.
Meanwhile,
display
remarkable
hydrothermal
aging
retaining
99.1%
after
soaking
in
90
°C
deionized
water
for
80
h,
whereas
decreases
sharply
93.7%.
Nano-Micro Letters,
Journal Year:
2025,
Volume and Issue:
17(1)
Published: Feb. 26, 2025
Abstract
To
adapt
to
the
trend
of
increasing
miniaturization
and
high
integration
microelectronic
equipments,
there
is
a
demand
for
multifunctional
thermally
conductive
(TC)
polymeric
films
combining
excellent
flame
retardancy
low
dielectric
constant
(
ε
).
date,
have
been
few
successes
that
achieve
such
performance
portfolio
in
polymer
due
their
different
even
mutually
exclusive
governing
mechanisms.
Herein,
we
propose
trinity
strategy
creating
rationally
engineered
heterostructure
nanoadditive
(FG@CuP@ZTC)
by
situ
self-assembly
immobilization
copper-phenyl
phosphonate
(CuP)
zinc-3,
5-diamino-1,2,4-triazole
complex
(ZTC)
onto
fluorinated
graphene
(FG)
surface.
Benefiting
from
synergistic
effects
FG,
CuP,
ZTC
bionic
lay-by-lay
(LBL)
strategy,
as-fabricated
waterborne
polyurethane
(WPU)
nanocomposite
film
with
30
wt%
FG@CuP@ZTC
exhibits
55.6%
improvement
limiting
oxygen
index
(LOI),
66.0%
40.5%
reductions
peak
heat
release
rate
total
release,
respectively,
93.3%
increase
tensile
strength
relative
pure
WPU
between
ZTC.
Moreover,
presents
thermal
conductivity
λ
)
12.7
W
m
−1
K
2.92
at
10
6
Hz.
This
work
provides
commercially
viable
rational
design
develop
high-performance
films,
which
hold
great
potential
as
advanced
dissipators
high-power-density
microelectronics.
Small,
Journal Year:
2025,
Volume and Issue:
unknown
Published: March 30, 2025
Abstract
The
escalating
thermal
challenges
posed
by
increasing
power
densities
in
electronic
devices
emerge
as
a
critical
barrier
to
maintain
their
sustained
and
reliable
operation.
Addressing
this
issue
requires
the
strategic
development
of
materials
with
superior
conductivity
properties
facilitate
progress
high‐power
electronics
development.
Thermal
conductive
polymer
composites
incorporating
ceramic
material
renowned
for
exceptional
adjustability,
insulating
properties,
moldability,
are
emerging
promising
solution
urgent
challenge.
Hexagonal
boron
nitride
(h‐BN)
nanomaterials
highly
candidates
management
applications,
owing
mechanical
stability,
remarkable
coefficients,
minimal
expansion
characteristics,
outstanding
chemical
inertness.
In
work,
≈10
years
on
high
nitride‐filled
is
thoroughly
summarized.
Moreover,
strategies
h‐BN
other
nanomaterials‐filled
at
synthesis,
functionalization,
innovative
structural
design
discussed
detail.
main
future
nitride‐polymer
also
proposed,
which
will
provide
meaningful
guidance
practical
applications
materials.
