Green segregated honeycomb biopolymer composites for electromagnetic interference shielding biomedical devices DOI
Tong Liu,

Huiyao Feng,

Chenhong Jin

и другие.

Chemical Engineering Journal, Год журнала: 2024, Номер 493, С. 152438 - 152438

Опубликована: Май 21, 2024

Язык: Английский

Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption DOI
Yongqiang Guo, Kunpeng Ruan, Guang‐Sheng Wang

и другие.

Science Bulletin, Год журнала: 2023, Номер 68(11), С. 1195 - 1212

Опубликована: Май 2, 2023

Язык: Английский

Процитировано

319

A Perspective for Developing Polymer-Based Electromagnetic Interference Shielding Composites DOI Creative Commons
Yali Zhang, Junwei Gu

Nano-Micro Letters, Год журнала: 2022, Номер 14(1)

Опубликована: Апрель 1, 2022

The rapid development of aerospace weapons and equipment, wireless base stations 5G communication technologies has put forward newer higher requirements for the comprehensive performances polymer-based electromagnetic interference (EMI) shielding composites. However, most currently prepared EMI composites are still difficult to combine high performance multi-functionality. In response this, based on research works relevant researchers as well our group, three possible directions break through above bottlenecks proposed, including construction efficient conductive networks, optimization multi-interfaces lightweight multifunction compatibility design. future trends in prospected, it is hoped provide certain theoretical basis technical guidance preparation,

Язык: Английский

Процитировано

221

Recent progress on multifunctional electromagnetic interference shielding polymer composites DOI
Ke Tian, Danrong Hu,

Quan Wei

и другие.

Journal of Material Science and Technology, Год журнала: 2022, Номер 134, С. 106 - 131

Опубликована: Июль 22, 2022

Язык: Английский

Процитировано

188

Design and advanced manufacturing of electromagnetic interference shielding materials DOI Creative Commons
Ji Liu, Ming-Yuan Yu, Zhong‐Zhen Yu

и другие.

Materials Today, Год журнала: 2023, Номер 66, С. 245 - 272

Опубликована: Апрель 10, 2023

Electromagnetic interference (EMI) shielding is critical in electronic applications. However, the currently available EMI materials are restricted customizability and application flexibility. Recent advances manufacturing technologies have provided a unique path to achieve custom creation of solutions. A successful example additive (AM), which has enabled high design freedom, efficient performance regulation, multifunctionality simultaneously into fabricated shields, offering an opportunity start revolution field shielding. In this review, we summarize latest AM materials, aiming provide deep understanding connection between raw methods, considerations, performances shields. We first introduce mechanism subsequently focusing on characteristics representative methods as-created Based requirements create application-oriented solutions, these also critically compared. Thereafter, present state-of-the-art considerations shields examine pivotal roles realizing designs. conclude by discussing future research directions, at motivating use developments

Язык: Английский

Процитировано

166

A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices DOI
Chenggong Zhao, Yifan Li, Yicheng Liu

и другие.

Advanced Composites and Hybrid Materials, Год журнала: 2022, Номер 6(1)

Опубликована: Дек. 28, 2022

Язык: Английский

Процитировано

135

External field-assisted techniques for polymer matrix composites with electromagnetic interference shielding DOI Open Access
Chaobo Liang, Hua Qiu, Yali Zhang

и другие.

Science Bulletin, Год журнала: 2023, Номер 68(17), С. 1938 - 1953

Опубликована: Авг. 1, 2023

Язык: Английский

Процитировано

129

Templating strategies for 3D-structured thermally conductive composites: Recent advances and thermal energy applications DOI
Jie Yang, Xi Shen, Wei Yang

и другие.

Progress in Materials Science, Год журнала: 2022, Номер 133, С. 101054 - 101054

Опубликована: Дек. 5, 2022

Язык: Английский

Процитировано

126

Hexagonal boron nitride nanosheets: Preparation, heat transport property and application as thermally conductive fillers DOI
Lulu An, Yuanlie Yu, Qiran Cai

и другие.

Progress in Materials Science, Год журнала: 2023, Номер 138, С. 101154 - 101154

Опубликована: Июнь 15, 2023

Язык: Английский

Процитировано

125

Highly efficient thermal conductivity of polydimethylsiloxane composites via introducing “Line-Plane”-like hetero-structured fillers DOI
Shuangshuang Wang,

Dianying Feng,

He Guan

и другие.

Composites Part A Applied Science and Manufacturing, Год журнала: 2022, Номер 157, С. 106911 - 106911

Опубликована: Март 7, 2022

Язык: Английский

Процитировано

121

A Bioinspired Polymer‐Based Composite Displaying Both Strong Adhesion and Anisotropic Thermal Conductivity DOI
Heng Zhang,

Qingxia He,

Huitao Yu

и другие.

Advanced Functional Materials, Год журнала: 2023, Номер 33(18)

Опубликована: Фев. 13, 2023

Abstract The integration and functionality of high‐power electronic architectures or devices require a high strength good heat flow at the interface. However, simultaneously improving interfacial bonding phonon transport polymers is challenging because tradeoff between cross‐linked flexible chains high‐quality crystalline structure. Here, copolymer, poly(dopamine methacrylate‐co‐hydroxyethyl methacrylate [P(DMA‐HEMA)] designed synthesized, inspired by snail mussel adhesion. copolymer achievs surface adhesion up to 6.38 MPa owing synergistic effects hydrogen bonds mechanical interlocking. When introduced into vertically aligned carbon nanotubes (VACNTs), catechol groups in P(DMA‐HEMA) formed strong with through π‐π interactions As result, P(DMA‐HEMA)/VACNTs composite shows through‐plane thermal conductivity (21.46 W m −1 K ), an in‐plane that 3.5 times higher than pristine VACNTs, extremely low contact resistance (20.27 mm 2 ). Furthermore, forms weld‐free high‐strength connections two pieces various metals bridge directional pathways. It also exhibits excellent transfer capability reliability even under zero‐pressure conditions.

Язык: Английский

Процитировано

111