Green segregated honeycomb biopolymer composites for electromagnetic interference shielding biomedical devices DOI
Tong Liu,

Huiyao Feng,

Chenhong Jin

et al.

Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: 493, P. 152438 - 152438

Published: May 21, 2024

Language: Английский

Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption DOI
Yongqiang Guo, Kunpeng Ruan, Guang‐Sheng Wang

et al.

Science Bulletin, Journal Year: 2023, Volume and Issue: 68(11), P. 1195 - 1212

Published: May 2, 2023

Language: Английский

Citations

319

A Perspective for Developing Polymer-Based Electromagnetic Interference Shielding Composites DOI Creative Commons
Yali Zhang, Junwei Gu

Nano-Micro Letters, Journal Year: 2022, Volume and Issue: 14(1)

Published: April 1, 2022

The rapid development of aerospace weapons and equipment, wireless base stations 5G communication technologies has put forward newer higher requirements for the comprehensive performances polymer-based electromagnetic interference (EMI) shielding composites. However, most currently prepared EMI composites are still difficult to combine high performance multi-functionality. In response this, based on research works relevant researchers as well our group, three possible directions break through above bottlenecks proposed, including construction efficient conductive networks, optimization multi-interfaces lightweight multifunction compatibility design. future trends in prospected, it is hoped provide certain theoretical basis technical guidance preparation,

Language: Английский

Citations

221

Recent progress on multifunctional electromagnetic interference shielding polymer composites DOI
Ke Tian, Danrong Hu,

Quan Wei

et al.

Journal of Material Science and Technology, Journal Year: 2022, Volume and Issue: 134, P. 106 - 131

Published: July 22, 2022

Language: Английский

Citations

188

Design and advanced manufacturing of electromagnetic interference shielding materials DOI Creative Commons
Ji Liu, Ming-Yuan Yu, Zhong‐Zhen Yu

et al.

Materials Today, Journal Year: 2023, Volume and Issue: 66, P. 245 - 272

Published: April 10, 2023

Electromagnetic interference (EMI) shielding is critical in electronic applications. However, the currently available EMI materials are restricted customizability and application flexibility. Recent advances manufacturing technologies have provided a unique path to achieve custom creation of solutions. A successful example additive (AM), which has enabled high design freedom, efficient performance regulation, multifunctionality simultaneously into fabricated shields, offering an opportunity start revolution field shielding. In this review, we summarize latest AM materials, aiming provide deep understanding connection between raw methods, considerations, performances shields. We first introduce mechanism subsequently focusing on characteristics representative methods as-created Based requirements create application-oriented solutions, these also critically compared. Thereafter, present state-of-the-art considerations shields examine pivotal roles realizing designs. conclude by discussing future research directions, at motivating use developments

Language: Английский

Citations

166

A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices DOI
Chenggong Zhao, Yifan Li, Yicheng Liu

et al.

Advanced Composites and Hybrid Materials, Journal Year: 2022, Volume and Issue: 6(1)

Published: Dec. 28, 2022

Language: Английский

Citations

135

External field-assisted techniques for polymer matrix composites with electromagnetic interference shielding DOI Open Access
Chaobo Liang, Hua Qiu, Yali Zhang

et al.

Science Bulletin, Journal Year: 2023, Volume and Issue: 68(17), P. 1938 - 1953

Published: Aug. 1, 2023

Language: Английский

Citations

135

Hexagonal boron nitride nanosheets: Preparation, heat transport property and application as thermally conductive fillers DOI
Lulu An, Yuanlie Yu, Qiran Cai

et al.

Progress in Materials Science, Journal Year: 2023, Volume and Issue: 138, P. 101154 - 101154

Published: June 15, 2023

Language: Английский

Citations

132

Templating strategies for 3D-structured thermally conductive composites: Recent advances and thermal energy applications DOI
Jie Yang, Xi Shen, Wei Yang

et al.

Progress in Materials Science, Journal Year: 2022, Volume and Issue: 133, P. 101054 - 101054

Published: Dec. 5, 2022

Language: Английский

Citations

126

Highly efficient thermal conductivity of polydimethylsiloxane composites via introducing “Line-Plane”-like hetero-structured fillers DOI
Shuangshuang Wang,

Dianying Feng,

He Guan

et al.

Composites Part A Applied Science and Manufacturing, Journal Year: 2022, Volume and Issue: 157, P. 106911 - 106911

Published: March 7, 2022

Language: Английский

Citations

121

A Bioinspired Polymer‐Based Composite Displaying Both Strong Adhesion and Anisotropic Thermal Conductivity DOI
Heng Zhang,

Qingxia He,

Huitao Yu

et al.

Advanced Functional Materials, Journal Year: 2023, Volume and Issue: 33(18)

Published: Feb. 13, 2023

Abstract The integration and functionality of high‐power electronic architectures or devices require a high strength good heat flow at the interface. However, simultaneously improving interfacial bonding phonon transport polymers is challenging because tradeoff between cross‐linked flexible chains high‐quality crystalline structure. Here, copolymer, poly(dopamine methacrylate‐co‐hydroxyethyl methacrylate [P(DMA‐HEMA)] designed synthesized, inspired by snail mussel adhesion. copolymer achievs surface adhesion up to 6.38 MPa owing synergistic effects hydrogen bonds mechanical interlocking. When introduced into vertically aligned carbon nanotubes (VACNTs), catechol groups in P(DMA‐HEMA) formed strong with through π‐π interactions As result, P(DMA‐HEMA)/VACNTs composite shows through‐plane thermal conductivity (21.46 W m −1 K ), an in‐plane that 3.5 times higher than pristine VACNTs, extremely low contact resistance (20.27 mm 2 ). Furthermore, forms weld‐free high‐strength connections two pieces various metals bridge directional pathways. It also exhibits excellent transfer capability reliability even under zero‐pressure conditions.

Language: Английский

Citations

111