Fluorine-containing main-chain type active esters as curing agents for epoxy resins to achieve superior dielectric and thermal performances
Progress in Organic Coatings,
Год журнала:
2024,
Номер
197, С. 108806 - 108806
Опубликована: Сен. 17, 2024
Язык: Английский
High Heat Resistance and Low Dielectric o‐Cresol Formaldehyde Epoxy Resin Solder Resist Containing Photocurable Small Molecular Compound Based on 3,4‐Epoxycyclohexylmethyl Methacrylate
Journal of Applied Polymer Science,
Год журнала:
2025,
Номер
unknown
Опубликована: Фев. 3, 2025
ABSTRACT
High
heat
resistance
and
low
dielectric
constant
are
the
development
trend
for
PCB
ink.
Generally,
higher
crosslinking
density
rigid
molecular
structure
beneficial
improving
resistance,
polarity
molecules
larger
three‐dimensional
helpful
reducing
constant.
In
this
work,
based
on
photocurable
small
epoxy
compound
3,4‐epoxycyclohexylmethyl
methacrylate
(TTA15),
we
successively
grafted
it
with
acrylic
acid
(AA)
1,2,5,6‐tetrahydrophthalic
anhydride
(THPA),
named
15AT.
After
modification
AA
THPA,
two
unsaturated
double
bonds
were
introduced.
15AT,
containing
three
a
cyclohexyl
ring,
mixed
as
an
auxiliary
resin
into
main
EPT‐001
(industrialized
o‐cresol
formaldehyde
THPA
products),
is
obviously
possible
to
improve
resistance.
According
addition
mass
of
15AT
in
total
resin,
0%,
5%,
10%,
15%,
20%
EAT,
EAT15‐5,
EAT15‐10,
EAT15‐15,
EAT15‐20,
respectively.
The
results
show
that
introduction
increases
T
g
value
by
up
37.1°C
also
has
lowest
(2.45),
which
0.29
lower
than
original
thereby
offering
new
approach
properties
Язык: Английский
High-performance polyacrylate oligomers enabled by disulfide networks
Next Materials,
Год журнала:
2025,
Номер
8, С. 100617 - 100617
Опубликована: Март 29, 2025
Язык: Английский
High-Performance Naphthalene-Based Photocurable Epoxy Resin for Advanced Printed Circuit Boards Coatings by Optimizing Fluorodiamine-Mediator Extension Chemistry
Polymer,
Год журнала:
2024,
Номер
308, С. 127421 - 127421
Опубликована: Июль 19, 2024
Язык: Английский
High-Reliable Polyurethane Modified Epoxy Photosensitive Composites for Solder Resist Applications
Composites Communications,
Год журнала:
2024,
Номер
unknown, С. 102180 - 102180
Опубликована: Ноя. 1, 2024
Язык: Английский
Preparation and properties of waterborne UV-curable epoxy soybean oil acrylate resin
Journal of Coatings Technology and Research,
Год журнала:
2024,
Номер
unknown
Опубликована: Дек. 10, 2024
Язык: Английский
High-Performance Biobased Electronic Packaging Coatings Enabled by Unlocking the Photo-Cross-Linking Capacity of Lignin-Derived Epoxy Resin
ACS Applied Polymer Materials,
Год журнала:
2024,
Номер
unknown
Опубликована: Дек. 27, 2024
Substantial
interest
in
producing
thermosets
and
photoresponsive
chemicals
from
bioresources
is
garnering,
yet
moderate
performance
drastically
confines
their
applicability
electronic
packaging
material.
Herein,
several
thermosetting
epoxy
building
blocks
lignin-derived
monomers
(vanillyl
alcohol
eugenol)
were
constructed,
a
range
of
lignin-based
enhanced
photocurable
resins
further
developed
using
acrylic
acid
tetrahydrophthalic
anhydride
as
modifiers
by
an
one-pot
synthesis
method.
The
comprehensive
functionalized
was
systematically
investigated,
such
photopolymerization
behavior,
thermal–mechanical
properties,
electrical
breakdown
properties.
As
result,
the
biobased
resin
stemming
vanillyl
fulfilled
fascinating
heat
resistance
(Tg
≈
103.9
°C)
tensile
strength
(28.89
±
4.39
MPa).
Additionally,
inspired
tunable
chain-extending
tactic,
toughness
photo-cross-linked
films
intensified
insertion
flexible
alkyl
chain
segments
between
cross-linked
sites.
proof
concept,
formulated
EAAT
green
ink,
consisting
inorganic,
demonstrated
superior
patterning
ability
after
alkali
development.
rationally
designed
network
strengthening
mechanism
reported
here
offers
important
universal
strategy
for
significantly
enhancing
properties
materials.
Язык: Английский