Опубликована: Янв. 1, 2023
Язык: Английский
Опубликована: Янв. 1, 2023
Язык: Английский
Applied Energy, Год журнала: 2024, Номер 375, С. 124173 - 124173
Опубликована: Авг. 13, 2024
Язык: Английский
Процитировано
51Energies, Год журнала: 2025, Номер 18(1), С. 149 - 149
Опубликована: Янв. 2, 2025
Nowadays, the number of transistors on electronic components is increasing exponentially leading to an ultra-high heat flux (106~107 W/m2). The non-uniform load distribution chip and local hot spots in thermal environment are key issues a data center (DC). Microchannel liquid cooling effective method inhibit accumulation chip. Optimizing air crucial approach realizing energy savings. This study summarizes latest research management by microchannel optimization DCs. existing concerning structure universality sink (MCHS), stability flow boiling new coolant, prediction spots, intelligent control system identified. Furthermore, novel strategy multi-scale synergy recommended, which expected suppress heighten temperature uniformity. review provides valuable insights into for It paves way applying innovative technologies artificial intelligence methods promote efficient operation low-carbon retrofit
Язык: Английский
Процитировано
4International Journal of Heat and Mass Transfer, Год журнала: 2024, Номер 224, С. 125308 - 125308
Опубликована: Фев. 14, 2024
Язык: Английский
Процитировано
7Applied Thermal Engineering, Год журнала: 2024, Номер 257, С. 124332 - 124332
Опубликована: Сен. 6, 2024
Язык: Английский
Процитировано
7International Journal of Thermal Sciences, Год журнала: 2025, Номер 212, С. 109782 - 109782
Опубликована: Фев. 10, 2025
Язык: Английский
Процитировано
1Chemical Engineering Journal, Год журнала: 2024, Номер 488, С. 150605 - 150605
Опубликована: Март 29, 2024
Язык: Английский
Процитировано
6Applied Thermal Engineering, Год журнала: 2025, Номер unknown, С. 126032 - 126032
Опубликована: Фев. 1, 2025
Язык: Английский
Процитировано
0International Journal of Thermal Sciences, Год журнала: 2025, Номер 213, С. 109800 - 109800
Опубликована: Фев. 26, 2025
Язык: Английский
Процитировано
0International Journal of Thermal Sciences, Год журнала: 2025, Номер 214, С. 109854 - 109854
Опубликована: Март 8, 2025
Язык: Английский
Процитировано
0Physics of Fluids, Год журнала: 2025, Номер 37(4)
Опубликована: Апрель 1, 2025
Ultrathin vapor chamber (UTVC) is considered an ideal solution to the heat dissipation problem of aircraft and spacecraft. However, cooling performance rapidly deteriorates due obstruction liquid return flow under acceleration overload, posing a serious threat safety More seriously, few theoretical models can reveal mechanism transfer centrifugal conditions, resulting in increase design cost difficulty anti-centrifugal ultrathin (ACUTVC). Herein, two novel ACUTVCs based on wicks were proposed, which extensively tested compared with UTVC traditional wick. Results show that effective thermal conductivities exceed 1500 W m−1 K−1 even extreme conditions 6 g acceleration, are about four times copper comparable commercial graphene films, demonstrating reliable management capability high-g conditions. The mechanisms different revealed by model proposed this work, maximum error 26.27% experimental results, showing good agreement. Model results highlight potential optimization approaches wick structures, may guide new directions for ACUTVC.
Язык: Английский
Процитировано
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