Manipulating Thin Film Boiling to Achieve Record-Breaking High Heat Flux DOI
Yuxiang Zhang, Xuan Zhao, Jiahua Li

и другие.

Опубликована: Янв. 1, 2023

Язык: Английский

A review on the liquid cooling thermal management system of lithium-ion batteries DOI
Chunxia Wu,

Yalong Sun,

Heng Tang

и другие.

Applied Energy, Год журнала: 2024, Номер 375, С. 124173 - 124173

Опубликована: Авг. 13, 2024

Язык: Английский

Процитировано

51

A Review of Non-Uniform Load Distribution and Solutions in Data Centers: Micro-Scale Liquid Cooling and Large-Scale Air Cooling DOI Creative Commons
Yifan Li,

Congzhe Zhu,

Xiuming Li

и другие.

Energies, Год журнала: 2025, Номер 18(1), С. 149 - 149

Опубликована: Янв. 2, 2025

Nowadays, the number of transistors on electronic components is increasing exponentially leading to an ultra-high heat flux (106~107 W/m2). The non-uniform load distribution chip and local hot spots in thermal environment are key issues a data center (DC). Microchannel liquid cooling effective method inhibit accumulation chip. Optimizing air crucial approach realizing energy savings. This study summarizes latest research management by microchannel optimization DCs. existing concerning structure universality sink (MCHS), stability flow boiling new coolant, prediction spots, intelligent control system identified. Furthermore, novel strategy multi-scale synergy recommended, which expected suppress heighten temperature uniformity. review provides valuable insights into for It paves way applying innovative technologies artificial intelligence methods promote efficient operation low-carbon retrofit

Язык: Английский

Процитировано

4

Manipulating thin film boiling to achieve record-breaking high heat flux DOI
Yuxiang Zhang, Xuan Zhao, Jiahua Li

и другие.

International Journal of Heat and Mass Transfer, Год журнала: 2024, Номер 224, С. 125308 - 125308

Опубликована: Фев. 14, 2024

Язык: Английский

Процитировано

7

Experimental study of an integrated aluminum flat plate heat pipe for lightweight thermal management in electronic devices DOI
Jingjing Bai, Yiming Li,

Yincai Zhao

и другие.

Applied Thermal Engineering, Год журнала: 2024, Номер 257, С. 124332 - 124332

Опубликована: Сен. 6, 2024

Язык: Английский

Процитировано

7

Enhanced capillary-driven thin film boiling through superhydrophilic mesh wick structure DOI
Longsheng Lu, Bo Tao, Shu Yang

и другие.

International Journal of Thermal Sciences, Год журнала: 2025, Номер 212, С. 109782 - 109782

Опубликована: Фев. 10, 2025

Язык: Английский

Процитировано

1

Microfluidic controllable production and morphology-independent phase-change heat transfer of boehmite nanofluids DOI

Junsheng Hou,

Dongyu Li,

Xiong Zhao

и другие.

Chemical Engineering Journal, Год журнала: 2024, Номер 488, С. 150605 - 150605

Опубликована: Март 29, 2024

Язык: Английский

Процитировано

6

Experimental investigation on the phase change liquid cooling characteristics in the offset grooved microchannel heat sink DOI
Yifan Li,

Congzhe Zhu,

Guodong Xia

и другие.

Applied Thermal Engineering, Год журнала: 2025, Номер unknown, С. 126032 - 126032

Опубликована: Фев. 1, 2025

Язык: Английский

Процитировано

0

Experimental study on nucleate boiling of liquid nitrogen spray cooling on superhydrophilic microstructured surface DOI
Yiming Fan, Fengmin Su, Liang‐Shih Fan

и другие.

International Journal of Thermal Sciences, Год журнала: 2025, Номер 213, С. 109800 - 109800

Опубликована: Фев. 26, 2025

Язык: Английский

Процитировано

0

Teardrop-like micro pin fin coated nanotube arrays chip for enhancement of flow boiling electronics cooling DOI
Hongqiang Chen, Quan Gao, Xiang Ma

и другие.

International Journal of Thermal Sciences, Год журнала: 2025, Номер 214, С. 109854 - 109854

Опубликована: Март 8, 2025

Язык: Английский

Процитировано

0

Novel ultrathin vapor chambers with anti-centrifugal wick structures for heat dissipation under high-g loads DOI
Changkun Shao,

Hongjian Leng,

Gong Chen

и другие.

Physics of Fluids, Год журнала: 2025, Номер 37(4)

Опубликована: Апрель 1, 2025

Ultrathin vapor chamber (UTVC) is considered an ideal solution to the heat dissipation problem of aircraft and spacecraft. However, cooling performance rapidly deteriorates due obstruction liquid return flow under acceleration overload, posing a serious threat safety More seriously, few theoretical models can reveal mechanism transfer centrifugal conditions, resulting in increase design cost difficulty anti-centrifugal ultrathin (ACUTVC). Herein, two novel ACUTVCs based on wicks were proposed, which extensively tested compared with UTVC traditional wick. Results show that effective thermal conductivities exceed 1500 W m−1 K−1 even extreme conditions 6 g acceleration, are about four times copper comparable commercial graphene films, demonstrating reliable management capability high-g conditions. The mechanisms different revealed by model proposed this work, maximum error 26.27% experimental results, showing good agreement. Model results highlight potential optimization approaches wick structures, may guide new directions for ACUTVC.

Язык: Английский

Процитировано

0