Thermal interface materials: From fundamental research to applications
SusMat,
Год журнала:
2024,
Номер
unknown
Опубликована: Сен. 23, 2024
Abstract
The
miniaturization,
integration,
and
high
data
throughput
of
electronic
chips
present
challenging
demands
on
thermal
management,
especially
concerning
heat
dissipation
at
interfaces,
which
is
a
fundamental
scientific
question
as
well
an
engineering
problem—a
death
problem
called
in
semiconductor
industry.
A
comprehensive
examination
interfacial
resistance
has
been
given
from
physics
perspective
2022
Review
Modern
Physics
.
Here,
we
provide
detailed
overview
materials
perspective,
focusing
the
optimization
structure
compositions
interface
(TIMs)
interact/contact
with
source
sink.
First,
discuss
impact
conductivity,
bond
line
thickness,
contact
TIMs.
Second,
it
pointed
out
that
there
are
two
major
routes
to
improve
transfer
through
interface.
One
reduce
TIM's
(
R
TIM
)
TIMs
strategies
like
incorporating
conductive
fillers,
enhancing
treatment
techniques.
other
c
by
improving
effective
contact,
strengthening
bonding,
utilizing
mass
gradient
alleviate
vibrational
mismatch
between
source/sink.
Finally,
such
challenges
theories,
potential
developments
sustainable
TIMs,
application
AI
design
also
explored.
Язык: Английский
Independent Control of Electrical and Thermal Properties of Polymer Composites for Low Thermal Resistance Interface Materials
Shabas Ahammed Abdul Jaleel,
Mohamad Alayli,
Seongsu Cheon
и другие.
Advanced Engineering Materials,
Год журнала:
2025,
Номер
unknown
Опубликована: Янв. 29, 2025
Electrically
insulating
thermal
interface
materials
(TIMs)
are
desired
for
certain
applications
to
avoid
electrical
current
leakage.
However,
it
is
more
challenging
achieve
high
conductivity
(
κ
)
due
the
noncoalescing
nature
of
ceramic
particles.
Herein,
independent
control
and
TIMs
reported,
with
aid
low‐temperature
coalescing
silver
nanoparticles
(AgNPs),
enhancing
,
decreasing
total
resistance
R
t
while
retaining
insulation.
The
leakage‐free
functionalized
phase‐change
material
(OP)
employed
as
a
matrix.
interaction
between
aluminum
nitride
(AlN)
particles
OP
induces
highest
surface
energy
intrinsic
adhesion
energy,
compared
other
particles,
resulting
in
lowest
elastic
modulus
.
(1.7
W
m
−1
K
(80.1
mm
2
OP‐AlN
further
improved
by
AgNP
decoration
(OP‐AlN/Ag).
AlN
coalesced
exquisitely
AgNPs
(3
vol%),
suppressing
(<10
−9
S
cm
).
increased
58%
(2.7
decreased
44%
(45.0
electrical/thermal
pathway
may
prove
useful
electrically
but
thermally
highly
conducting
TIMs.
Язык: Английский
Effect of Flexible Chains on Thermal Conductivity of Liquid Crystalline Epoxy Resins
ACS Applied Polymer Materials,
Год журнала:
2024,
Номер
6(21), С. 13449 - 13456
Опубликована: Окт. 18, 2024
Liquid
crystalline
epoxy
resins
(LCEs)
have
attracted
scientific
attention
due
to
their
excellent
physical
properties,
including
thermal
conductivity.
In
this
study,
we
report
biphenyl
(BPERn)─a
series
of
LCEs─and
intermolecular
interaction
depending
on
the
network
structure.
Biphenyl
derivatives
liquid
monomers
were
synthesized
by
introducing
various
lengths
alkyl
chains
and
functional
groups
at
both
ends
side
exhibited
a
mesomorphic
orientation
in
specific
temperature
range.
The
BPERn
prepared
hot
compression
molding,
employing
hexamethylene
diamine
as
curing
agent.
behavior
was
monitored
polarizing
optical
microscopy
differential
scanning
calorimetry.
formation
an
LC
observed
during
polymerization
process.
properties
optimized
using
thermogravimetric
analysis,
calorimetry,
dynamic
mechanical
conductivity
measurements.
microstructure
X-ray
scattering
analysis.
increased
with
flexible
chain
length,
BPER8
longest
reached
0.50
W/m·K.
bulk
specimens
faster
change
than
conventional
commercial
samples
when
infrared
imaging
camera.
These
results
suggest
improvement
LCE
suitable
for
application
electronic
materials.
Язык: Английский
Fluorinated boron nitride nanosheets for high thermal conductivity and low dielectric constant silicone rubber composites
Polymer Composites,
Год журнала:
2024,
Номер
unknown
Опубликована: Сен. 9, 2024
Abstract
Increasing
miniaturization
and
integration
of
microelectronic
devices
have
led
to
an
unprecedented
attention
on
heat
dissipation
signal
transmission
electronic
equipment.
However,
the
mostly
used
method
enhance
thermal
conductivity
polymers
by
adding
thermally
conductive
fillers
usually
results
in
increase
dielectric
constant
(D
k
).
It
was
still
challenging
synergistically
achieve
low
D
high
polymer‐matrix
composites.
Herein,
hydroxylated
boron
nitride
nanosheet
(BNNS‐OH)
with
a
yield
35.67%
prepared
liquid
ultrasonic
exfoliation
under
assistance
sodium
cholate
(SC),
grafted
(1H,1H,2H,2H‐perfluorodecyl)
trimethoxy
silane
prepare
fluorinated
nanosheets
(F‐BNNS),
which
can
uniformly
disperse
silicone
rubber
(LSR)
reduce
LSR
The
composites
20
wt%
F‐BNNS
reached
0.489
W·m
−1
·K
,
showing
307.35%
comparison
pure
(0.12
Meantime,
as‐obtained
LSR/F‐BNNS
(20
wt%)
is
reduced
from
3.4
2.6,
loss
f
)
less
than
0.012.
facile
rational
design
BNNS
offers
new
insight
for
high‐end
packaging
materials.
Highlights
A
treatment
h‐BN
proposed.
achieved
ultralow
2.63
via
BNNS.
Thermal
increased
LSR.
Язык: Английский