Effect of Morphology and Structure of Polyethylene Fibers on Thermal Conductivity of PDMS Composites
Hongli Cheng,
Liangchun Zhou,
Gaojie Han
и другие.
Polymer,
Год журнала:
2025,
Номер
unknown, С. 128194 - 128194
Опубликована: Фев. 1, 2025
Язык: Английский
Independent Control of Electrical and Thermal Properties of Polymer Composites for Low Thermal Resistance Interface Materials
Shabas Ahammed Abdul Jaleel,
Mohamad Alayli,
Seongsu Cheon
и другие.
Advanced Engineering Materials,
Год журнала:
2025,
Номер
unknown
Опубликована: Янв. 29, 2025
Electrically
insulating
thermal
interface
materials
(TIMs)
are
desired
for
certain
applications
to
avoid
electrical
current
leakage.
However,
it
is
more
challenging
achieve
high
conductivity
(
κ
)
due
the
noncoalescing
nature
of
ceramic
particles.
Herein,
independent
control
and
TIMs
reported,
with
aid
low‐temperature
coalescing
silver
nanoparticles
(AgNPs),
enhancing
,
decreasing
total
resistance
R
t
while
retaining
insulation.
The
leakage‐free
functionalized
phase‐change
material
(OP)
employed
as
a
matrix.
interaction
between
aluminum
nitride
(AlN)
particles
OP
induces
highest
surface
energy
intrinsic
adhesion
energy,
compared
other
particles,
resulting
in
lowest
elastic
modulus
.
(1.7
W
m
−1
K
(80.1
mm
2
OP‐AlN
further
improved
by
AgNP
decoration
(OP‐AlN/Ag).
AlN
coalesced
exquisitely
AgNPs
(3
vol%),
suppressing
(<10
−9
S
cm
).
increased
58%
(2.7
decreased
44%
(45.0
electrical/thermal
pathway
may
prove
useful
electrically
but
thermally
highly
conducting
TIMs.
Язык: Английский
Overcoming the Uniform Heat Transfer Network Construction Trade-off in Anchored Structure Composites with Electromagnetic Shielding
Composites Part B Engineering,
Год журнала:
2025,
Номер
unknown, С. 112359 - 112359
Опубликована: Март 1, 2025
Язык: Английский
Vertically Oriented Carbon Nanotube-Based Composites for Thermal Management
ACS Applied Nano Materials,
Год журнала:
2024,
Номер
7(21), С. 24978 - 24985
Опубликована: Окт. 30, 2024
Polymer
thermally
conductive
composites
have
emerged
as
ideal
materials
to
address
the
issue
of
heat
accumulation
in
various
electrical
devices.
However,
practical
application
often
requires
low
filler
content
with
multifunctional
properties
meet
rapid
development
electronic
technology.
Herein,
highly
oriented
carbon
nanotubes
(O-CNTs)
were
grown
situ
on
vertically
aligned
melem
skeletons
by
ice
templating
and
high-temperature
catalytic
methods.
The
ordered
CNTs
constructed
a
cross-linking
network
matrix
epoxy
(EP)
for
efficient
transport
pathways.
O-CNTs/EP
composite
exhibits
outstanding
out-of-plane
in-plane
thermal
conductivities
2.36
1.20
W/(m·K)
CNT
4
wt
%,
respectively.
also
shows
an
excellent
electromagnetic
shielding
effect
over
30
dB
range
8–40
GHz.
This
work
provides
promising
strategy
construction
high-performance
advanced
dissipation
management
materials.
Язык: Английский
Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid
International Journal of Molecular Sciences,
Год журнала:
2024,
Номер
25(20), С. 11156 - 11156
Опубликована: Окт. 17, 2024
With
the
innovation
of
modern
electronics,
heat
dissipation
in
devices
faces
several
problems.
In
our
work,
boron
nitride
(BN)
with
good
thermal
conductivity
(TC)
was
successfully
fabricated
by
constructing
BN
along
axial
direction
and
surface-grafted
hybrid
composite
fibers
via
wet-spinning
hot-pressing
method.
The
unique
inter-outer
inter-interconnected
structure
exhibited
176.47%
enhancement
(TCE),
which
exhibits
TC,
mechanical
resistance,
chemical
resistance.
addition,
depending
on
special
fibers,
it
provides
a
new
strategy
for
fabricating
interface
materials
electronic
device.
Язык: Английский
Epoxy composites produced via sodium alginate‐mediated Ca crosslinking of MXene and boron nitride fillers with excellent thermal conductivity and electromagnetic interference shielding effectiveness
Polymer Composites,
Год журнала:
2024,
Номер
unknown
Опубликована: Ноя. 7, 2024
Abstract
This
study
investigates
novel
polymer
composites
for
enhanced
thermal
conductivity
and
electromagnetic
interference
(EMI)
shielding.
By
incorporating
sodium
alginate‐mediated
Ca
crosslinked
MXene
boron
nitride
fillers
into
an
epoxy
matrix,
the
exhibit
significantly
improved
thermal,
electrical,
mechanical
properties.
Surface
treatment
filler
dispersion
interfacial
bonding
by
introducing
hydroxyl
groups,
which
improve
compatibility
between
thereby
reducing
agglomeration
creating
robust
electrical
conduction
networks.
Hot‐pressing
method
further
increases
composite
density
eliminating
internal
voids
aligning
more
effectively,
resulting
in
superior
characteristics.
The
best
performing
hot‐pressed
achieved
a
through‐plane
of
7.45
W/m
K,
excellent
EMI
shielding
effectiveness
58.3
dB,
along
with
tensile
strength
37.2
MPa
elongation
as
high
3.8%.
These
enhancements
make
highly
suitable
advanced
electronic
devices
where
efficient
heat
dissipation
are
critical.
Highlights
improves
compatibility.
High‐filler
fabricated
hot‐pressing
method.
MX‐CA‐BN/EPH
achieve
K
conductivity.
Enhanced
dB.
Язык: Английский