Epoxy composites produced via sodium alginate‐mediated Ca crosslinking of MXene and boron nitride fillers with excellent thermal conductivity and electromagnetic interference shielding effectiveness DOI

Jae-Kyung Lee,

Wondu Lee,

Jihoon Kim

et al.

Polymer Composites, Journal Year: 2024, Volume and Issue: unknown

Published: Nov. 7, 2024

Abstract This study investigates novel polymer composites for enhanced thermal conductivity and electromagnetic interference (EMI) shielding. By incorporating sodium alginate‐mediated Ca crosslinked MXene boron nitride fillers into an epoxy matrix, the exhibit significantly improved thermal, electrical, mechanical properties. Surface treatment filler dispersion interfacial bonding by introducing hydroxyl groups, which improve compatibility between thereby reducing agglomeration creating robust electrical conduction networks. Hot‐pressing method further increases composite density eliminating internal voids aligning more effectively, resulting in superior characteristics. The best performing hot‐pressed achieved a through‐plane of 7.45 W/m K, excellent EMI shielding effectiveness 58.3 dB, along with tensile strength 37.2 MPa elongation as high 3.8%. These enhancements make highly suitable advanced electronic devices where efficient heat dissipation are critical. Highlights improves compatibility. High‐filler fabricated hot‐pressing method. MX‐CA‐BN/EPH achieve K conductivity. Enhanced dB.

Language: Английский

Effect of Morphology and Structure of Polyethylene Fibers on Thermal Conductivity of PDMS Composites DOI

Hongli Cheng,

Liangchun Zhou,

Gaojie Han

et al.

Polymer, Journal Year: 2025, Volume and Issue: unknown, P. 128194 - 128194

Published: Feb. 1, 2025

Language: Английский

Citations

1
Independent Control of Electrical and Thermal Properties of Polymer Composites for Low Thermal Resistance Interface Materials DOI Open Access

Shabas Ahammed Abdul Jaleel,

Mohamad Alayli,

Seongsu Cheon

et al.

Advanced Engineering Materials, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 29, 2025

Electrically insulating thermal interface materials (TIMs) are desired for certain applications to avoid electrical current leakage. However, it is more challenging achieve high conductivity ( κ ) due the noncoalescing nature of ceramic particles. Herein, independent control and TIMs reported, with aid low‐temperature coalescing silver nanoparticles (AgNPs), enhancing , decreasing total resistance R t while retaining insulation. The leakage‐free functionalized phase‐change material (OP) employed as a matrix. interaction between aluminum nitride (AlN) particles OP induces highest surface energy intrinsic adhesion energy, compared other particles, resulting in lowest elastic modulus . (1.7 W m −1 K (80.1 mm 2 OP‐AlN further improved by AgNP decoration (OP‐AlN/Ag). AlN coalesced exquisitely AgNPs (3 vol%), suppressing (<10 −9 S cm ). increased 58% (2.7 decreased 44% (45.0 electrical/thermal pathway may prove useful electrically but thermally highly conducting TIMs.

Language: Английский

Citations

0
Overcoming the Uniform Heat Transfer Network Construction Trade-off in Anchored Structure Composites with Electromagnetic Shielding DOI
Rui Chen,

Yageng Bai,

Yuxuan Gu

et al.

Composites Part B Engineering, Journal Year: 2025, Volume and Issue: unknown, P. 112359 - 112359

Published: March 1, 2025

Language: Английский

Citations

0
Vertically Oriented Carbon Nanotube-Based Composites for Thermal Management DOI

Jing Peng,

W. -X. Xia, Lifen Su

et al.

ACS Applied Nano Materials, Journal Year: 2024, Volume and Issue: 7(21), P. 24978 - 24985

Published: Oct. 30, 2024

Polymer thermally conductive composites have emerged as ideal materials to address the issue of heat accumulation in various electrical devices. However, practical application often requires low filler content with multifunctional properties meet rapid development electronic technology. Herein, highly oriented carbon nanotubes (O-CNTs) were grown situ on vertically aligned melem skeletons by ice templating and high-temperature catalytic methods. The ordered CNTs constructed a cross-linking network matrix epoxy (EP) for efficient transport pathways. O-CNTs/EP composite exhibits outstanding out-of-plane in-plane thermal conductivities 2.36 1.20 W/(m·K) CNT 4 wt %, respectively. also shows an excellent electromagnetic shielding effect over 30 dB range 8–40 GHz. This work provides promising strategy construction high-performance advanced dissipation management materials.

Language: Английский

Citations

2
Bio-Inspired Thermal Conductive Fibers by Boron Nitride Nanosheet/Boron Nitride Hybrid DOI Open Access
Jiajing Zhang,

P Zhang,

Chunhua Zhang

et al.

International Journal of Molecular Sciences, Journal Year: 2024, Volume and Issue: 25(20), P. 11156 - 11156

Published: Oct. 17, 2024

With the innovation of modern electronics, heat dissipation in devices faces several problems. In our work, boron nitride (BN) with good thermal conductivity (TC) was successfully fabricated by constructing BN along axial direction and surface-grafted hybrid composite fibers via wet-spinning hot-pressing method. The unique inter-outer inter-interconnected structure exhibited 176.47% enhancement (TCE), which exhibits TC, mechanical resistance, chemical resistance. addition, depending on special fibers, it provides a new strategy for fabricating interface materials electronic device.

Language: Английский

Citations

1
Epoxy composites produced via sodium alginate‐mediated Ca crosslinking of MXene and boron nitride fillers with excellent thermal conductivity and electromagnetic interference shielding effectiveness DOI

Jae-Kyung Lee,

Wondu Lee,

Jihoon Kim

et al.

Polymer Composites, Journal Year: 2024, Volume and Issue: unknown

Published: Nov. 7, 2024

Abstract This study investigates novel polymer composites for enhanced thermal conductivity and electromagnetic interference (EMI) shielding. By incorporating sodium alginate‐mediated Ca crosslinked MXene boron nitride fillers into an epoxy matrix, the exhibit significantly improved thermal, electrical, mechanical properties. Surface treatment filler dispersion interfacial bonding by introducing hydroxyl groups, which improve compatibility between thereby reducing agglomeration creating robust electrical conduction networks. Hot‐pressing method further increases composite density eliminating internal voids aligning more effectively, resulting in superior characteristics. The best performing hot‐pressed achieved a through‐plane of 7.45 W/m K, excellent EMI shielding effectiveness 58.3 dB, along with tensile strength 37.2 MPa elongation as high 3.8%. These enhancements make highly suitable advanced electronic devices where efficient heat dissipation are critical. Highlights improves compatibility. High‐filler fabricated hot‐pressing method. MX‐CA‐BN/EPH achieve K conductivity. Enhanced dB.

Language: Английский

Citations

0