Molecular dynamics simulation of the thermal conductivity and dielectric properties of PI/FG composites DOI
Song Bi, Tong Zhao, Jiying Tuo

и другие.

Surfaces and Interfaces, Год журнала: 2024, Номер unknown, С. 105569 - 105569

Опубликована: Дек. 1, 2024

Язык: Английский

An Engineered Heterostructured Trinity Enables Fire-Safe, Thermally Conductive Polymer Nanocomposite Films with Low Dielectric Loss DOI Creative Commons
Qiang Chen,

Jiabing Feng,

Yijiao Xue

и другие.

Nano-Micro Letters, Год журнала: 2025, Номер 17(1)

Опубликована: Фев. 26, 2025

Abstract To adapt to the trend of increasing miniaturization and high integration microelectronic equipments, there is a demand for multifunctional thermally conductive (TC) polymeric films combining excellent flame retardancy low dielectric constant ( ε ). date, have been few successes that achieve such performance portfolio in polymer due their different even mutually exclusive governing mechanisms. Herein, we propose trinity strategy creating rationally engineered heterostructure nanoadditive (FG@CuP@ZTC) by situ self-assembly immobilization copper-phenyl phosphonate (CuP) zinc-3, 5-diamino-1,2,4-triazole complex (ZTC) onto fluorinated graphene (FG) surface. Benefiting from synergistic effects FG, CuP, ZTC bionic lay-by-lay (LBL) strategy, as-fabricated waterborne polyurethane (WPU) nanocomposite film with 30 wt% FG@CuP@ZTC exhibits 55.6% improvement limiting oxygen index (LOI), 66.0% 40.5% reductions peak heat release rate total release, respectively, 93.3% increase tensile strength relative pure WPU between ZTC. Moreover, presents thermal conductivity λ ) 12.7 W m −1 K 2.92 at 10 6 Hz. This work provides commercially viable rational design develop high-performance films, which hold great potential as advanced dissipators high-power-density microelectronics.

Язык: Английский

Процитировано

2

Advancing anti-corrosion performance of composite coating: Self-aligned fluorinated graphene for multifunctional electronic packaging DOI

Yu Yu Sin,

Shen Wu Hsiao,

John Peter Isaqu

и другие.

Carbon, Год журнала: 2024, Номер 228, С. 119368 - 119368

Опубликована: Июнь 22, 2024

Язык: Английский

Процитировано

10

Physical evolution mechanism of polyimide/fluorinated graphene composite insulating materials under extreme conditions DOI
Song Bi, Tong Zhao, Jiying Tuo

и другие.

Progress in Organic Coatings, Год журнала: 2025, Номер 200, С. 109065 - 109065

Опубликована: Янв. 13, 2025

Язык: Английский

Процитировано

1

A review on boron nitride reinforced polyimide-based nanocomposites for high-temperature capacitive energy storage: Challenges and recommendations DOI Creative Commons
V. E. Ogbonna, Olawale Popoola,

Patricia I. Popoola

и другие.

Journal of Thermoplastic Composite Materials, Год журнала: 2025, Номер unknown

Опубликована: Март 11, 2025

The adoption of polyimide-based materials for high temperature related applications is receiving increased attention from the research community, particularly high-temperature capacitive energy storage. Polyimide matrix material has illustrated its effectiveness in design and manufacturing polymer-based dielectric capacitors, owing to intrinsic characteristics. However, modifying structure characteristics widespread using inorganic filler. present study reviewed recent advances on enhancement nanocomposite properties boron nitride fillers From literature, it worth noting that remain promising improving dielectric, breakdown strength, thermal conductivity, stability response polyimide nanocomposites favourable capacitors application. Additionally, storage density charge-discharge efficiency nitride-reinforced relation strength conductivity were thoroughly discussed. In conclusion, current challenges, which are associated with fabrication characterization presented, as well recommendation future directions this developing field.

Язык: Английский

Процитировано

0

Polyimide Dielectrics with Low Dielectric Permittivity DOI

Xiaodi Dong,

Jun‐Wei Zha

Опубликована: Март 21, 2025

Язык: Английский

Процитировано

0

Study on the dielectric properties of fluorinated graphene DOI
Zixuan Gou, Weibin Xi, Wei Jiang

и другие.

FlatChem, Год журнала: 2025, Номер unknown, С. 100862 - 100862

Опубликована: Март 1, 2025

Язык: Английский

Процитировано

0

Molecular dynamics simulation of the thermal conductivity and dielectric properties of PI/FG composites DOI
Song Bi, Tong Zhao, Jiying Tuo

и другие.

Surfaces and Interfaces, Год журнала: 2024, Номер unknown, С. 105569 - 105569

Опубликована: Дек. 1, 2024

Язык: Английский

Процитировано

1