An Engineered Heterostructured Trinity Enables Fire-Safe, Thermally Conductive Polymer Nanocomposite Films with Low Dielectric Loss

Nano-Micro Letters, Journal Year: 2025, Volume and Issue: 17(1)

Published: Feb. 26, 2025

Abstract To adapt to the trend of increasing miniaturization and high integration microelectronic equipments, there is a demand for multifunctional thermally conductive (TC) polymeric films combining excellent flame retardancy low dielectric constant ( ε ). date, have been few successes that achieve such performance portfolio in polymer due their different even mutually exclusive governing mechanisms. Herein, we propose trinity strategy creating rationally engineered heterostructure nanoadditive (FG@CuP@ZTC) by situ self-assembly immobilization copper-phenyl phosphonate (CuP) zinc-3, 5-diamino-1,2,4-triazole complex (ZTC) onto fluorinated graphene (FG) surface. Benefiting from synergistic effects FG, CuP, ZTC bionic lay-by-lay (LBL) strategy, as-fabricated waterborne polyurethane (WPU) nanocomposite film with 30 wt% FG@CuP@ZTC exhibits 55.6% improvement limiting oxygen index (LOI), 66.0% 40.5% reductions peak heat release rate total release, respectively, 93.3% increase tensile strength relative pure WPU between ZTC. Moreover, presents thermal conductivity λ ) 12.7 W m −1 K 2.92 at 10 6 Hz. This work provides commercially viable rational design develop high-performance films, which hold great potential as advanced dissipators high-power-density microelectronics.

Language: Английский

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Advancing anti-corrosion performance of composite coating: Self-aligned fluorinated graphene for multifunctional electronic packaging

Carbon, Journal Year: 2024, Volume and Issue: 228, P. 119368 - 119368

Published: June 22, 2024

Language: Английский

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Physical evolution mechanism of polyimide/fluorinated graphene composite insulating materials under extreme conditions

Progress in Organic Coatings, Journal Year: 2025, Volume and Issue: 200, P. 109065 - 109065

Published: Jan. 13, 2025

Language: Английский

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A review on boron nitride reinforced polyimide-based nanocomposites for high-temperature capacitive energy storage: Challenges and recommendations

Journal of Thermoplastic Composite Materials, Journal Year: 2025, Volume and Issue: unknown

Published: March 11, 2025

The adoption of polyimide-based materials for high temperature related applications is receiving increased attention from the research community, particularly high-temperature capacitive energy storage. Polyimide matrix material has illustrated its effectiveness in design and manufacturing polymer-based dielectric capacitors, owing to intrinsic characteristics. However, modifying structure characteristics widespread using inorganic filler. present study reviewed recent advances on enhancement nanocomposite properties boron nitride fillers From literature, it worth noting that remain promising improving dielectric, breakdown strength, thermal conductivity, stability response polyimide nanocomposites favourable capacitors application. Additionally, storage density charge-discharge efficiency nitride-reinforced relation strength conductivity were thoroughly discussed. In conclusion, current challenges, which are associated with fabrication characterization presented, as well recommendation future directions this developing field.

Language: Английский

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Polyimide Dielectrics with Low Dielectric Permittivity

Published: March 21, 2025

Language: Английский

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Study on the dielectric properties of fluorinated graphene

FlatChem, Journal Year: 2025, Volume and Issue: unknown, P. 100862 - 100862

Published: March 1, 2025

Language: Английский

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Molecular dynamics simulation of the thermal conductivity and dielectric properties of PI/FG composites

Surfaces and Interfaces, Journal Year: 2024, Volume and Issue: unknown, P. 105569 - 105569

Published: Dec. 1, 2024

Language: Английский

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